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Author: Wilfried Sauer Publisher: Springer Science & Business Media ISBN: 184628354X Category : Technology & Engineering Languages : en Pages : 493
Book Description
This book provides a systemized presentation of new techniques and methods in electronics manufacture. It helps the reader reduce the cost and increase the reliability of electronic products by employing up-to-date technology. It also details the latest ideas for reducing the scale of electronic components and products to the nano-scale by organizing all the elements of the complicated modern electronics manufacturing process showing how they affect each other.
Author: Wilfried Sauer Publisher: Springer Science & Business Media ISBN: 184628354X Category : Technology & Engineering Languages : en Pages : 493
Book Description
This book provides a systemized presentation of new techniques and methods in electronics manufacture. It helps the reader reduce the cost and increase the reliability of electronic products by employing up-to-date technology. It also details the latest ideas for reducing the scale of electronic components and products to the nano-scale by organizing all the elements of the complicated modern electronics manufacturing process showing how they affect each other.
Author: Tadahiro Ohmi Publisher: CRC Press ISBN: 1420026860 Category : Science Languages : en Pages : 402
Book Description
As science pushes closer toward the atomic size scale, new challenges arise to slow the pace of the miniaturization that has transformed our society and fueled the information age. New technologies are necessary to surpass these obstacles and realize the tremendous growth predicted by Moore's law. Assembled from the works of pioneering researchers, Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing presents new developments and technologies for producing the next generation of electronic circuits and displays. This book introduces radical-reaction-based semiconductor manufacturing technologies that overcome the limitations of the existing molecule-reaction-based technologies. It systematically details the procedures and underlying concepts involved in wet process technologies and applications. Following an introduction to semiconductor surface chemical electronics, expert contributors discuss the principles and technology of high-performance wet cleaning; etching technologies and processes; antistatic technology; wet vapor resist stripping technology; and process and safety technologies including waste reclamation, chemical composition control, and ultrapure water and liquid chemical supply systems and materials for fluctuation-free facilities. Currently, large production runs are needed to balance the costs of acquiring and tuning equipment for specialized operating conditions. Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing explains the technologies and processes used to meet the demand for variety and low volumes that exists in today's digital electronics marketplace.
Author: Luciano Lavagno Publisher: CRC Press ISBN: 1420007955 Category : Technology & Engineering Languages : en Pages : 608
Book Description
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
Author: Carl-Mikael Zetterling Publisher: IET ISBN: 9780852969984 Category : Technology & Engineering Languages : en Pages : 202
Book Description
This book explains why SiC is so useful in electronics, gives clear guidance on the various processing steps (growth, doping, etching, contact formation, dielectrics etc) and describes how these are integrated in device manufacture.
Author: Haleh Ardebili Publisher: William Andrew ISBN: 0128119799 Category : Technology & Engineering Languages : en Pages : 510
Book Description
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them
Author: Chuan Seng Tan Publisher: Springer Science & Business Media ISBN: 0387765344 Category : Technology & Engineering Languages : en Pages : 365
Book Description
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Author: Jens Lienig Publisher: Springer Nature ISBN: 3030392848 Category : Technology & Engineering Languages : en Pages : 319
Book Description
This book covers the fundamental knowledge of layout design from the ground up, addressing both physical design, as generally applied to digital circuits, and analog layout. Such knowledge provides the critical awareness and insights a layout designer must possess to convert a structural description produced during circuit design into the physical layout used for IC/PCB fabrication. The book introduces the technological know-how to transform silicon into functional devices, to understand the technology for which a layout is targeted (Chap. 2). Using this core technology knowledge as the foundation, subsequent chapters delve deeper into specific constraints and aspects of physical design, such as interfaces, design rules and libraries (Chap. 3), design flows and models (Chap. 4), design steps (Chap. 5), analog design specifics (Chap. 6), and finally reliability measures (Chap. 7). Besides serving as a textbook for engineering students, this book is a foundational reference for today’s circuit designers. For Slides and Other Information: https://www.ifte.de/books/pd/index.html
Author: Luciano Lavagno Publisher: CRC Press ISBN: 1482254611 Category : Technology & Engineering Languages : en Pages : 798
Book Description
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Author: Thomas E. Kissell Publisher: ISBN: Category : Education Languages : en Pages : 936
Book Description
Based on the author's experience working with technicians directly on the factory floor in major industries, this handbook/reference coversallof the electronic technology found in modern industrial systems, going into the depth required to install, troubleshoot, and repaircomplexautomation systems. Each stand-alone (but cross-referenced) chapter explores either an entire system or individual circuits and components that are used over and over in a large variety of complex systems. Features a large number of figures, diagrams, and pictures, and typical “Job Assignment” s, with solutions.Advanced Solid State Logic: Flip-Flops, Shift Registers, Counters and Timers. Programmable Controllers. Solid-State Devices Used to Control Power: SCRs, TRIACs and Power Transistors. Solid-State Devices Used for Firing Circuits. Photoelectronics, Lasers and Fiber Optics. Industrial Power Supplies, Inverters and Converters. Operational Amplifiers. Open-Loop and Closed-Loop Feedback Systems. Input Devices: Sensors, Transducers, and Transmitters for Measurement. Output Devices: Amplifiers, Valves, Relays, Variable-Frequency Drives, Stepper Motors and Servomotor Drives. AC and DC Motors and Generators, Transformers, and Three-Phase Electricity. Case Studies of Four Industrial Applications. Robots and Other Motion Control Systems. Motor-Control Devices and Circuits. Data Communications for Industrial Electronics.For Instrumentation and Process Control Technicians, PLC and Motion Control Technicians.
Author: Wilfried Sauer
Author: Wilfried Sauer
Author: Tadahiro Ohmi
Author: Luciano Lavagno
Author: Carl-Mikael Zetterling
Author: James J. Licari
Author: Haleh Ardebili
Author: Chuan Seng Tan
Author: Jens Lienig
Author: Luciano Lavagno
Author: Thomas E. Kissell