IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop PDF Download

Author:
Publisher:
ISBN: 9780780301542
Category : Process control
Languages : en
Pages : 212

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Author: Chinmay K. Maiti
Publisher: CRC Press
ISBN: 1000638111
Category : Technology & Engineering
Languages : en
Pages : 314

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Book Description
This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.

Author:
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780307414
Category : Technology & Engineering
Languages : en
Pages : 0

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Author: Mary Kathryn Thompson
Publisher: ICAD 2013
ISBN: 0989465802
Category : Technology & Engineering
Languages : en
Pages : 231

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Author: John N. Helbert
Publisher: William Andrew
ISBN: 0815517807
Category : Technology & Engineering
Languages : en
Pages : 1025

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Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production.Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.

Author: Richard Boyle
Publisher: Springer
ISBN: 3540486275
Category : Computers
Languages : en
Pages : 936

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Book Description
The two volume set LNCS 4291 and LNCS 4292 constitutes the refereed proceedings of the Second International Symposium on Visual Computing, ISVC 2006, held in Lake Tahoe, NV, USA in November 2006. The 65 revised full papers and 56 poster papers presented together with 57 papers of ten special tracks were carefully reviewed and selected from more than 280 submissions. The papers cover the four main areas of visual computing.

Author: Rajiv Kohli
Publisher: William Andrew
ISBN: 1437778313
Category : Science
Languages : en
Pages : 311

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Book Description
Rajiv Kohli and Kash Mittal have brought together the work of experts from different industry sectors and backgrounds to provide a state-of-the-art survey and best practice guidance for scientists and engineers engaged in surface cleaning or handling the consequences of surface contamination. Topics covered include: - A systems analysis approach to contamination control - Physical factors that influence the behavior of particle deposition in enclosures - An overview of current yield models and description of advanced models - Types of strippable coatings, their properties and applications of these coatings for removal of surface contaminants - In-depth coverage of ultrasonic cleaning - Contamination and cleaning issues at the nanoscale - Experimental results illustrating the impact of model parameters on the removal of particle contamination The expert contributions in this book provide a valuable source of information on the current status and recent developments in surface contamination and cleaning. The book will be of value to industry, government and academic personnel involved in research and development, manufacturing, process and quality control, and procurement specifications across sectors including microelectronics, aerospace, optics, xerography and joining (adhesive bonding). ABOUT THE EDITORS Rajiv Kohli is a leading expert with The Aerospace Corporation in contaminant particle behavior, surface cleaning, and contamination control. At the NASA Johnson Space Center in Houston, Texas, he provides technical support for contamination control related to ground-based and manned spaceflight hardware for the Space Shuttle, the International Space Station, and the new Constellation Program that is designed to meet the United States Vision for Space Exploration. Kashmiri Lal "Kash" Mittal was associated with IBM from 1972 to 1994. Currently, he is teaching and consulting in the areas of surface contamination and cleaning, and in adhesion science and technology. He is the Editor-in-Chief of the Journal of Adhesion Science and Technology and is the editor of 98 published books, many of them dealing with surface contamination and cleaning. Also available Developments in Surface Contamination and Cleaning, Volume 1: Fundamentals and Applied Aspects (edited by Rajiv Kohli & K.L. Mittal). ISBN: 9780815515555. · Provides guidance on best-practice cleaning techniques and the avoidance of surface contamination · Covers contamination and cleaning issues at the nanoscale · Includes an in-depth look at ultrasonic cleaning

Author: Hubert Missbauer
Publisher: Springer Nature
ISBN: 107160354X
Category : Business & Economics
Languages : en
Pages : 289

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Book Description
This book presents a comprehensive overview of recent developments in production planning. The monograph begins with an introductory chapter reviewing the need for these production planning models, that operate by determining time-phased releases of work into the facility or supply chain, relating these to the Manufacturing Planning and Control (MPC) and Advanced Planning and Scheduling (APS) frameworks, that form the basis of most academic research and industrial practice. The extensive body of work on Workload Control is also placed in this context, and proves the need for improved models with a discussion of the difficulties, these approaches encounter. The next two chapters present a detailed review of the state of the art in optimization models based on exogenous planned lead times, and examines the cases where these can take both integer and fractional values. The difficulties arising in estimating planned lead times are consistent with factory behavior which are highlighted, noting that many of these lead to non-convex optimization models. Attempts to address these difficulties by iterative multimodel approaches, that combine simulation and mathematical programming, are also discussed in detail. The next three chapters of the volume address the set of techniques developed using clearing functions, which represent the expected output of a resource in a planning period, as a function of the expected workload of the resource, during that period. The chapters on this subject propose a basic optimization model for multiple products, discuss the difficulties of this model and some possible solutions. It also reviews prior work, and discuss a number of alternative formulations of the clearing function concept with their respective advantages and disadvantages. Applications to lot sizing decisions and a number of other specific problems are also described. This volume concludes with an assessment of the state of the art described in the volume, and several directions for future work.

Author: Wielfried Lerch
Publisher: Trans Tech Publications Ltd
ISBN: 3038131733
Category : Technology & Engineering
Languages : en
Pages : 427

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Book Description
Special topic volume with invited papers only

Author: Fabian Steinberg
Publisher: Springer Nature
ISBN: 3658450339
Category :
Languages : en
Pages : 174

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