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Microwaves Photonic Links

Microwaves Photonic Links PDF Author: Christian Rumelhard
Publisher: John Wiley & Sons
ISBN: 1118586352
Category : Technology & Engineering
Languages : en
Pages : 295

Book Description
This book presents the electrical models for the different elements of a photonic microwave link like lasers, external modulators, optical fibers, photodiodes and phototransistors. The future trends of these components are also introduced: lasers to VCSEL, external modulators to electro-absorption modulators, glass optical fibers to plastic optical fibers, photodiodes to UTC photodiodes or phototransistors. It also describes an original methodology to evaluate the performance of a microwave photonic link, based on the developed elcetrical models, that can be easily incorporated in commercial electrical circuits simulation software to simulate this complete link.

Microwaves Photonic Links

Microwaves Photonic Links PDF Author: Christian Rumelhard
Publisher: John Wiley & Sons
ISBN: 1118586352
Category : Technology & Engineering
Languages : en
Pages : 295

Book Description
This book presents the electrical models for the different elements of a photonic microwave link like lasers, external modulators, optical fibers, photodiodes and phototransistors. The future trends of these components are also introduced: lasers to VCSEL, external modulators to electro-absorption modulators, glass optical fibers to plastic optical fibers, photodiodes to UTC photodiodes or phototransistors. It also describes an original methodology to evaluate the performance of a microwave photonic link, based on the developed elcetrical models, that can be easily incorporated in commercial electrical circuits simulation software to simulate this complete link.

Technical Digest

Technical Digest PDF Author:
Publisher:
ISBN:
Category : Microwave communication systems
Languages : en
Pages : 436

Book Description


Bulletin de L'Institut International Du Froid

Bulletin de L'Institut International Du Froid PDF Author:
Publisher:
ISBN:
Category : Refrigeration and refrigerating machinery
Languages : en
Pages : 130

Book Description


Annales des télécommunications

Annales des télécommunications PDF Author:
Publisher:
ISBN:
Category : Telecommunication
Languages : en
Pages : 342

Book Description


Government Reports Annual Index

Government Reports Annual Index PDF Author:
Publisher:
ISBN:
Category : Research
Languages : en
Pages : 1132

Book Description
Sections 1-2. Keyword Index.--Section 3. Personal author index.--Section 4. Corporate author index.-- Section 5. Contract/grant number index, NTIS order/report number index 1-E.--Section 6. NTIS order/report number index F-Z.

Government Reports Announcements & Index

Government Reports Announcements & Index PDF Author:
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1320

Book Description


Fiabilité des Transistors Bipolaires à Hétérojonction sur substrat InP

Fiabilité des Transistors Bipolaires à Hétérojonction sur substrat InP PDF Author: JEAN-CHRISTOPHE MARTIN
Publisher:
ISBN: 9786131513053
Category :
Languages : fr
Pages : 228

Book Description


Radiation Effects on Embedded Systems

Radiation Effects on Embedded Systems PDF Author: Raoul Velazco
Publisher: Springer Science & Business Media
ISBN: 140205646X
Category : Technology & Engineering
Languages : en
Pages : 273

Book Description
This volume provides an extensive overview of radiation effects on integrated circuits, offering major guidelines for coping with radiation effects on components. It contains a set of chapters based on the tutorials presented at the International School on Effects of Radiation on Embedded Systems for Space Applications (SERESSA) that was held in Manaus, Brazil, November 20-25, 2005.

Masters Theses in the Pure and Applied Sciences

Masters Theses in the Pure and Applied Sciences PDF Author: W. H. Shafer
Publisher: Springer
ISBN: 9780306409912
Category : Science
Languages : en
Pages : 297

Book Description
Masters Theses in the Pure and Applied Sciences was first conceived, published, and dis seminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the ac tivity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volume were handled by an international publishing. house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 25 (thesis year 1980) a total of 10,308 theses titles from 27 Canadian and 214 United States universities. We are sure that this broader base for theses titles reported will greatly enhance the value of this important annual reference work. While Volume 25 reports theses submitted in 1980, on occasion, certain universities do report theses submitted in previous years but not reported at the time.

Semiconductor-device Electronics

Semiconductor-device Electronics PDF Author: R. M. Warner
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 968

Book Description
This clear, student-oriented text is for upper-level or graduate courses covering basic semiconductor physics, physical descriptions of PN-junction diodes, bipolar junction transistors, and MOS Field-effect transistors. The organization is from specific to more general topics with a foundations chapter that reviews critical concepts such as Poisson's Equation, dielectric relaxation, and displacement current. The text progresses toward detailed and often unique coverage: including SPICE modeling of the junction diode, the BJT and MOSFET, ohmic-contact application of the high-low junction, and MOS-capacitance crossover.