Author: Publisher: Integrity Institute of Tech
ISBN:
Category :
Languages : en
Pages : 17
Book Description
Fundamentals of Electrical Design Course Module 2
Author: Publisher: Integrity Institute of Tech
ISBN:
Category :
Languages : en
Pages : 17
Book Description
Fundamentals of Electrical Design - Module 2 PRELIMINARY AND DETAILED DESIGN ANALYSIS
Author: Publisher: Integrity Institute of Tech
ISBN:
Category :
Languages : en
Pages : 18
Book Description
Fundamental Concepts in Electrical and Computer Engineering with Practical Design Problems
Author: Reza AdhamiPublisher: Universal-Publishers
ISBN: 1581129718
Category : Computers
Languages : en
Pages : 736
Book Description
In many cases, the beginning engineering student is thrown into upper-level engineering courses without an adequate introduction to the basic material. This, at best, causes undue stress on the student as they feel unprepared when faced with unfamiliar material, and at worst, results in students dropping out of the program or changing majors when they discover that their chosen field of engineering is not what they thought it was. The purpose of this text is to introduce the student to a general cross-section of the field of electrical and computer engineering. The text is aimed at incoming freshmen, and as such, assumes that the reader has a limited to nonexistent background in electrical engineering and knowledge of no more than pre-calculus in the field of mathematics. By exposing students to these fields at an introductory level, early in their studies, they will have both a better idea of what to expect in later classes and a good foundation of knowledge upon which to build.
Resources in Education
Author: Fundamentals of Electrical Engineering
Author: Leonard S. BobrowPublisher: Oxford Series in Electrical and Computer Engineering
ISBN: 9780195105094
Category : Technology & Engineering
Languages : en
Pages : 1163
Book Description
Divided into four parts: circuits, electronics, digital systems, and electromagnetics, this text provides an understanding of the fundamental principles on which modern electrical engineering is based. It is suitable for a variety of electrical engineering courses, and can also be used as a text for an introduction to electrical engineering.
Catalog of Copyright Entries. Third Series
Author: Library of Congress. Copyright OfficePublisher: Copyright Office, Library of Congress
ISBN:
Category : Copyright
Languages : en
Pages : 1862
Book Description
Film & Video Finder
Author: Proceedings
Author: American Society for Engineering Education. ConferencePublisher:
ISBN:
Category : Engineering
Languages : en
Pages : 1342
Book Description
Review Guide for the NABCEP Entry-Level Exam
Author: John R. BalfourPublisher: Jones & Bartlett Publishers
ISBN: 1449624650
Category : Technology & Engineering
Languages : en
Pages : 258
Book Description
This guide will help prepare readers for the NABCEP exam by providing the fundamental principles of PV system design, installation, and operation.
Multichip Module Technologies and Alternatives: The Basics
Author: Daryl Ann DoanePublisher: Springer Science & Business Media
ISBN: 1461531004
Category : Computers
Languages : en
Pages : 895
Book Description
Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.