Author:
Publisher:
ISBN:
Category : United States
Languages : en
Pages : 782
Book Description
Index of Specifications and Standards
Department Of Defense Index of Specifications and Standards Federal Supply Class Listing (FSC) Part III July 2005
Author:
Publisher: DIANE Publishing
ISBN: 1428983422
Category :
Languages : en
Pages : 782
Book Description
Publisher: DIANE Publishing
ISBN: 1428983422
Category :
Languages : en
Pages : 782
Book Description
Electrical Product Compliance and Safety Engineering, Volume 2
Author: Steli Loznen
Publisher: Artech House
ISBN: 1630818399
Category : Technology & Engineering
Languages : en
Pages : 350
Book Description
Publisher: Artech House
ISBN: 1630818399
Category : Technology & Engineering
Languages : en
Pages : 350
Book Description
Department Of Defense Index of Specifications and Standards Alphabetical Listing Part I July 2005
Author:
Publisher: DIANE Publishing
ISBN: 1428983406
Category :
Languages : en
Pages : 779
Book Description
Publisher: DIANE Publishing
ISBN: 1428983406
Category :
Languages : en
Pages : 779
Book Description
Department Of Defense Index of Specifications and Standards Numerical Canceled Listing (APPENDIX) Part IV September 2005
Author:
Publisher: DIANE Publishing
ISBN: 1428983473
Category :
Languages : en
Pages : 1252
Book Description
Publisher: DIANE Publishing
ISBN: 1428983473
Category :
Languages : en
Pages : 1252
Book Description
Department Of Defense Index of Specifications and Standards Numerical Listing Part II July 2005
Author:
Publisher: DIANE Publishing
ISBN: 1428983414
Category :
Languages : en
Pages : 809
Book Description
Publisher: DIANE Publishing
ISBN: 1428983414
Category :
Languages : en
Pages : 809
Book Description
Principles of Reliable Soldering Techniques
Author: R. Sengupta
Publisher: New Age International
ISBN: 9788122411096
Category :
Languages : en
Pages : 122
Book Description
Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.
Publisher: New Age International
ISBN: 9788122411096
Category :
Languages : en
Pages : 122
Book Description
Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.
Manuals Combined: Nondestructive Testing (NDT) And Inspection (NDI)
Author:
Publisher: Jeffrey Frank Jones
ISBN:
Category :
Languages : en
Pages : 8380
Book Description
Over 8,300 pages .... Just a SAMPLE of the CONTENTS: NONDESTRUCTIVE INSPECTION METHODS. Published by the Departments of the Army, Navy and Air Force on 1 March 2000 - 771 pages and June 2005 - 762 pages; Metallic Materials and Elements for Aerospace Vehicle Structures 1,733 pages Designing and Developing Maintainable Products and Systems - Revision A 719 pages Sampling Procedures and Tables for Inspection by Attributes 75 pages Nondestructive Testing Acceptance Criteria 88 pages Environmental Stress Screening Process for Electronic Equipment 49 pages Handbook for Reliability Test Methods, Plans, and Environments for Engineering, Development, Qualification, and Production - Revision A 411 pages Human Engineering - Revision F 219 pages Sampling Procedures and Tables for Life and Reliability Testing (Based on Exponential Distribution) 77 pages Test Method Standard: Electronic and Electrical Component Parts 191 pages Reliability Testing for Engineering Development, Qualification and Production - Revision D 47 pages Electroexplosive Subsystem Safety Requirements and Test Methods for Space Systems (150 pages, 8.64 MB) Reliability Prediction of Electronic Equipment- Notice F 205 pages Reliability Program for Systems and Equipment Development and Production - Revision B 88 pages Electronic Discharge Control Handbook for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices) - Revision B 171 pages Electrical Grounding for Aircraft Safety 290 pages Fuze and Fuze Components, Environmental and Performance Tests for - Revision C 295 pages Requirements for the Control of Electromagnetic Interference Characteristics of Subsystems and Equipment - Revision E 253 pages Maintainability Verification/Demonstration/Evaluation - Revision A 64 pages Failure Rate Sampling Plans and Procedures - Revision C 41 pages Maintainability Prediction 176 pages Definition of Terms for Reliability and Maintainability - Revision C 18 pages Semiconductor Devices 730 pages Reliability Modeling and Prediction - Revision B 85 pages Established Reliability and High Reliability Qualified Products List (QPL) Systems For Electrical, Electronic, and Fiber Optic Parts Specifications - Revision F 17 pages Environmental Test Methods and Engineering Guidelines 416 pages) Test Methods for Electrical Connectors - Revision A 129 pages Environmental Engineering Considerations and Laboratory Tests - Revision F 539 pages System Safety Program Requirements 117 pages Test Method Standard Microcircuits - Revision E 705 pages Test Method Standard Microcircuits - Revision F 708 pages Procedures for Performing a Failure Mode Effects and Criticality Analysis - Revision A 54 pages
Publisher: Jeffrey Frank Jones
ISBN:
Category :
Languages : en
Pages : 8380
Book Description
Over 8,300 pages .... Just a SAMPLE of the CONTENTS: NONDESTRUCTIVE INSPECTION METHODS. Published by the Departments of the Army, Navy and Air Force on 1 March 2000 - 771 pages and June 2005 - 762 pages; Metallic Materials and Elements for Aerospace Vehicle Structures 1,733 pages Designing and Developing Maintainable Products and Systems - Revision A 719 pages Sampling Procedures and Tables for Inspection by Attributes 75 pages Nondestructive Testing Acceptance Criteria 88 pages Environmental Stress Screening Process for Electronic Equipment 49 pages Handbook for Reliability Test Methods, Plans, and Environments for Engineering, Development, Qualification, and Production - Revision A 411 pages Human Engineering - Revision F 219 pages Sampling Procedures and Tables for Life and Reliability Testing (Based on Exponential Distribution) 77 pages Test Method Standard: Electronic and Electrical Component Parts 191 pages Reliability Testing for Engineering Development, Qualification and Production - Revision D 47 pages Electroexplosive Subsystem Safety Requirements and Test Methods for Space Systems (150 pages, 8.64 MB) Reliability Prediction of Electronic Equipment- Notice F 205 pages Reliability Program for Systems and Equipment Development and Production - Revision B 88 pages Electronic Discharge Control Handbook for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices) - Revision B 171 pages Electrical Grounding for Aircraft Safety 290 pages Fuze and Fuze Components, Environmental and Performance Tests for - Revision C 295 pages Requirements for the Control of Electromagnetic Interference Characteristics of Subsystems and Equipment - Revision E 253 pages Maintainability Verification/Demonstration/Evaluation - Revision A 64 pages Failure Rate Sampling Plans and Procedures - Revision C 41 pages Maintainability Prediction 176 pages Definition of Terms for Reliability and Maintainability - Revision C 18 pages Semiconductor Devices 730 pages Reliability Modeling and Prediction - Revision B 85 pages Established Reliability and High Reliability Qualified Products List (QPL) Systems For Electrical, Electronic, and Fiber Optic Parts Specifications - Revision F 17 pages Environmental Test Methods and Engineering Guidelines 416 pages) Test Methods for Electrical Connectors - Revision A 129 pages Environmental Engineering Considerations and Laboratory Tests - Revision F 539 pages System Safety Program Requirements 117 pages Test Method Standard Microcircuits - Revision E 705 pages Test Method Standard Microcircuits - Revision F 708 pages Procedures for Performing a Failure Mode Effects and Criticality Analysis - Revision A 54 pages
Electronic Materials Handbook
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
SAE AMS Index
Author: Society of Automotive Engineers. Cooperative Engineering Program
Publisher:
ISBN:
Category : Airplanes
Languages : en
Pages : 268
Book Description
Publisher:
ISBN:
Category : Airplanes
Languages : en
Pages : 268
Book Description