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Author: CMOS Emerging Technologies Research Publisher: CMOS Emerging Technologies ISBN: 1927500451 Category : Languages : en Pages : 63
Book Description
A collection of abstracts for talks presented at the 2014 CMOS Emerging Technologies Research Symposium in Grenoble, France, July 6-8, 2014. The CMOS Emerging Technologies Research Symposium is a research and business event for those who want to discuss and find out about new exciting high tech opportunities. The conference provides researchers, companies and academic institutions with a platform for showcasing their technology, innovations, products and services. By bringing together people from all areas of the high tech arena, we create a stimulating common ground for exploring collaborations and encouraging discussions on emerging technologies.
Author: CMOS Emerging Technologies Research Publisher: CMOS Emerging Technologies ISBN: 1927500451 Category : Languages : en Pages : 63
Book Description
A collection of abstracts for talks presented at the 2014 CMOS Emerging Technologies Research Symposium in Grenoble, France, July 6-8, 2014. The CMOS Emerging Technologies Research Symposium is a research and business event for those who want to discuss and find out about new exciting high tech opportunities. The conference provides researchers, companies and academic institutions with a platform for showcasing their technology, innovations, products and services. By bringing together people from all areas of the high tech arena, we create a stimulating common ground for exploring collaborations and encouraging discussions on emerging technologies.
Author: Gabriel M. Rebeiz Publisher: John Wiley & Sons ISBN: 0471462888 Category : Technology & Engineering Languages : en Pages : 512
Book Description
Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.
Author: Theodore S. Rappaport Publisher: Pearson Education ISBN: 0132172283 Category : Computers Languages : en Pages : 705
Book Description
The Definitive, Comprehensive Guide to Cutting-Edge Millimeter Wave Wireless Design “This is a great book on mmWave systems that covers many aspects of the technology targeted for beginners all the way to the advanced users. The authors are some of the most credible scholars I know of who are well respected by the industry. I highly recommend studying this book in detail.” —Ali Sadri, Ph.D., Sr. Director, Intel Corporation, MCG mmWave Standards and Advanced Technologies Millimeter wave (mmWave) is today's breakthrough frontier for emerging wireless mobile cellular networks, wireless local area networks, personal area networks, and vehicular communications. In the near future, mmWave products, systems, theories, and devices will come together to deliver mobile data rates thousands of times faster than today's existing cellular and WiFi networks. In Millimeter Wave Wireless Communications, four of the field's pioneers draw on their immense experience as researchers, entrepreneurs, inventors, and consultants, empowering engineers at all levels to succeed with mmWave. They deliver exceptionally clear and useful guidance for newcomers, as well as the first complete desk reference for design experts. The authors explain mmWave signal propagation, mmWave circuit design, antenna designs, communication theory, and current standards (including IEEE 802.15.3c, Wireless HD, and ECMA/WiMedia). They cover comprehensive mmWave wireless design issues, for 60 GHz and other mmWave bands, from channel to antenna to receiver, introducing emerging design techniques that will be invaluable for research engineers in both industry and academia. Topics include Fundamentals: communication theory, channel propagation, circuits, antennas, architectures, capabilities, and applications Digital communication: baseband signal/channel models, modulation, equalization, error control coding, multiple input multiple output (MIMO) principles, and hardware architectures Radio wave propagation characteristics: indoor and outdoor applications Antennas/antenna arrays, including on-chip and in-package antennas, fabrication, and packaging Analog circuit design: mmWave transistors, fabrication, and transceiver design approaches Baseband circuit design: multi–gigabit-per-second, high-fidelity DAC and ADC converters Physical layer: algorithmic choices, design considerations, and impairment solutions; and how to overcome clipping, quantization, and nonlinearity Higher-layer design: beam adaptation protocols, relaying, multimedia transmission, and multiband considerations 60 GHz standardization: IEEE 802.15.3c for WPAN, Wireless HD, ECMA-387, IEEE 802.11ad, Wireless Gigabit Alliance (WiGig)
Author: Duixian Liu Publisher: John Wiley & Sons ISBN: 1119556635 Category : Technology & Engineering Languages : en Pages : 416
Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author: Shiban Kishen Koul Publisher: CRC Press ISBN: 1000223620 Category : Computers Languages : en Pages : 258
Book Description
