Author: Earl E. Swartzlander Jr. Publisher: Springer Science & Business Media ISBN: 1461316219 Category : Technology & Engineering Languages : en Pages : 515
Book Description
Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
Author: Klaus Echtle Publisher: Springer Science & Business Media ISBN: 9783540584261 Category : Computers Languages : en Pages : 642
Book Description
This book presents the proceedings of the First European Dependable Computing Conference (EDCC-1), held in Berlin, Germany, in October 1994. EDCC is the merger of two former European events on dependable computing. The volume comprises 34 refereed full papers selected from 106 submissions. The contributions address all current aspects of dependable computing and reflect the state of the art in dependable systems research and advanced applications; among the topics covered are hardware and software reliability, safety-critical and secure systems, fault-tolerance and detection, verification and validation, formal methods, hardware and software testing, and parallel and distributed systems.
Author: Publisher: ASM International ISBN: 9780871702852 Category : Technology & Engineering Languages : en Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Salim Hariri Publisher: CRC Press ISBN: 9780849389863 Category : Computers Languages : en Pages : 346
Book Description
This three-volume work presents a compendium of current and seminal papers on parallel/distributed processing offered at the 22nd International Conference on Parallel Processing, held August 16-20, 1993 in Chicago, Illinois. Topics include processor architectures; mapping algorithms to parallel systems, performance evaluations; fault diagnosis, recovery, and tolerance; cube networks; portable software; synchronization; compilers; hypercube computing; and image processing and graphics. Computer professionals in parallel processing, distributed systems, and software engineering will find this book essential to complete their computer reference library.
Author: Philip Garrou Publisher: John Wiley & Sons ISBN: 352762306X Category : Technology & Engineering Languages : en Pages : 798
Book Description
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Author: Manjul Bhushan Publisher: Springer Science & Business Media ISBN: 1441993770 Category : Technology & Engineering Languages : en Pages : 401
Book Description
Microelectronic Test Structures for CMOS Technology and Products addresses the basic concepts of the design of test structures for incorporation within test-vehicles, scribe-lines, and CMOS products. The role of test structures in the development and monitoring of CMOS technologies and products has become ever more important with the increased cost and complexity of development and manufacturing. In this timely volume, IBM scientists Manjul Bhushan and Mark Ketchen emphasize high speed characterization techniques for digital CMOS circuit applications and bridging between circuit performance and characteristics of MOSFETs and other circuit elements. Detailed examples are presented throughout, many of which are equally applicable to other microelectronic technologies as well. The authors’ overarching goal is to provide students and technology practitioners alike a practical guide to the disciplined design and use of test structures that give unambiguous information on the parametrics and performance of digital CMOS technology.
Author: Dilip Patel Publisher: Springer Science & Business Media ISBN: 1447130162 Category : Computers Languages : en Pages : 516
Book Description
This volume contains the papers presented at the Intemational Conference on Object Oriented Information Systems 00lS'94, held at South Bank University, London, December 19 - 21, 1994. In response to our call for papers, a total 85 papers from 24 different countries were submitted. Each paper was evaluated by at least two Program Committee members and an additional reviewer. Together, we selected 41 papers for presentation at the conference and inclusion in the Proceedings. Also included are the keynote addresses by Peter Gray and Michael Jackson. The other submissions were recommended for presentation in the poster sessions. Peter Gray, our invited speaker, evaluates the problems of object-oriented systems and data independence by looking at how object oriented database applications are failing to perceive its benefits, and instead rely too much on encapsulation. He suggests alternative kinds of object storage to preserve data independence. The second invited speaker, Michael Jackson describes a way of solving problems, by focusing directly on the problems themselves, their components and structures and on the relationships between the problem and the solution method. He discusses a particular view of the role of object-orientation in software development.
Author: Beth Keser Publisher: John Wiley & Sons ISBN: 1119314135 Category : Technology & Engineering Languages : en Pages : 576
Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author: Guo Qi Zhang Publisher: Springer Science & Business Media ISBN: 0387755934 Category : Technology & Engineering Languages : en Pages : 338
Book Description
In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.
Author: Earl E. Swartzlander Jr.
Author: Klaus Echtle
Author: 
Author: Salim Hariri
Author: Philip Garrou
Author: Manjul Bhushan
Author: 
Author: Dilip Patel
Author: Beth Keser
Author: Guo Qi Zhang