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Failure Analysis of Ceramic Components

Failure Analysis of Ceramic Components PDF Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :

Book Description
Ceramics are being considered for a wide range of structural applications due to their low density and their ability to retain strength at high temperatures. The inherent brittleness of monolithic ceramics requires a departure from the deterministic design philosophy utilized to analyze metallic structural components. The design program ''Ceramic Analysis and Reliability Evaluation of Structures Life'' (CARES/LIFE) developed by NASA Lewis Research Center uses a probabilistic approach to predict the reliability of monolithic components under operational loading. The objective of this study was to develop an understanding of the theories used by CARES/LIFE to predict the reliability of ceramic components and to assess the ability of CARES/LIFE to accurately predict the fast fracture behavior of monolithic ceramic components. A finite element analysis was performed to determine the temperature and stress distribution of a silicon carbide O-ring under diametral compression. The results of the finite element analysis were supplied as input into CARES/LIFE to determine the fast fracture reliability of the O-ring. Statistical material strength parameters were calculated from four-point flexure bar test data. The predicted reliability showed excellent correlation with O-ring compression test data indicating that the CARES/LIFE program can be used to predict the reliability of ceramic components subjected to complicated stress states using material properties determined from simple uniaxial tensile tests.

Failure Analysis of Ceramic Components

Failure Analysis of Ceramic Components PDF Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :

Book Description
Ceramics are being considered for a wide range of structural applications due to their low density and their ability to retain strength at high temperatures. The inherent brittleness of monolithic ceramics requires a departure from the deterministic design philosophy utilized to analyze metallic structural components. The design program ''Ceramic Analysis and Reliability Evaluation of Structures Life'' (CARES/LIFE) developed by NASA Lewis Research Center uses a probabilistic approach to predict the reliability of monolithic components under operational loading. The objective of this study was to develop an understanding of the theories used by CARES/LIFE to predict the reliability of ceramic components and to assess the ability of CARES/LIFE to accurately predict the fast fracture behavior of monolithic ceramic components. A finite element analysis was performed to determine the temperature and stress distribution of a silicon carbide O-ring under diametral compression. The results of the finite element analysis were supplied as input into CARES/LIFE to determine the fast fracture reliability of the O-ring. Statistical material strength parameters were calculated from four-point flexure bar test data. The predicted reliability showed excellent correlation with O-ring compression test data indicating that the CARES/LIFE program can be used to predict the reliability of ceramic components subjected to complicated stress states using material properties determined from simple uniaxial tensile tests.

Ceramics

Ceramics PDF Author: Dietrich Munz
Publisher: Springer Science & Business Media
ISBN: 3642584071
Category : Technology & Engineering
Languages : en
Pages : 302

Book Description
The book gives a description of the failure phenomena of ceramic materials under mechanical loading, the methods to determine their properties, and the principles for material selection. The book presents fracture mechanical and statistical principles and their application to describe the scatter of strength and lifetime, while special chapters are devoted to creep behaviour, multiaxial failure criteria and thermal shock behaviour. XXXXXXX Neuer Text Describing how ceramic materials fracture and fail under mechanical loading, this book provides methods for determining the properties of ceramics, and gives criteria for selecting ceramic materials for particular applications. It also examines the fracture-mechanical and statistical principles and their use in understanding the strength and durability of ceramics. Special chapters are devoted to creep behavior, criteria for multiaxial failure, and behavior under thermal shock. Readers will gain insight into the design of reliable ceramic components.

Failure Analysis of Engineering Materials

Failure Analysis of Engineering Materials PDF Author: Charles R. Brooks
Publisher: McGraw Hill Professional
ISBN: 9780071357586
Category : Technology & Engineering
Languages : en
Pages : 626

Book Description
Suitable for engineers, this work presents a tool for expert investigation and analysis of component failures. It is designed-to-be-used introduction to principals and practices. It includes: 500 illustrations; pinpoints fracture type with comparative fractographs; and can be used as expert examples in reports.

Microelectronics Failure Analysis

Microelectronics Failure Analysis PDF Author: EDFAS Desk Reference Committee
Publisher: ASM International
ISBN: 1615037268
Category : Technology & Engineering
Languages : en
Pages : 673

Book Description
Includes bibliographical references and index.

Fractography of Ceramic and Metal Failures

Fractography of Ceramic and Metal Failures PDF Author: J. J. Mecholsky
Publisher: ASTM International
ISBN:
Category :
Languages : en
Pages : 416

Book Description


Engineered Materials Handbook, Desk Edition

Engineered Materials Handbook, Desk Edition PDF Author: ASM International. Handbook Committee
Publisher: ASM International
ISBN: 0871702835
Category : Technology & Engineering
Languages : en
Pages : 1313

Book Description
A comprehensive reference on the properties, selection, processing, and applications of the most widely used nonmetallic engineering materials. Section 1, General Information and Data, contains information applicable both to polymers and to ceramics and glasses. It includes an illustrated glossary, a collection of engineering tables and data, and a guide to materials selection. Sections 2 through 7 focus on polymeric materials--plastics, elastomers, polymer-matrix composites, adhesives, and sealants--with the information largely updated and expanded from the first three volumes of the Engineered Materials Handbook. Ceramics and glasses are covered in Sections 8 through 12, also with updated and expanded information. Annotation copyright by Book News, Inc., Portland, OR

Microelectronics Failure Analysis

Microelectronics Failure Analysis PDF Author:
Publisher: ASM International
ISBN: 0871708043
Category : Technology & Engineering
Languages : en
Pages : 813

Book Description
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron

Systems Failure Analysis

Systems Failure Analysis PDF Author: Joseph Berk
Publisher: ASM International
ISBN: 1615031375
Category : Technology & Engineering
Languages : en
Pages : 209

Book Description


Microelectronic Failure Analysis Desk Reference

Microelectronic Failure Analysis Desk Reference PDF Author:
Publisher: ASM International
ISBN: 0871707454
Category : Technology & Engineering
Languages : en
Pages : 162

Book Description
Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee.

Microelectronic Failure Analysis

Microelectronic Failure Analysis PDF Author:
Publisher: ASM International
ISBN: 0871707691
Category : Technology & Engineering
Languages : en
Pages : 160

Book Description
Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee