Author: Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 544
Book Description
Masters Theses and Doctoral Dissertations in the Pure and Applied Sciences Accepted by Colleges and Universities of the United States
Author: Master's Theses and Doctoral Dissertations in the Pure and Applied Sciences
Author: Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 186
Book Description
Scientific and Technical Aerospace Reports
Author: Demystifying Switched Capacitor Circuits
Author: Mingliang (Michael) LiuPublisher: Elsevier
ISBN: 0080458769
Category : Technology & Engineering
Languages : en
Pages : 332
Book Description
This book helps engineers to grasp fundamental theories and design principles by presenting physical and intuitive explanations of switched-capacitor circuits. Numerous circuit examples are discussed and the author emphasizes the most important and fundamental principles involved in implementing state-of-the-art switched-capacitor circuits for analog signal processing and power management applications. Throughout the book, the author presents numerous step-by-step tutorials and gives practical design examples.While some quantitative analysis is necessary to understand underlying concepts, tedious mathematical equations and formal proofs are avoided. An intuitive appreciation for switched-capacitor circuits is achieved.Much of the existing information on contemporary switched-capacitor circuit applications is in the form of applications notes and data sheets for various switched-capacitor ICs. This book compiles such information in a single volume and coherently organizes and structures it.The author has his own website at www.mingliangliu.com * Step-by-step tutorials which emphasize the most fundamental principals of switched-capacitor circuits * Few tedious mathematical equations * The first easy-to-understand compilation on this subject--most information available is not very cohesive
Compact Models for Integrated Circuit Design
Author: Samar K. SahaPublisher: CRC Press
ISBN: 1351831070
Category : Technology & Engineering
Languages : en
Pages : 385
Book Description
Compact Models for Integrated Circuit Design: Conventional Transistors and Beyond provides a modern treatise on compact models for circuit computer-aided design (CAD). Written by an author with more than 25 years of industry experience in semiconductor processes, devices, and circuit CAD, and more than 10 years of academic experience in teaching compact modeling courses, this first-of-its-kind book on compact SPICE models for very-large-scale-integrated (VLSI) chip design offers a balanced presentation of compact modeling crucial for addressing current modeling challenges and understanding new models for emerging devices. Starting from basic semiconductor physics and covering state-of-the-art device regimes from conventional micron to nanometer, this text: Presents industry standard models for bipolar-junction transistors (BJTs), metal-oxide-semiconductor (MOS) field-effect-transistors (FETs), FinFETs, and tunnel field-effect transistors (TFETs), along with statistical MOS models Discusses the major issue of process variability, which severely impacts device and circuit performance in advanced technologies and requires statistical compact models Promotes further research of the evolution and development of compact models for VLSI circuit design and analysis Supplies fundamental and practical knowledge necessary for efficient integrated circuit (IC) design using nanoscale devices Includes exercise problems at the end of each chapter and extensive references at the end of the book Compact Models for Integrated Circuit Design: Conventional Transistors and Beyond is intended for senior undergraduate and graduate courses in electrical and electronics engineering as well as for researchers and practitioners working in the area of electron devices. However, even those unfamiliar with semiconductor physics gain a solid grasp of compact modeling concepts from this book.
The Summary of Engineering Research
Author: Devices for Integrated Circuits
Author: H. Craig CaseyPublisher: John Wiley & Sons
ISBN: 0471171344
Category : Technology & Engineering
Languages : en
Pages : 549
Book Description
This book develops the device physics of the Si and III-V compound semiconductor devices used in integrated circuits. Important equations are derived from basic physical concepts. The physics of these devices are related to the parameters used in SPICE. Terminology is intended to prepare students for reading technical journals on semiconductor devices. This text is suitable for first-year graduate students and seniors in Electrical Engineering; graduate students in Material Science and Chemical Engineering, interested in semiconductor materials; Computer Science students interested in custom VLSI design; and professionals in the semiconductor industry.
Quadrature RC−Oscillators
Author: João Carlos Ferreira de Almeida CasaleiroPublisher: Springer
ISBN: 3030007405
Category : Technology & Engineering
Languages : en
Pages : 166
Book Description
This book presents a tutorial review of van der Pol model, a universal oscillator model for the analysis of modern RC−oscillators in weak and strong nonlinear regimes. A detailed analysis of the injection locking in van der Pol oscillators is also presented. The relation between the van der Pol parameters and several circuit implementations in CMOS nanotechnology is given, showing that this theory is very useful in the optimization of oscillator key parameters, such as: frequency, amplitude and phase relationship. The authors discuss three different examples: active coupling RC−oscillators, capacitive coupling RC−oscillators, and two-integrator oscillator working in the sinusoidal regime. · Provides a detailed tutorial on the van der Pol oscillator model, which can be the basis for the analysis of modern RC−oscillators in weak and strong nonlinear regimes; · Demonstrations the relationship between the van der Pol parameters and several circuit implementations in CMOS nanotechnology, showing that this theory is a powerful tool in the optimization of key oscillator parameters; · Provides three circuit prototypes implemented in modern CMOS nanotechnology in the GHz range, with applications in low area, low power, low cost, wireless sensor network (WSN) applications (e.g. IoT, BLE).
Electronic Materials Handbook
Author: Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
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