ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis PDF Download

Author: ASM International
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540

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Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

Author: Navid Asadizanjani
Publisher: Springer Nature
ISBN: 3030626091
Category : Technology & Engineering
Languages : en
Pages : 193

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Book Description
This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.

Author: Navid Asadizanjani
Publisher: Elsevier
ISBN: 0443185433
Category : Technology & Engineering
Languages : en
Pages : 224

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Book Description
Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities. - Discusses materials as enablers to provide electronics assurance, counterfeit detection/protection, and fingerprinting - Provides an overview of benefits and challenges of materials-based security solutions to inspire future materials research directions - Includes an introduction to material perspectives on hardware security to enable cross collaboration between materials, design, and testing

Author: ASM International
Publisher: ASM International
ISBN: 1627080996
Category : Technology & Engineering
Languages : en
Pages : 593

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Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.

Author: ASM International
Publisher: ASM International
ISBN: 1627081518
Category : Technology & Engineering
Languages : en
Pages : 666

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Book Description
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.

Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974

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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Author: A. S. M. International
Publisher: ASM International
ISBN: 1627080228
Category : Technology & Engineering
Languages : en
Pages : 634

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Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.

Author: A. S. M. International
Publisher: ASM International
ISBN: 1627080740
Category : Technology & Engineering
Languages : en
Pages : 561

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Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.

Author: Mark Tehranipoor
Publisher: Springer Nature
ISBN: 3030644480
Category : Technology & Engineering
Languages : en
Pages : 602

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Book Description
This book provides an overview of emerging topics in the field of hardware security, such as artificial intelligence and quantum computing, and highlights how these technologies can be leveraged to secure hardware and assure electronics supply chains. The authors are experts in emerging technologies, traditional hardware design, and hardware security and trust. Readers will gain a comprehensive understanding of hardware security problems and how to overcome them through an efficient combination of conventional approaches and emerging technologies, enabling them to design secure, reliable, and trustworthy hardware.

Author: ASM International
Publisher:
ISBN: 9781615039791
Category : Electronic apparatus and appliances
Languages : en
Pages : 620

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Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.