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Author: Hiroyuki Fukuyama Publisher: Springer Science & Business Media ISBN: 3540859187 Category : Technology & Engineering Languages : en Pages : 211
Book Description
A variety of industries – information technology, aerospace, automobile, and basic and new materials manufacturing – need technological innovations, which bring high-value-added and high-quality products at low cost not only because of global competition, but also because of the perspective of en- ronmental consciousness and regulation. Thermophysical properties of hi- temperature melts are indispensable for numerical simulations of material processes such as semiconductor and optical crystal growth of the melt, and castingofsuper-high-temperaturealloysforjet-engineturbineblades,inad- tion to welding in automobile manufacturing. Recent developments in process modeling provide 3D unsteady analysis of melt convection, temperature, and heat ?ux distribution, which enables us to predict product quality. In fact, 3D process visualization using computer modeling helps us to understand complicated phenomena occurring in the melt and to control the process. Accurate data are necessary to improve the modeling, which co- e?ectively engenders high-quality products. However, crucial obstacles render measurements of thermophysical properties di?cult at elevated temperatures because of high chemical reactivity and ?uidity of melts. Substantial and persistent challenges have been made to ascertain the precise thermophysical properties of high-temperature melts. This book describes the new techniques and latest developments in the measurements of atomic structure, density, surface tension, viscosity, heat capacity, thermal and mass di?usivity, th- mal conductivity, emissivity, and electrical conductivity of high-temperature melts. In addition to up-to-date improvements in conventional techniques, some new attempts are introduced to open a new scienti?c ?eld, that is, physics of high-temperature melts.
Author: Hiroyuki Fukuyama Publisher: Springer Science & Business Media ISBN: 3540859187 Category : Technology & Engineering Languages : en Pages : 211
Book Description
A variety of industries – information technology, aerospace, automobile, and basic and new materials manufacturing – need technological innovations, which bring high-value-added and high-quality products at low cost not only because of global competition, but also because of the perspective of en- ronmental consciousness and regulation. Thermophysical properties of hi- temperature melts are indispensable for numerical simulations of material processes such as semiconductor and optical crystal growth of the melt, and castingofsuper-high-temperaturealloysforjet-engineturbineblades,inad- tion to welding in automobile manufacturing. Recent developments in process modeling provide 3D unsteady analysis of melt convection, temperature, and heat ?ux distribution, which enables us to predict product quality. In fact, 3D process visualization using computer modeling helps us to understand complicated phenomena occurring in the melt and to control the process. Accurate data are necessary to improve the modeling, which co- e?ectively engenders high-quality products. However, crucial obstacles render measurements of thermophysical properties di?cult at elevated temperatures because of high chemical reactivity and ?uidity of melts. Substantial and persistent challenges have been made to ascertain the precise thermophysical properties of high-temperature melts. This book describes the new techniques and latest developments in the measurements of atomic structure, density, surface tension, viscosity, heat capacity, thermal and mass di?usivity, th- mal conductivity, emissivity, and electrical conductivity of high-temperature melts. In addition to up-to-date improvements in conventional techniques, some new attempts are introduced to open a new scienti?c ?eld, that is, physics of high-temperature melts.
Author: Publisher: Academic Press ISBN: 0080920624 Category : Science Languages : en Pages : 368
Book Description
This book describes the theory of radiation thermometry, both at a primary level and for a variety of applications, such as in the materials processing industries and remote sensing. This book is written for those who will apply radiation thermometry in industrial practice; use radiation thermometers for scientific research; the radiation thermometry specialist in a national measurement institute; developers of radiation thermometers who are working to innovate products for instrument manufacturers, and developers of non-contact thermometry methods to address challenging thermometry problems. The authors of each chapter were chosen from a group of international scientists who are experts in the field and specialists on the subject matter covered in the chapter. A large number of references are included at the end of each chapter as a resource for those seeking a deeper or more detailed understanding. This book is more than a practice guide, readers will gain in-depth knowledge in: (1) the proper selection of the type of thermometer; (2) the best practice in using the radiation thermometers; (3) awareness of the error sources and subsequent appropriate procedure to reduce the overall uncertainty; and (4) understanding of the calibration chain and its current limitations. - Covers all fundamental aspects of the radiometric measurements - Discusses practical applications with details on the instrumentation, calibration, and error sources - Authors are from leading national labs working in R&D of temperature measurements
Author: Hiroyuki Fukuyama Publisher: Springer ISBN: 9783540859178 Category : Technology & Engineering Languages : en Pages : 204
Book Description
A variety of industries – information technology, aerospace, automobile, and basic and new materials manufacturing – need technological innovations, which bring high-value-added and high-quality products at low cost not only because of global competition, but also because of the perspective of en- ronmental consciousness and regulation. Thermophysical properties of hi- temperature melts are indispensable for numerical simulations of material processes such as semiconductor and optical crystal growth of the melt, and castingofsuper-high-temperaturealloysforjet-engineturbineblades,inad- tion to welding in automobile manufacturing. Recent developments in process modeling provide 3D unsteady analysis of melt convection, temperature, and heat ?ux distribution, which enables us to predict product quality. In fact, 3D process visualization using computer modeling helps us to understand complicated phenomena occurring in the melt and to control the process. Accurate data are necessary to improve the modeling, which co- e?ectively engenders high-quality products. However, crucial obstacles render measurements of thermophysical properties di?cult at elevated temperatures because of high chemical reactivity and ?uidity of melts. Substantial and persistent challenges have been made to ascertain the precise thermophysical properties of high-temperature melts. This book describes the new techniques and latest developments in the measurements of atomic structure, density, surface tension, viscosity, heat capacity, thermal and mass di?usivity, th- mal conductivity, emissivity, and electrical conductivity of high-temperature melts. In addition to up-to-date improvements in conventional techniques, some new attempts are introduced to open a new scienti?c ?eld, that is, physics of high-temperature melts.
Author: F. Patrick McCluskey Publisher: CRC Press ISBN: 9780849396236 Category : Technology & Engineering Languages : en Pages : 354
Book Description
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Author: National Research Council Publisher: National Academies Press ISBN: 0309176026 Category : Technology & Engineering Languages : en Pages : 102
Book Description
This book assesses the state of the art of coatings materials and processes for gas-turbine blades and vanes, determines potential applications of coatings in high-temperature environments, identifies needs for improved coatings in terms of performance enhancements, design considerations, and fabrication processes, assesses durability of advanced coating systems in expected service environments, and discusses the required inspection, repair, and maintenance methods. The promising areas for research and development of materials and processes for improved coating systems and the approaches to increased coating standardization are identified, with an emphasis on materials and processes with the potential for improved performance, quality, reproducibility, or manufacturing cost reduction.
Author: Hiroyuki Fukuyama
Author: Hiroyuki Fukuyama
Author: Henri Le Chatelier
Author: 
Author: Jack Ekin
Author: Hiroyuki Fukuyama
Author: F. Patrick McCluskey
Author: National Research Council
Author: 
Author: 
Author: American Society for Testing and Materials