Author: Paul Chu
Publisher: BoD – Books on Demand
ISBN: 9533070862
Category : Technology & Engineering
Languages : en
Pages : 458
Book Description
This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields.
Advances in Solid State Circuit Technologies
Author: Paul Chu
Publisher: BoD – Books on Demand
ISBN: 9533070862
Category : Technology & Engineering
Languages : en
Pages : 458
Book Description
This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields.
Publisher: BoD – Books on Demand
ISBN: 9533070862
Category : Technology & Engineering
Languages : en
Pages : 458
Book Description
This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields.
A CMOS Self-Powered Front-End Architecture for Subcutaneous Event-Detector Devices
Author: Jordi Colomer-Farrarons
Publisher: Springer Science & Business Media
ISBN: 9400706863
Category : Technology & Engineering
Languages : en
Pages : 169
Book Description
A CMOS Self-Powered Front-End Architecture for Subcutaneous Event-Detector Devices presents the conception and prototype realization of a Self-Powered architecture for subcutaneous detector devices. The architecture is designed to work as a true/false (event detector) or threshold level alarm of some substances, ions, etc... that are detected through a three-electrodes amperometric BioSensor approach. The device is envisaged as a Low-Power subcutaneous implantable application powered by an inductive link, one emitter antenna at the external side of the skin and the receiver antenna under the skin. The sensor is controlled with a Potentiostat circuit and then, a post-processing unit detects the desired levels and activates the transmission via a backscattering method by the inductive link. All the instrumentation, except the power module, is implemented in the so called BioChip. Following the idea of the powering link to harvest energy of the magnetic induced link at the implanted device, a Multi-Harvesting Power Chip (MHPC) has been also designed.
Publisher: Springer Science & Business Media
ISBN: 9400706863
Category : Technology & Engineering
Languages : en
Pages : 169
Book Description
A CMOS Self-Powered Front-End Architecture for Subcutaneous Event-Detector Devices presents the conception and prototype realization of a Self-Powered architecture for subcutaneous detector devices. The architecture is designed to work as a true/false (event detector) or threshold level alarm of some substances, ions, etc... that are detected through a three-electrodes amperometric BioSensor approach. The device is envisaged as a Low-Power subcutaneous implantable application powered by an inductive link, one emitter antenna at the external side of the skin and the receiver antenna under the skin. The sensor is controlled with a Potentiostat circuit and then, a post-processing unit detects the desired levels and activates the transmission via a backscattering method by the inductive link. All the instrumentation, except the power module, is implemented in the so called BioChip. Following the idea of the powering link to harvest energy of the magnetic induced link at the implanted device, a Multi-Harvesting Power Chip (MHPC) has been also designed.
Highly Integrated Gate Drivers for Si and GaN Power Transistors
Author: Achim Seidel
Publisher: Springer Nature
ISBN: 3030689409
Category : Technology & Engineering
Languages : en
Pages : 137
Book Description
This book explores integrated gate drivers with emphasis on new gallium nitride (GaN) power transistors, which offer fast switching along with minimum switching losses. It serves as a comprehensive, all-in-one source for gate driver IC design, written in handbook style with systematic guidelines. The authors cover the full range from fundamentals to implementation details including topics like power stages, various kinds of gate drivers (resonant, non-resonant, current-source, voltage-source), gate drive schemes, driver supply, gate loop, gate driver power efficiency and comparison silicon versus GaN transistors. Solutions are presented on the system and circuit level for highly integrated gate drivers. Coverage includes miniaturization by higher integration of subfunctions onto the IC (buffer capacitors), as well as more efficient switching by a multi-level approach, which also improves robustness in case of extremely fast switching transitions. The discussion also includes a concept for robust operation in the highly relevant case that the gate driver is placed in distance to the power transistor. All results are widely applicable to achieve highly compact, energy efficient, and cost-effective power electronics solutions.
Publisher: Springer Nature
ISBN: 3030689409
Category : Technology & Engineering
Languages : en
Pages : 137
Book Description
This book explores integrated gate drivers with emphasis on new gallium nitride (GaN) power transistors, which offer fast switching along with minimum switching losses. It serves as a comprehensive, all-in-one source for gate driver IC design, written in handbook style with systematic guidelines. The authors cover the full range from fundamentals to implementation details including topics like power stages, various kinds of gate drivers (resonant, non-resonant, current-source, voltage-source), gate drive schemes, driver supply, gate loop, gate driver power efficiency and comparison silicon versus GaN transistors. Solutions are presented on the system and circuit level for highly integrated gate drivers. Coverage includes miniaturization by higher integration of subfunctions onto the IC (buffer capacitors), as well as more efficient switching by a multi-level approach, which also improves robustness in case of extremely fast switching transitions. The discussion also includes a concept for robust operation in the highly relevant case that the gate driver is placed in distance to the power transistor. All results are widely applicable to achieve highly compact, energy efficient, and cost-effective power electronics solutions.
Nanoscale Semiconductor Memories
Author: Santosh K. Kurinec
Publisher: CRC Press
ISBN: 1351832085
Category : Technology & Engineering
Languages : en
Pages : 450
Book Description
Nanoscale memories are used everywhere. From your iPhone to a supercomputer, every electronic device contains at least one such type. With coverage of current and prototypical technologies, Nanoscale Semiconductor Memories: Technology and Applications presents the latest research in the field of nanoscale memories technology in one place. It also covers a myriad of applications that nanoscale memories technology has enabled. The book begins with coverage of SRAM, addressing the design challenges as the technology scales, then provides design strategies to mitigate radiation induced upsets in SRAM. It discusses the current state-of-the-art DRAM technology and the need to develop high performance sense amplifier circuitry. The text then covers the novel concept of capacitorless 1T DRAM, termed as Advanced-RAM or A-RAM, and presents a discussion on quantum dot (QD) based flash memory. Building on this foundation, the coverage turns to STT-RAM, emphasizing scalable embedded STT-RAM, and the physics and engineering of magnetic domain wall "racetrack" memory. The book also discusses state-of-the-art modeling applied to phase change memory devices and includes an extensive review of RRAM, highlighting the physics of operation and analyzing different materials systems currently under investigation. The hunt is still on for universal memory that fits all the requirements of an "ideal memory" capable of high-density storage, low-power operation, unparalleled speed, high endurance, and low cost. Taking an interdisciplinary approach, this book bridges technological and application issues to provide the groundwork for developing custom designed memory systems.
Publisher: CRC Press
ISBN: 1351832085
Category : Technology & Engineering
Languages : en
Pages : 450
Book Description
Nanoscale memories are used everywhere. From your iPhone to a supercomputer, every electronic device contains at least one such type. With coverage of current and prototypical technologies, Nanoscale Semiconductor Memories: Technology and Applications presents the latest research in the field of nanoscale memories technology in one place. It also covers a myriad of applications that nanoscale memories technology has enabled. The book begins with coverage of SRAM, addressing the design challenges as the technology scales, then provides design strategies to mitigate radiation induced upsets in SRAM. It discusses the current state-of-the-art DRAM technology and the need to develop high performance sense amplifier circuitry. The text then covers the novel concept of capacitorless 1T DRAM, termed as Advanced-RAM or A-RAM, and presents a discussion on quantum dot (QD) based flash memory. Building on this foundation, the coverage turns to STT-RAM, emphasizing scalable embedded STT-RAM, and the physics and engineering of magnetic domain wall "racetrack" memory. The book also discusses state-of-the-art modeling applied to phase change memory devices and includes an extensive review of RRAM, highlighting the physics of operation and analyzing different materials systems currently under investigation. The hunt is still on for universal memory that fits all the requirements of an "ideal memory" capable of high-density storage, low-power operation, unparalleled speed, high endurance, and low cost. Taking an interdisciplinary approach, this book bridges technological and application issues to provide the groundwork for developing custom designed memory systems.
On-Chip Electro-Static Discharge (ESD) Protection for Radio-Frequency Integrated Circuits
Author: Qiang Cui
Publisher: Springer
ISBN: 3319108190
Category : Technology & Engineering
Languages : en
Pages : 99
Book Description
This book enables readers to design effective ESD protection solutions for all mainstream RF fabrication processes (GaAs pHEMT, SiGe HBT, CMOS). The new techniques introduced by the authors have much higher protection levels and much lower parasitic effects than those of existing ESD protection devices. The authors describe in detail the ESD phenomenon, as well as ESD protection fundamentals, standards, test equipment, and basic design strategies. Readers will benefit from realistic case studies of ESD protection for RFICs and will learn to increase significantly modern RFICs’ ESD safety level, while maximizing RF performance.
Publisher: Springer
ISBN: 3319108190
Category : Technology & Engineering
Languages : en
Pages : 99
Book Description
This book enables readers to design effective ESD protection solutions for all mainstream RF fabrication processes (GaAs pHEMT, SiGe HBT, CMOS). The new techniques introduced by the authors have much higher protection levels and much lower parasitic effects than those of existing ESD protection devices. The authors describe in detail the ESD phenomenon, as well as ESD protection fundamentals, standards, test equipment, and basic design strategies. Readers will benefit from realistic case studies of ESD protection for RFICs and will learn to increase significantly modern RFICs’ ESD safety level, while maximizing RF performance.
Millimeter Wave Wireless Communications
Author: Theodore S. Rappaport
Publisher: Pearson Education
ISBN: 0132172283
Category : Computers
Languages : en
Pages : 705
Book Description
The Definitive, Comprehensive Guide to Cutting-Edge Millimeter Wave Wireless Design “This is a great book on mmWave systems that covers many aspects of the technology targeted for beginners all the way to the advanced users. The authors are some of the most credible scholars I know of who are well respected by the industry. I highly recommend studying this book in detail.” —Ali Sadri, Ph.D., Sr. Director, Intel Corporation, MCG mmWave Standards and Advanced Technologies Millimeter wave (mmWave) is today's breakthrough frontier for emerging wireless mobile cellular networks, wireless local area networks, personal area networks, and vehicular communications. In the near future, mmWave products, systems, theories, and devices will come together to deliver mobile data rates thousands of times faster than today's existing cellular and WiFi networks. In Millimeter Wave Wireless Communications, four of the field's pioneers draw on their immense experience as researchers, entrepreneurs, inventors, and consultants, empowering engineers at all levels to succeed with mmWave. They deliver exceptionally clear and useful guidance for newcomers, as well as the first complete desk reference for design experts. The authors explain mmWave signal propagation, mmWave circuit design, antenna designs, communication theory, and current standards (including IEEE 802.15.3c, Wireless HD, and ECMA/WiMedia). They cover comprehensive mmWave wireless design issues, for 60 GHz and other mmWave bands, from channel to antenna to receiver, introducing emerging design techniques that will be invaluable for research engineers in both industry and academia. Topics include Fundamentals: communication theory, channel propagation, circuits, antennas, architectures, capabilities, and applications Digital communication: baseband signal/channel models, modulation, equalization, error control coding, multiple input multiple output (MIMO) principles, and hardware architectures Radio wave propagation characteristics: indoor and outdoor applications Antennas/antenna arrays, including on-chip and in-package antennas, fabrication, and packaging Analog circuit design: mmWave transistors, fabrication, and transceiver design approaches Baseband circuit design: multi–gigabit-per-second, high-fidelity DAC and ADC converters Physical layer: algorithmic choices, design considerations, and impairment solutions; and how to overcome clipping, quantization, and nonlinearity Higher-layer design: beam adaptation protocols, relaying, multimedia transmission, and multiband considerations 60 GHz standardization: IEEE 802.15.3c for WPAN, Wireless HD, ECMA-387, IEEE 802.11ad, Wireless Gigabit Alliance (WiGig)
Publisher: Pearson Education
ISBN: 0132172283
Category : Computers
Languages : en
Pages : 705
Book Description
