Author: Samuel S. MaoPublisher:
ISBN:
Category :
Languages : en
Pages : 194
Book Description
Experimental and Theoretical Studies of Picosecond Laser Interactions with Electronic Materials - Laser Ablation
Author: Samuel S. MaoFemtosecond Laser-Matter Interaction
Author: Eugene G. GamalyPublisher: CRC Press
ISBN: 9814241814
Category : Science
Languages : en
Pages : 370
Book Description
This is the first comprehensive treatment of the interaction of femtosecond laser pulses with solids at nonrelativistic intensity. It connects phenomena from the subtle atomic motion on the nanoscale to the generation of extreme pressure and temperature in the interaction zone confined inside a solid. The femtosecond laser-matter interaction has already found numerous applications in industry, medicine, and materials science. However, there is no consensus on the interpretation of related phenomena. With mathematics kept to a minimum, this is a highly engaging and readable treatment for students and researchers in science and engineering. The book avoids complex mathematical formulae, and hence the content is accessible to nontechnical readers. Useful summaries after each chapter provide compressed information for quick estimates of major parameters in planned or performed experiments. The book connects the basic physics of femtosecond laser-solid interactions to a broad range of applications. Throught the text, basic assumptions are derived from the first principles, and new results and ideas are presented. From such analyses, a qualitative and predictive framework for the field emerges, the impact of which on applications is also discussed.
3D Microelectronic Packaging
Author: Yan LiPublisher: Springer
ISBN: 3319445863
Category : Technology & Engineering
Languages : en
Pages : 465
Book Description
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Scientific and Technical Aerospace Reports
Author: Laser Ablation in Liquids
Author: Guowei YangPublisher: CRC Press
ISBN: 9814241520
Category : Science
Languages : en
Pages : 1166
Book Description
This book focuses on the fundamental concepts and physical and chemical aspects of pulsed laser ablation of solid targets in liquid environments and its applications in the preparation of nanomaterials and fabrication of nanostructures. The areas of focus include basic thermodynamic and kinetic processes of laser ablation in liquids, and its applic
Dissertation Abstracts International
Author: Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 980
Book Description
Pulsed Laser Ablation of Solids
Author: Mihai StafePublisher: Springer Science & Business Media
ISBN: 3642409784
Category : Science
Languages : en
Pages : 241
Book Description
The book introduces ‘the state of the art' of pulsed laser ablation and its applications. It is based on recent theoretical and experimental studies. The book reaches from the basics to advanced topics of pulsed laser ablation. Theoretical and experimental fundamental phenomena involved in pulsed laser ablation are discussed with respect to material properties, laser wavelength, fluence and intensity regime of the light absorbed linearly or non-linearly in the target material. The energy absorbed by the electrons leads to atom/molecule excitation, ionization and/or direct chemical bond breaking and is also transferred to the lattice leading to material heating and phase transitions. Experimental non-invasive optical methods for analyzing these phenomena in real time are described. Theoretical models for pulsed laser ablation and phase transitions induced by laser beams and laser-vapour/plasma interaction during the plume expansion above the target are also presented. Calculations of the ablation speed and dimensions of the ablated micro- and nano-structures are performed. The validity and required refinement of different models in different experimental conditions is provided. The pulsed laser deposition process which bases on collecting the ablated particles on a surface is analyzed in terms of efficiency and quality of the deposited films as a function of ambient conditions, target material, laser parameters and substrate characteristics. The interaction between the incident laser and the ablation plasma is analyzed with respect to its influence on the structures of the deposited films and its capacity to generate high harmonics and single attosecond pulses which are highly desirable in pump-probe experiments.
Femtosecond Laser-Matter Interaction
Author: Eugene G. GamalyPublisher: CRC Press
ISBN: 9814267805
Category : Science
Languages : en
Pages : 350
Book Description
This is the first comprehensive treatment of the interaction of femtosecond laser pulses with solids at nonrelativistic intensity. It connects phenomena from the subtle atomic motion on the nanoscale to the generation of extreme pressure and temperature in the interaction zone confined inside a solid. The femtosecond laser-matter interaction has al
Micro-Manufacturing
Author: Muammer KoçPublisher: John Wiley & Sons
ISBN: 1118010566
Category : Technology & Engineering
Languages : en
Pages : 490
Book Description
This book is the first of its kind to collectively address design-based and mechanical micro-manufacturing topics in one place. It focuses on design and materials selection, as well as the manufacturing of micro-products using mechanical-based micro-manufacturing process technologies. After addressing the fundamentals and non-metallic-based micro-manufacturing processes in the semiconductor industry, it goes on to address specific metallic-based micro-manufacturing processes, such as: micro-forming, micro-machining, micro-molding, micro-laser processing, micro-layered manufacturing, micro-joining, micro-assembly and materials handling, and microEDM and ECM. The book provides an in-depth understanding of materials behavior at micro-scales and under different micro-scale processing conditions, while also including a wide variety of emerging micro-scale manufacturing issues and examples.
Author: