Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs PDF Download

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Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 420

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Author: Vikram Kumar
Publisher: SPIE-International Society for Optical Engineering
ISBN: 9780819436016
Category : Science
Languages : en
Pages : 802

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Author: Konstantinos Zekentes
Publisher: Materials Research Forum LLC
ISBN: 1644900661
Category : Technology & Engineering
Languages : en
Pages : 293

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The book presents an in-depth review and analysis of Silicon Carbide device processing. The main topics are: (1) Silicon Carbide Discovery, Properties and Technology, (2) Processing and Application of Dielectrics in Silicon Carbide Devices, (3) Doping by Ion Implantation, (4) Plasma Etching and (5) Fabrication of Silicon Carbide Nanostructures and Related Devices. The book is also suited as supplementary textbook for graduate courses. Keywords: Silicon Carbide, SiC, Technology, Processing, Semiconductor Devices, Material Properties, Polytypism, Thermal Oxidation, Post Oxidation Annealing, Surface Passivation, Dielectric Deposition, Field Effect Mobility, Ion Implantation, Post Implantation Annealing, Channeling, Surface Roughness, Dry Etching, Plasma Etching, Ion Etching, Sputtering, Chemical Etching, Plasma Chemistry, Micromasking, Microtrenching, Nanocrystal, Nanowire, Nanotube, Nanopillar, Nanoelectromechanical Systems (NEMS).

Author: Tobias Funk
Publisher: Springer Nature
ISBN: 303053250X
Category : Technology & Engineering
Languages : en
Pages : 144

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This book provides readers with a single-source reference to current sensing integrated circuit design. It is written in handbook style, including systematic guidelines and implementation examples. The authors focus on the implementation of wide-bandwidth current sensing on a single microchip, toward usage in applications such as sensing, control and optimization of the energy flow in growth areas like industrial electronics, renewable energies, smart grids, electromobility and the Internet of Things. Provides readers with a comprehensive, all-in-one source for current sensing integrated circuit design, including implementation examples; Discusses modeling and optimization of on-chip Rogowski coil and Hall sensor in both lateral and vertical orientation; Includes noise reduction techniques, such as auto-zeroing and chopping; Covers open-loop and closed-loop sensor front-end design; Presents the first on-chip current sensor with a planar coil placed besides a power line to measure internal signal currents and the first off-chip current sensor with a helix-shaped coil for external signal currents in the multi-MHz region.

Author: Robert Perret
Publisher: John Wiley & Sons
ISBN: 1118623207
Category : Technology & Engineering
Languages : en
Pages : 381

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This book relates the recent developments in several key electrical engineering R&D labs, concentrating on power electronics switches and their use. The first sections deal with key power electronics technologies, MOSFETs and IGBTs, including series and parallel associations. The next section examines silicon carbide and its potentiality for power electronics applications and its present limitations. Then, a dedicated section presents the capacitors, key passive components in power electronics, followed by a modeling method allowing the stray inductances computation, necessary for the precise simulation of switching waveforms. Thermal behavior associated with power switches follows, and the last part proposes some interesting prospectives associated to Power Electronics integration.

Author: J.-P. Colinge
Publisher: Springer Science & Business Media
ISBN: 1441991069
Category : Technology & Engineering
Languages : en
Pages : 375

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Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a milestone for the semiconductor industry, as high-quality SOI wafers suddenly became available in large quantities. From then on, it took only a few years to witness the use of SOI technology in a wealth of applications ranging from audio amplifiers and wristwatches to 64-bit microprocessors. This book presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI CMOS processing, and the physics of the SOI MOSFET receive an in-depth analysis.

Author: Fred Roozeboom
Publisher: The Electrochemical Society
ISBN: 9781566772747
Category : Technology & Engineering
Languages : en
Pages : 482

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The proceedings from this May 2000 symposium illustrate the range of applications in Rapid Thermal Processing (RTP). The refereed papers cover a variety of issues, such as ultra-shallow junctions; contacts for nanoscale CMOS; gate stacks; new applications of RTP, such as for the enhanced crystalization of amorphous silicon thin films; and advances on RTP systems and process monitoring, including optimizing and controlling gas flows in an RTCVD reactor. Most presentations are supported by charts and other graphical data. c. Book News Inc.

Author: Marin Alexe
Publisher: Springer Science & Business Media
ISBN: 3662108275
Category : Science
Languages : en
Pages : 510

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Book Description
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Author: Francesca Iacopi
Publisher: Springer Nature
ISBN: 3031216105
Category : Technology & Engineering
Languages : en
Pages : 271

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This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

Author: Josef Lutz
Publisher: Springer
ISBN: 3319709178
Category : Technology & Engineering
Languages : en
Pages : 723

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Book Description
Halbleiter-Leistungsbauelemente sind das Kernstück der Leistungselektronik. Sie bestimmen die Leistungsfähigkeit und machen neuartige und verlustarme Schaltungen erst möglich. In dem Band wird neben den Halbleiter-Leistungsbauelementen selbst auch die Aufbau- und Verbindungstechnik behandelt: von den physikalischen Grundlagen und der Herstellungstechnologie über einzelne Bauelemente bis zu thermomechanischen Problemen, Zerstörungsmechanismen und Störungseffekten. Die 2., überarbeitete Auflage berücksichtigt technische Neuerungen und Entwicklungen.