Author: John LauPublisher: McGraw Hill Professional
ISBN: 9780071386241
Category : Technology & Engineering
Languages : en
Pages : 710
Book Description
An engineer's guidebook demonstrating non-toxic electronics manufacturing processes
Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
Author: John LauPublisher: McGraw Hill Professional
ISBN: 9780071386241
Category : Technology & Engineering
Languages : en
Pages : 710
Book Description
An engineer's guidebook demonstrating non-toxic electronics manufacturing processes
Electronics Manufacturing
Author: C. P. WongPublisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 700
Book Description
Covering the cost; design; materials; process; equipment; manufacturing; and reliability issues; this comprehensive guide provides cutting edge information on lead-free; halogen-free; and conductive-adhesive technologies. --
Advanced Manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Author: Publisher: Emerald Group Publishing
ISBN: 184663010X
Category : Electronic packaging
Languages : en
Pages : 72
Book Description
This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.
Lead-Free Electronics
Author: Edwin BradleyPublisher: John Wiley & Sons
ISBN: 9780470171462
Category : Technology & Engineering
Languages : en
Pages : 472
Book Description
Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author: Ephraim SuhirPublisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471
Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Dielectric Films for Advanced Microelectronics
Author: Mikhail BaklanovPublisher: John Wiley & Sons
ISBN: 0470065419
Category : Technology & Engineering
Languages : en
Pages : 508
Book Description
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Innovations in Materials Manufacturing, Fabrication, and Environmental Safety
Author: Mel SchwartzPublisher: CRC Press
ISBN: 1420082167
Category : Technology & Engineering
Languages : en
Pages : 782
Book Description
When people make a call on a cellphone, drive a car, or turn on a computer, few truly appreciate the innovations in material selection, technology, and fabrication that were required to make it all possible. Innovations in Materials Manufacturing, Fabrication, and Environmental Safety explores expected developments in analysis, design, testing, and
Assembly and Reliability of Lead-Free Solder Joints
Author: John H. LauPublisher: Springer Nature
ISBN: 9811539200
Category : Technology & Engineering
Languages : en
Pages : 545
Book Description
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Lead-Free Solder Interconnect Reliability
Author: Dongkai ShangguanPublisher: ASM International
ISBN: 161503093X
Category : Technology & Engineering
Languages : en
Pages : 292
Book Description
Nano-Bio- Electronic, Photonic and MEMS Packaging
Author: C.P. WongPublisher: Springer Science & Business Media
ISBN: 1441900403
Category : Technology & Engineering
Languages : en
Pages : 761
Book Description
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.