The Definitive, Comprehensive Guide to Cutting-Edge Millimeter Wave Wireless Design “This is a great book on mmWave systems that covers many aspects of the technology targeted for beginners all the way to the advanced users. The authors are some of the most credible scholars I know of who are well respected by the industry. I highly recommend studying this book in detail.” —Ali Sadri, Ph.D., Sr. Director, Intel Corporation, MCG mmWave Standards and Advanced Technologies Millimeter wave (mmWave) is today's breakthrough frontier for emerging wireless mobile cellular networks, wireless local area networks, personal area networks, and vehicular communications. In the near future, mmWave products, systems, theories, and devices will come together to deliver mobile data rates thousands of times faster than today's existing cellular and WiFi networks. In Millimeter Wave Wireless Communications, four of the field's pioneers draw on their immense experience as researchers, entrepreneurs, inventors, and consultants, empowering engineers at all levels to succeed with mmWave. They deliver exceptionally clear and useful guidance for newcomers, as well as the first complete desk reference for design experts. The authors explain mmWave signal propagation, mmWave circuit design, antenna designs, communication theory, and current standards (including IEEE 802.15.3c, Wireless HD, and ECMA/WiMedia). They cover comprehensive mmWave wireless design issues, for 60 GHz and other mmWave bands, from channel to antenna to receiver, introducing emerging design techniques that will be invaluable for research engineers in both industry and academia. Topics include Fundamentals: communication theory, channel propagation, circuits, antennas, architectures, capabilities, and applications Digital communication: baseband signal/channel models, modulation, equalization, error control coding, multiple input multiple output (MIMO) principles, and hardware architectures Radio wave propagation characteristics: indoor and outdoor applications Antennas/antenna arrays, including on-chip and in-package antennas, fabrication, and packaging Analog circuit design: mmWave transistors, fabrication, and transceiver design approaches Baseband circuit design: multi–gigabit-per-second, high-fidelity DAC and ADC converters Physical layer: algorithmic choices, design considerations, and impairment solutions; and how to overcome clipping, quantization, and nonlinearity Higher-layer design: beam adaptation protocols, relaying, multimedia transmission, and multiband considerations 60 GHz standardization: IEEE 802.15.3c for WPAN, Wireless HD, ECMA-387, IEEE 802.11ad, Wireless Gigabit Alliance (WiGig)
Antenna Design for Mobile Devices
Author: Zhijun Zhang
Publisher: John Wiley & Sons
ISBN: 1119132355
Category : Technology & Engineering
Languages : en
Pages : 335
Book Description
Expanded and updated, this practical guide is a one-stop design reference containing all an engineer needs when designing antennas Integrates state-of-the-art technologies with a special section for step-by-step antenna design Features up-to-date bio-safety and electromagnetic compatibility regulation compliance and latest standards Newly updated with MIMO antenna design, measurements and requirements Accessible to readers of many levels, from introductory to specialist Written by a practicing expert who has hired and trained numerous engineers
Publisher: John Wiley & Sons
ISBN: 1119132355
Category : Technology & Engineering
Languages : en
Pages : 335
Book Description
Expanded and updated, this practical guide is a one-stop design reference containing all an engineer needs when designing antennas Integrates state-of-the-art technologies with a special section for step-by-step antenna design Features up-to-date bio-safety and electromagnetic compatibility regulation compliance and latest standards Newly updated with MIMO antenna design, measurements and requirements Accessible to readers of many levels, from introductory to specialist Written by a practicing expert who has hired and trained numerous engineers
Mechanical And Electronics Engineering - Proceedings Of The International Conference On Icmee 2009
Author: Venkatesh Mahadevan
Publisher: World Scientific
ISBN: 9814466298
Category : Technology & Engineering
Languages : en
Pages : 334
Book Description
The 2009 International Conference on Mechanical and Electronics Engineering (ICMEE 2009) will be held in Chennai, India from 24-26 July, 2009. The aim of ICMEE 2009 is to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research findings and development activities in mechanical and electronics engineering. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to forge new business or research relations and to find global partners for future collaboration.
Publisher: World Scientific
ISBN: 9814466298
Category : Technology & Engineering
Languages : en
Pages : 334
Book Description
The 2009 International Conference on Mechanical and Electronics Engineering (ICMEE 2009) will be held in Chennai, India from 24-26 July, 2009. The aim of ICMEE 2009 is to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research findings and development activities in mechanical and electronics engineering. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to forge new business or research relations and to find global partners for future collaboration.
