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Author: ASM International Publisher: ASM International ISBN: 1627082735 Category : Technology & Engineering Languages : en Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: ASM International Publisher: ASM International ISBN: 1627082735 Category : Technology & Engineering Languages : en Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: ASM International Publisher: ASM International ISBN: 1627081518 Category : Technology & Engineering Languages : en Pages : 666
Book Description
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Author: A. S. M. International Publisher: ASM International ISBN: 1627080740 Category : Technology & Engineering Languages : en Pages : 561
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Author: ASM International Publisher: ASM International ISBN: 1627080996 Category : Technology & Engineering Languages : en Pages : 593
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Author: A. S. M. International Publisher: ASM International ISBN: 1627080228 Category : Technology & Engineering Languages : en Pages : 634
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
Author: Lawrence C. Wagner Publisher: Springer Science & Business Media ISBN: 1461549191 Category : Technology & Engineering Languages : en Pages : 256
Book Description
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Author: ASM International
Author: ASM International
Author: ASM International
Author: 
Author: 
Author: A. S. M. International
Author: ASM International
Author: ASM International
Author: A. S. M. International
Author: ASM International
Author: Lawrence C. Wagner