This book discusses antenna designs for handheld devices as well as base stations. The book serves as a reference and a handy guide for graduate students and PhD students involved in the field of millimeter wave antenna design. It also gives insights to designers and practicing engineers who are actively engaged in design of antennas for future 5G devices. It offers an in-depth study, performance analysis and extensive characterization of novel antennas for 5G applications. The reader will learn about basic design methodology and techniques to develop antennas for 5G applications including concepts of path loss compensation, co-design of commercial 4G antennas with millimeter wave 5G antennas and antennas used in phase array and pattern diversity modules. Practical examples included in the book will help readers to build high performance antennas for 5G subsystems/systems using low cost technology. Key Features Provides simple design methodology of different antennas for handheld devices as well as base stations for 5G applications. Concept of path loss compensation introduced. Co-design of commercial 4G antennas with millimetre wave 5G antennas presented. Comparison of phased array versus pattern diversity modules discussed in detail. Fabrication and Measurement challenges at mmWaves and Research Avenues in antenna designs for 5G and beyond presented. Shiban Kishen Koul is an emeritus professor at the Centre for Applied Research in Electronics at the Indian Institute of Technology Delhi. He served as the chairman of Astra Microwave Products Limited, Hyderabad from 2009-2018. He is a Life Fellow of the Institution of Electrical and Electronics Engineering (IEEE), USA, a Fellow of the Indian National Academy of Engineering (INAE), and a Fellow of the Institution of Electronics and Telecommunication Engineers (IETE). Karthikeya G S worked as an assistant professor in Visvesvaraya technological university from 2013 to 2016 and completed his PhD from the Centre for Applied Research in Electronics at the Indian Institute of Technology Delhi in Dec.2019. He is a member of IEEE-Antenna Propagation Society and Antenna Test and Measurement society.
Author: IEEE Staff Publisher: ISBN: 9781665430821 Category : Languages : en Pages :
Book Description
RFIC is the premier IC Conference focused on the latest developments in RF Microwave, and Millimeter Wave Integrated Circuit Technology and Innovation
Author: Cam Nguyen Publisher: John Wiley & Sons ISBN: 1118900472 Category : Technology & Engineering Languages : en Pages : 884
Book Description
Radio-Frequency Integrated-Circuit Engineering addresses the theory, analysis and design of passive and active RFIC's using Si-based CMOS and Bi-CMOS technologies, and other non-silicon based technologies. The materials covered are self-contained and presented in such detail that allows readers with only undergraduate electrical engineering knowledge in EM, RF, and circuits to understand and design RFICs. Organized into sixteen chapters, blending analog and microwave engineering, Radio-Frequency Integrated-Circuit Engineering emphasizes the microwave engineering approach for RFICs. * Provides essential knowledge in EM and microwave engineering, passive and active RFICs, RFIC analysis and design techniques, and RF systems vital for RFIC students and engineers * Blends analog and microwave engineering approaches for RFIC design at high frequencies * Includes problems at the end of each chapter
Author: Sorin Voinigescu Publisher: Cambridge University Press ISBN: 0521873029 Category : Technology & Engineering Languages : en Pages : 921
Book Description
A transistor-level, design-intensive overview of high speed and high frequency monolithic integrated circuits for wireless and broadband systems from 2 GHz to 200 GHz, this comprehensive text covers high-speed, RF, mm-wave, and optical fibre circuits using nanoscale CMOS, SiGe BiCMOS, and III-V technologies. Step-by-step design methodologies, end-of chapter problems, and practical simulation and design projects are provided, making this an ideal resource for senior undergraduate and graduate courses in circuit design. With an emphasis on device-circuit topology interaction and optimization, it gives circuit designers and students alike an in-depth understanding of device structures and process limitations affecting circuit performance.
Author: Sudipta Das Publisher: Springer ISBN: 9789811657337 Category : Science Languages : en Pages : 0
Book Description
This book highlights the growing applications of THz technology and various modules used for their successful realization. The enormous advantages of THz devices like higher resolution, spatial directivity, high-speed communication, greater bandwidth, non-ionizing signal nature and compactness make them useful in various applications like communication, sensing, security, safety, spectroscopy, manufacturing, bio-medical, agriculture, imaging, etc. Since the THz radiation covers frequencies from 0.1THz to around 10THz and highly attenuated by atmospheric gases, they are used in short-distance applications only. The book focuses on recent advances and different research issues in terahertz technology and presents theoretical, methodological, well-established and validated empirical works dealing with the different topics.
Author: CMOS Emerging Technologies Research
Author: CMOS Emerging Technologies Research
Author: Gabriel M. Rebeiz
Author: Theodore S. Rappaport
Author: Duixian Liu
Author: Shiban Kishen Koul
Author: IEEE Staff
Author: Cam Nguyen
Author: Sorin Voinigescu
Author: Sudipta Das
Author: Thomas H. Lee