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Author: Vasilis F. Pavlidis Publisher: Newnes ISBN: 0124104843 Category : Technology & Engineering Languages : en Pages : 770
Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author: Vasilis F. Pavlidis Publisher: Newnes ISBN: 0124104843 Category : Technology & Engineering Languages : en Pages : 770
Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author: Publisher: IEEE Computer Society Press ISBN: 9780769515618 Category : Computers Languages : en Pages : 584
Book Description
Annotation Fifty-one papers and 21 posters from the March 2002 symposium report current research in deep submicron integrated circuit design and development. The sessions address interconnect extraction and modeling, design for process variations, metrics, power and noise management, verification, signal integrity, and low power design techniques. Some of the topics are transition aware global signaling (TAGS), the interoperability of EDA tools for sequential logic synthesis, statistical methods for the determination of process corners, power supply noise suppression via clock skew scheduling, and the relation between SAT and BDDs for equivalence checking. No subject index. Annotation copyrighted by Book News Inc., Portland, OR.
Author: O. Kovras Publisher: Nova Publishers ISBN: 9781594549335 Category : Science Languages : en Pages : 248
Book Description
Quantum field theory was invented to deal simultaneously with special relativity and quantum mechanics, the two greatest discoveries of early twentieth-century physics, but it has become increasingly important to many areas of physics including quantum hall physics, surface growth, string theory, D-branes and quantum gravity as well as condensed-matter and high-energy applications and particle-physics. This book presents leading-edge research from throughout the world.
Author: Lijie Grace Zhang Publisher: Academic Press ISBN: 0128245530 Category : Science Languages : en Pages : 563
Book Description
3D Bioprinting and Nanotechnology in Tissue Engineering and Regenerative Medicine, Second Edition provides an in-depth introduction to bioprinting and nanotechnology and their industrial applications. Sections cover 4D Printing Smart Multi-responsive Structure, Cells for Bioprinting, 4D Printing Biomaterials, 3D/4D printing functional biomedical devices, 3D Printing for Cardiac and Heart Regeneration, Integrating 3D printing with Ultrasound for Musculoskeletal Regeneration, 3D Printing for Liver Regeneration, 3D Printing for Cancer Studies, 4D Printing Soft Bio-robots, Clinical Translation and Future Directions. The book's team of expert contributors have pooled their expertise in order to provide a summary of the suitability, sustainability and limitations of each technique for each specific application. The increasing availability and decreasing costs of nanotechnologies and 3D printing technologies are driving their use to meet medical needs. This book provides an overview of these technologies and their integration. - Includes clinical applications, regulatory hurdles, and a risk-benefit analysis of each technology - Assists readers in selecting the best materials and how to identify the right parameters for printing - Includes the advantages of integrating 3D printing and nanotechnology in order to improve the safety of nano-scale materials for biomedical applications
Author: Tim-Oliver Husser Publisher: Universitätsverlag Göttingen ISBN: 3863950925 Category : Languages : en Pages : 194
Book Description
Globular clusters are gravitationally bound collections of hundreds of thousands of stars that are almost as old as the Universe itself. Although they have been studied for hundreds of years, their formation and evolution is not yet fully understood. We want to fi nd answers to some of the major questions by investing a large amount of observing time with MUSE, the upcoming 2nd generation instrument for ESOś Very Large Telescope. In this thesis I discuss the current state of research on globular clusters as well as the possibilities of this new instrument. Numerical methods for the analysis of MUSE data are presented, including a comprehensive library of synthetic spectra that has been created just for this purpose. The application of these methods to both synthetic and real data is discussed with particular emphasis on a "dry run" that has been conducted for MUSE. Finally, a potential program for the observation of globular clusters is presented.
Author: Vasilis F. Pavlidis
Author: Vasilis F. Pavlidis
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Author: 
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Author: Library of Congress. Copyright Office
Author: O. Kovras
Author: 
Author: Lijie Grace Zhang
Author: Library of Congress
Author: Tim-Oliver Husser