Intelligent Technologies and Engineering Systems
Author: Jengnan Juang
Publisher: Springer Science & Business Media
ISBN: 1461467470
Category : Technology & Engineering
Languages : en
Pages : 1006
Book Description
This book concentrates on intelligent technologies as it relates to engineering systems. The book covers the following topics: networking, signal processing, artificial intelligence, control and software engineering, intelligent electronic circuits and systems, communications, and materials and mechanical engineering. The book is a collection of original papers that have been reviewed by technical editors. These papers were presented at the International Conference on Intelligent Technologies and Engineering Systems, held Dec. 13-15, 2012.
Publisher: Springer Science & Business Media
ISBN: 1461467470
Category : Technology & Engineering
Languages : en
Pages : 1006
Book Description
This book concentrates on intelligent technologies as it relates to engineering systems. The book covers the following topics: networking, signal processing, artificial intelligence, control and software engineering, intelligent electronic circuits and systems, communications, and materials and mechanical engineering. The book is a collection of original papers that have been reviewed by technical editors. These papers were presented at the International Conference on Intelligent Technologies and Engineering Systems, held Dec. 13-15, 2012.
System Simulation and Scientific Computing
Author: Tianyuan Xiao
Publisher: Springer
ISBN: 3642343813
Category : Computers
Languages : en
Pages : 480
Book Description
The Three-Volume-Set CCIS 323, 324, 325 (AsiaSim 2012) together with the Two-Volume-Set CCIS 326, 327 (ICSC 2012) constitutes the refereed proceedings of the Asia Simulation Conference, AsiaSim 2012, and the International Conference on System Simulation, ICSC 2012, held in Shanghai, China, in October 2012. The 267 revised full papers presented were carefully reviewed and selected from 906 submissions. The papers are organized in topical sections on modeling theory and technology; modeling and simulation technology on synthesized environment and virtual reality environment; pervasive computing and simulation technology; embedded computing and simulation technology; verification, validation and accreditation technology; networked modeling and simulation technology; modeling and simulation technology of continuous system, discrete system, hybrid system, and intelligent system; high performance computing and simulation technology; cloud simulation technology; modeling and simulation technology of complex system and open, complex, huge system; simulation based acquisition and virtual prototyping engineering technology; simulator; simulation language and intelligent simulation system; parallel and distributed software; CAD, CAE, CAM, CIMS, VP, VM, and VR; visualization; computing and simulation applications in science and engineering; computing and simulation applications in management, society and economics; computing and simulation applications in life and biomedical engineering; computing and simulation applications in energy and environment; computing and simulation applications in education; computing and simulation applications in military field; computing and simulation applications in medical field.
Publisher: Springer
ISBN: 3642343813
Category : Computers
Languages : en
Pages : 480
Book Description
The Three-Volume-Set CCIS 323, 324, 325 (AsiaSim 2012) together with the Two-Volume-Set CCIS 326, 327 (ICSC 2012) constitutes the refereed proceedings of the Asia Simulation Conference, AsiaSim 2012, and the International Conference on System Simulation, ICSC 2012, held in Shanghai, China, in October 2012. The 267 revised full papers presented were carefully reviewed and selected from 906 submissions. The papers are organized in topical sections on modeling theory and technology; modeling and simulation technology on synthesized environment and virtual reality environment; pervasive computing and simulation technology; embedded computing and simulation technology; verification, validation and accreditation technology; networked modeling and simulation technology; modeling and simulation technology of continuous system, discrete system, hybrid system, and intelligent system; high performance computing and simulation technology; cloud simulation technology; modeling and simulation technology of complex system and open, complex, huge system; simulation based acquisition and virtual prototyping engineering technology; simulator; simulation language and intelligent simulation system; parallel and distributed software; CAD, CAE, CAM, CIMS, VP, VM, and VR; visualization; computing and simulation applications in science and engineering; computing and simulation applications in management, society and economics; computing and simulation applications in life and biomedical engineering; computing and simulation applications in energy and environment; computing and simulation applications in education; computing and simulation applications in military field; computing and simulation applications in medical field.