Author: United States. Internal Revenue ServicePublisher:
ISBN:
Category : Taxation
Languages : en
Pages : 684
Book Description
Internal Revenue Bulletin
Author: United States. Internal Revenue ServicePublisher:
ISBN:
Category : Taxation
Languages : en
Pages : 684
Book Description
Tramrail
Author: Cleveland Electric TramrailPublisher:
ISBN:
Category : Conveying machinery
Languages : en
Pages : 292
Book Description
Code of Federal Regulations
Author: Publisher:
ISBN:
Category : Administrative law
Languages : en
Pages : 844
Book Description
Special edition of the Federal Register, containing a codification of documents of general applicability and future effect ... with ancillaries.
Minerals Yearbook
Author: Minerals Yearbook Metals and Minerals 2010 Volume I
Author: Publisher: Government Printing Office
ISBN:
Category :
Languages : en
Pages : 1106
Book Description
International Arbitration: Law and Practice in Switzerland
Author: Gabrielle Kaufmann-KohlerPublisher: Oxford University Press
ISBN: 0191669199
Category : Law
Languages : en
Pages : 732
Book Description
This book expounds the theory of international arbitration law. It explains in easily accessible terms all the fundamentals of arbitration, from separability of the arbitration agreement to competence-competence over procedural autonomy, finality of the award, and many other concepts. It does so with a focus on international arbitration law and jurisprudence in Switzerland, a global leader in the field. With a broader reach than a commentary of Chapter 12 of the Swiss Private International Law Act, the discussion contains numerous references to comparative law and its developments in addition to an extensive review of the practice of international tribunals. Written by two well-known specialists - Professor Kaufmann-Kohler being one of the leading arbitrators worldwide and Professor Rigozzi one of the foremost experts in sports arbitration - the work reflects many years of experience in managing arbitral proceedings involving commercial, investment, and sports disputes. This expertise is the basis for the solutions proposed to resolve the many practical issues that may arise in the course of an arbitration. It also informs the discussion of the arbitration rules addressed in the book, from the ICC Arbitration Rules to the Swiss Rules of International Arbitration, the CAS Code, and the UNCITRAL Rules. While the book covers commercial and sports arbitrations primarily, it also applies to investment arbitrations conducted under rules other than the ICSID framework.
Enzymes and Coenzymes: Advances in Research and Application: 2011 Edition
Author: Publisher: ScholarlyEditions
ISBN: 1464920729
Category : Medical
Languages : en
Pages : 1417
Book Description
Enzymes and Coenzymes: Advances in Research and Application: 2011 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Enzymes and Coenzymes. The editors have built Enzymes and Coenzymes: Advances in Research and Application: 2011 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Enzymes and Coenzymes in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Enzymes and Coenzymes: Advances in Research and Application: 2011 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.
Bulletins
Author: Making Marvels
Author: Wolfram KoeppePublisher: Metropolitan Museum of Art
ISBN: 1588396770
Category : Art
Languages : en
Pages : 315
Book Description
Featuring more than 150 treasures from several of the world’s most prestigious collections, Making Marvels explores the vital intersection of art, technology, and political power at the courts of early modern Europe. It was there, from the sixteenth through eighteenth centuries, that a remarkable outpouring of creativity and learning gave rise to exquisite objects that were at once beautiful works of art and technological wonders. By amassing vast, glittering collections of these ingeniously crafted objects, princes flaunted their wealth and competed for mastery over the known world. More than mere status symbols, however, many of these marvels ushered in significant advancements that have had a lasting influence on astronomy, engineering, and even international politics. Incisive texts by leading scholars situate these works within the rich, complex symbolism of life at court, where science and splendor were pursued with equal vigor and together contributed to a culture of magnificence.
Interconnect Reliability in Advanced Memory Device Packaging
Author: Chong Leong, GanPublisher: Springer Nature
ISBN: 3031267087
Category : Computers
Languages : en
Pages : 223
Book Description
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.