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Author: Robert C. Sundahl Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 312
Book Description
The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.
Author: Robert C. Sundahl Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 312
Book Description
The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.
Author: Steven K. Groothuis Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 344
Book Description
While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.
Author: Stella W. Pang Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 616
Book Description
The fabrication of Si- and compound semiconductor-based devices involves a number of steps ranging from material growth to pattern definition by lithography, and ultimately, pattern transfer by etching/deposition. The key to device manufacturing, however, is reproducibility, low cost and high yield. Diagnostic techniques allow correlation between processing and actual device performance to be established. Researchers from universities, industry and government come together in this book to examine the advances in diagnostic techniques that provide critical information on structural, optical and electrical properties of semiconductor devices, as well as monitoring techniques for equipment/processes for control and feedback. The overriding goal is for rapid, accurate materials characterization, both in situ and ex situ. Topics include: in situ diagnostics; proximal probe microscopies; optical probes of devices and device properties; spectroscopic ellipsometry/structural diagnostics; and material analysis - X-ray techniques, strain measurements and passivation.
Author: D. B. Poker Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 940
Book Description
Several beam-solid interaction techniques have been developed that can either stand alone or be used in connection with others for materials processing, for fabrication of devices with enhanced electro-optical and mechanical properties, and with enhanced resistance to corrosion and erosion. For example, advances in focused ion beams (FIB) have brought out-of-reach ideas and applications to fruition. This book from MRS focuses on the developments in ion-beam-assisted processing of materials and reviews successful applications of the techniques. Topics include: fundamentals of ion-solid interactions; ion-beam mixing; radiation damage; insulators and wide bandgap materials; polymers; optical materials; plasma and ion-assisted techniques; metals and tribology; focused ion beams; fundamental semiconductor processing and compound semiconductors.
Author: Aloysius F. Hepp Publisher: ISBN: Category : Science Languages : en Pages : 512
Book Description
In years prior, there has been considerable research activity in an exciting class of materials - non-oxide covalent ceramics. These nitrides, carbides, sulfides and related materials have found a wide range of use, from electronics to aerospace/defense, optical sensors and devices, and mechanical/structural applications. In this book, the third in a continuing series, chemists, physicists, ceramists and materials scientists and engineers from around the world come together to share research and highlight recent advances in non-oxide materials. In contrast to its predecessors, the focus of the volume is less on production and fabrication, and more on applications and properties. Topics include: non-oxides for electronics and optoelectronics; preparation of bulk non-oxide ceramics; science of covalent ceramics - bonding, structure and microstructure; fabrication of covalent ceramic thin films; and technology of covalent ceramics - surfaces, composites and processing.
Author: Robert C. Sundahl
Author: Robert C. Sundahl
Author: Steven K. Groothuis
Author: 
Author: National Semiconductor Metrology Program (U.S.)
Author: Madhav Datta
Author: 
Author: National Institute of Standards and Technology (U.S.)
Author: Stella W. Pang
Author: D. B. Poker
Author: Aloysius F. Hepp