Author:
Publisher:
ISBN:
Category : Periodicals
Languages : en
Pages : 1860

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Book Description
A union list of serials commencing publication after Dec. 31, 1949.

Author: Y N Zhou
Publisher: Elsevier
ISBN: 184569404X
Category : Technology & Engineering
Languages : en
Pages : 835

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Book Description
Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. - Reviews the basics of nanojoining including solid-state bonding and fusion microwelding - Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling - Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells

Author: John H. Lau
Publisher: Springer Science & Business Media
ISBN: 9780442002602
Category : Computers
Languages : en
Pages : 504

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Book Description
Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR

Author: James E. Morris
Publisher: Springer Science & Business Media
ISBN: 9400904398
Category : Technology & Engineering
Languages : en
Pages : 459

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Book Description
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.

Author: Jing Liu
Publisher: World Scientific
ISBN: 9811245878
Category : Technology & Engineering
Languages : en
Pages : 961

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Book Description
This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category — liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.

Author:
Publisher:
ISBN:
Category : Power resources
Languages : en
Pages : 946

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Book Description

Author: Lyes Benyoucef
Publisher: Springer Science & Business Media
ISBN: 1849961190
Category : Computers
Languages : en
Pages : 516

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Book Description
Artificial Intelligence Techniques for Networked Manufacturing Enterprises Management addresses prominent concepts and applications of AI technologies in the management of networked manufacturing enterprises. The aim of this book is to align latest practices, innovation and case studies with academic frameworks and theories, where AI techniques are used efficiently for networked manufacturing enterprises. More specifically, it includes the latest research results and projects at different levels addressing quick-response system, theoretical performance analysis, performance and capability demonstration. The role of emerging AI technologies in the modelling, evaluation and optimisation of networked enterprises’ activities at different decision levels is also covered. Artificial Intelligence Techniques for Networked Manufacturing Enterprises Management is a valuable guide for postgraduates and researchers in industrial engineering, computer science, automation and operations research.

Author: Zhihong Qian
Publisher: Springer Science & Business Media
ISBN: 3642257666
Category : Technology & Engineering
Languages : en
Pages : 849

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Book Description
CSIE 2011 is an international scientific Congress for distinguished scholars engaged in scientific, engineering and technological research, dedicated to build a platform for exploring and discussing the future of Computer Science and Information Engineering with existing and potential application scenarios. The congress has been held twice, in Los Angeles, USA for the first and in Changchun, China for the second time, each of which attracted a large number of researchers from all over the world. The congress turns out to develop a spirit of cooperation that leads to new friendship for addressing a wide variety of ongoing problems in this vibrant area of technology and fostering more collaboration over the world. The congress, CSIE 2011, received 2483 full paper and abstract submissions from 27 countries and regions over the world. Through a rigorous peer review process, all submissions were refereed based on their quality of content, level of innovation, significance, originality and legibility. 688 papers have been accepted for the international congress proceedings ultimately.

Author: Elizabeth Popp Berman
Publisher: Princeton University Press
ISBN: 0691147086
Category : Education
Languages : en
Pages : 282

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Book Description
"Academic science in the U.S. once self-consciously avoided the market. But today it is seen as an economic engine that keeps the nation globally competitive. Creating the Market University compares the origins of biotech entrepreneurship, university patenting, and university-industry research centers to show how government decisions shaped by a new argument--that innovation drives the economy-transformed academic science"-- Provided by publisher.

Author: Institute of Industrial Engineers (1981- )
Publisher:
ISBN: 9780898061161
Category : Industrial engineering
Languages : en
Pages : 412

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Book Description