Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Handbook of 3D Integration, Volume 3 PDF full book. Access full book title Handbook of 3D Integration, Volume 3 by Philip Garrou. Download full books in PDF and EPUB format.
Author: Philip Garrou Publisher: John Wiley & Sons ISBN: 3527670122 Category : Technology & Engineering Languages : en Pages : 484
Book Description
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Author: Philip Garrou Publisher: John Wiley & Sons ISBN: 3527334661 Category : Technology & Engineering Languages : en Pages : 484
Book Description
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Author: Paul D. Franzon Publisher: John Wiley & Sons ISBN: 3527697047 Category : Technology & Engineering Languages : en Pages : 492
Book Description
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Author: Philip Garrou Publisher: John Wiley & Sons ISBN: 352762306X Category : Technology & Engineering Languages : en Pages : 798
Book Description
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Author: Jacopo Iannacci Publisher: John Wiley & Sons ISBN: 3527673946 Category : Technology & Engineering Languages : en Pages : 374
Book Description
Closes the gap between hardcore-theoretical and purely experimental RF-MEMS books. The book covers, from a practical viewpoint, the most critical steps that have to be taken in order to develop novel RF-MEMS device concepts. Prototypical RF-MEMS devices, both including lumped components and complex networks, are presented at the beginning of the book as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. Theoretical concepts are introduced when necessary to complement the practical hints given for all RF-MEMS development stages. Provides researchers and engineers with invaluable practical hints on how to develop novel RF-MEMS device concepts Covers all critical steps, dealing with design, simulation, optimization, characterization and fabrication of MEMS for radio-frequency applications Addresses frequently disregarded issues, explicitly treating the hard to predict interplay between the three-dimensional device structure and its electromagnetic functionality Bridges theory and experiment, fundamental concepts are introduced with the application in mind, and simulation results are validated against experimental results Appeals to the practice-oriented R&D reader: design and simulation examples are based on widely known software packages such as ANSYS and the hardware description language Verilog.
Author: Markku Tilli Publisher: Elsevier ISBN: 012817787X Category : Technology & Engineering Languages : en Pages : 1028
Book Description
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. - Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits - Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures - Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements - Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
Author: Oliver Brand Publisher: John Wiley & Sons ISBN: 3527335455 Category : Technology & Engineering Languages : en Pages : 512
Book Description
Part of the AMN book series, this book covers the principles, modeling and implementation as well as applications of resonant MEMS from a unified viewpoint. It starts out with the fundamental equations and phenomena that govern the behavior of resonant MEMS and then gives a detailed overview of their implementation in capacitive, piezoelectric, thermal and organic devices, complemented by chapters addressing the packaging of the devices and their stability. The last part of the book is devoted to the cutting-edge applications of resonant MEMS such as inertial, chemical and biosensors, fluid properties sensors, timing devices and energy harvesting systems.
Author: Aida Todri-Sanial Publisher: Springer ISBN: 3319297465 Category : Technology & Engineering Languages : en Pages : 340
Book Description
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Author: Yash Agrawal Publisher: Springer Nature ISBN: 9819944767 Category : Technology & Engineering Languages : en Pages : 286
Book Description
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Author: Chuan Seng Tan Publisher: CRC Press ISBN: 9814303828 Category : Science Languages : en Pages : 376
Book Description
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
Author: Yan Li Publisher: Springer Nature ISBN: 9811570906 Category : Technology & Engineering Languages : en Pages : 629
Book Description
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Author: Philip Garrou
Author: Philip Garrou
Author: Paul D. Franzon
Author: Philip Garrou
Author: Jacopo Iannacci
Author: Markku Tilli
Author: Oliver Brand
Author: Aida Todri-Sanial
Author: Yash Agrawal
Author: Chuan Seng Tan
Author: Yan Li