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Author: Earl E. Swartzlander Jr. Publisher: Springer Science & Business Media ISBN: 1461316219 Category : Technology & Engineering Languages : en Pages : 515
Book Description
Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
Author: Earl E. Swartzlander Jr. Publisher: Springer Science & Business Media ISBN: 1461316219 Category : Technology & Engineering Languages : en Pages : 515
Book Description
Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
Author: Publisher: ASM International ISBN: 9780871702852 Category : Technology & Engineering Languages : en Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Earl E Swartzlander Publisher: World Scientific ISBN: 9814641480 Category : Mathematics Languages : en Pages : 486
Book Description
This is the new edition of the classic book Computer Arithmetic in three volumes published originally in 1990 by IEEE Computer Society Press. As in the original, the book contains many classic papers treating advanced concepts in computer arithmetic, which is very suitable as stand-alone textbooks or complementary materials to textbooks on computer arithmetic for graduate students and research professionals interested in the field. Told in the words of the initial developers, this book conveys the excitement of the creators, and the implementations provide insight into the details necessary to realize real chips. This second volume presents topics on error tolerant arithmetic, digit on-line arithmetic, number systems, and now in this new edition, a topic on implementations of arithmetic operations, all wrapped with an updated overview and a new introduction for each chapter. This volume is part of a 3 volume set: Computer Arithmetic Volume I Computer Arithmetic Volume II Computer Arithmetic Volume III The full set is available for sale in a print-only version. Contents:Error Tolerant ArithmeticOn-Line ArithmeticVLSI Adder ImplementationsVLSI Multiplier ImplementationsFloating-Point VLSI ChipsNumber RepresentationImplementations Readership: Graduate students and research professionals interested in computer arithmetic. Key Features:It reprints the classic papersIt covers advanced arithmetic operationsIt does this in the words of the original creatorsKeywords:Computer Arithmetic;Fault Tolerant;Arithmetic;On-Line Arithmetic;Adder Implementations;Multiplier Implementations;Floating Point Chips;Number Representation;Implementations
Author: IEEE Computer Society Publisher: ISBN: 9780818671074 Category : Computers Languages : en Pages : 326
Book Description
An invited talk recounts Intel's experience with increasing die yield through CAD algorithms, and a panel discussion examines tools for the extracting of critical areas for a yield analysis of VLSI design. Others of the 34 papers cover critical area analysis, defect sensitivity and reliability, fault tolerant architectures and arrays, yield projection and enhancement, fault tolerant and testing techniques, and self-checking and coding techniques. No subject index. Annotation copyright by Book News, Inc., Portland, OR.
Author: Run-Wei Li Publisher: CRC Press ISBN: 0429608209 Category : Science Languages : en Pages : 409
Book Description
With the recently well developed areas of Internet of Thing, consumer wearable gadgets and artificial intelligence, flexible and stretchable electronic devices have spurred great amount of interest from both the global scientific and industrial communities. As an emerging technology, flexible and stretchable electronics requires the scale-span fabrication of devices involving nano-features, microstructures and macroscopic large area manufacturing. The key factor behind covers the organic, inorganic and nano materials that exhibit completely different mechanical and electrical properties, as well as the accurate interfacial control between these components. Based on the fusion of chemistry, physics, biology, materials science and information technology, this review volume will try to offer a timely and comprehensive overview on the flexible and stretchable electronic materials and devices. The book will cover the working principle, materials selection, device fabrication and applications of electronic components of transistors, solar cells, memories, sensors, supercapacitors, circuits and etc.
Author: Manjul Bhushan Publisher: Springer Science & Business Media ISBN: 1441993770 Category : Technology & Engineering Languages : en Pages : 401
Book Description
Microelectronic Test Structures for CMOS Technology and Products addresses the basic concepts of the design of test structures for incorporation within test-vehicles, scribe-lines, and CMOS products. The role of test structures in the development and monitoring of CMOS technologies and products has become ever more important with the increased cost and complexity of development and manufacturing. In this timely volume, IBM scientists Manjul Bhushan and Mark Ketchen emphasize high speed characterization techniques for digital CMOS circuit applications and bridging between circuit performance and characteristics of MOSFETs and other circuit elements. Detailed examples are presented throughout, many of which are equally applicable to other microelectronic technologies as well. The authors’ overarching goal is to provide students and technology practitioners alike a practical guide to the disciplined design and use of test structures that give unambiguous information on the parametrics and performance of digital CMOS technology.
Author: Earl E. Swartzlander Jr.
Author: Earl E. Swartzlander Jr.
Author: R. M. Lea
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Author: Earl E Swartzlander
Author: IEEE Computer Society
Author: IEEE Computer Society
Author: Run-Wei Li
Author: Manjul Bhushan
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