Author: Graham F. SomervillePublisher:
ISBN:
Category : Butanol
Languages : en
Pages : 114
Book Description
Downflow Boiling of N-butanol in a Uniformly Heated Tube
Author: Graham F. SomervillePublisher:
ISBN:
Category : Butanol
Languages : en
Pages : 114
Book Description
Experimental Results of Forced Convection Boiling Potassium Heat Transfer and Pressure Drop Tests
Author: E. BernsteinDownflow Boiling and Nonboiling Heat Transfer in a Uniformly Heated Tube
Author: Robert LeRoy SaniPublisher:
ISBN:
Category : Ebullition
Languages : en
Pages : 112
Book Description
Heat Transfer in Condensation and Boiling
Author: Karl StephanPublisher: Springer Science & Business Media
ISBN: 3642524575
Category : Technology & Engineering
Languages : en
Pages : 342
Book Description
I welcome the opportunity to have my book translated, because of the great emphasis on two-phase flow and heat transfer in the English-speaking world, as related to research, university education, and industrial practice. The 1988 Springer-Verlag edition of "Warmeiibergang beim Kondensieren und beim Sieden" has been enlarged to include additional material on falling film evaporation (Chapter 12) and pressure drop in two-phase flow (Chapter 13). Minor errors in the original text have also been corrected. I would like to express my sincere appreciation to Professor Green, Asso ciate Professor of German at Rensselaer, for his excellent translation and co operation. My thanks go also to Professor Bergles for his close attention to technical and linguistic details. He carefully read the typescript and made many comments and suggestions that helped to improve the manuscript. I hope that the English edition will meet with' a favorable reception and contribute to better understanding and to progress in the field of heat transfer in condensation and boiling. February 1992 K. Stephan Preface to the German-Language Edition This book is a continuation of the series "Heat and Mass Transfer" edited by U. Grigull, in which three volumes have already been published. Its aim is to acquaint students and practicing engineers with heat transfer during condensa tion and boiling, and is intended primarily for students and engineers in mechanical, chemical, electrical, and industrial processing engineering.
NASA Technical Note
Author: Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set)
Author: Avram Bar-CohenPublisher: World Scientific
ISBN: 9814313785
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set)
Author: Publisher: World Scientific
ISBN: 9814452599
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Applied Mechanics Reviews
Author: Boiling Heat Transfer And Two-Phase Flow
Author: L S TongPublisher: Routledge
ISBN: 1351463365
Category : Science
Languages : en
Pages : 394
Book Description
Completely updated, this graduate text describes the current state of boiling heat transfer and two-phase flow, in terms through which students can attain a consistent understanding. Prediction of real or potential boiling heat transfer behaviour, both in steady and transient states, is covered to aid engineering design of reliable and effective systems.
Author: