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Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 504
Book Description
IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings].
![IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. PDF](https://books.google.com/books/content/images/frontcover/kAhWAAAAMAAJ?fife=w80-h100)
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 504
Book Description
IEEE/CPMT International Electronics Manufacturing Technology Symposium
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 370
Book Description
Modeling and Application of Flexible Electronics Packaging
Author: YongAn HuangPublisher: Springer
ISBN: 981133627X
Category : Technology & Engineering
Languages : en
Pages : 297
Book Description
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Copper Wire Bonding
Author: Preeti S ChauhanPublisher: Springer Science & Business Media
ISBN: 1461457610
Category : Technology & Engineering
Languages : en
Pages : 254
Book Description
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 2-4, 1995, Austin, TX, USA
Author: Walt TrybulaPublisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 536
Book Description
Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA
Author: Don MillardPublisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Ball grid array technology
Languages : en
Pages : 504
Book Description
The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Author: Beth KeserPublisher: John Wiley & Sons
ISBN: 1119313988
Category : Technology & Engineering
Languages : en
Pages : 634
Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
ISTFA 2006
Author: Electronic Device Failure Analysis SocietyPublisher: ASM International
ISBN: 1615030891
Category : Technology & Engineering
Languages : en
Pages : 524
Book Description
Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele
Author: C. ColingePublisher: The Electrochemical Society
ISBN: 1566778239
Category : Science
Languages : en
Pages : 656
Book Description
Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
Author: ASM InternationalPublisher: ASM International
ISBN: 1627080996
Category : Technology & Engineering
Languages : en
Pages : 593
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.