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Author: Kazuo Kondo Publisher: The Electrochemical Society ISBN: Category : Copper plating Languages : en Pages : 422
Book Description
Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.
Author: Kazuo Kondo Publisher: The Electrochemical Society ISBN: Category : Copper plating Languages : en Pages : 422
Book Description
Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.
Author: Mehdi Khodaei Publisher: BoD – Books on Demand ISBN: 9535130137 Category : Science Languages : en Pages : 127
Book Description
Nowadays, nanomaterials are attracting huge attentions not only from a basic research point of view but also for their potential applications. Since finding the structure-property-processing relationships can open new windows in the application of materials, the material characterizations play a crucial role in the research and development of materials science. The increasing demand for energy with the necessity to find alternative renewable and sustainable energy sources leads to the rapid growth in attention to energy materials. In this book, the results of some outstanding researches on synchrotron-based characterization of nanostructured materials related to energy applications are presented.
Author: John O. Dukovic Publisher: The Electrochemical Society ISBN: 1566775868 Category : Science Languages : en Pages : 288
Book Description
The papers in this issue describe the latest advances in fundamental and practical aspects of electrochemical processes for fabrication of microelectronic devices and related structures. Topics range from plating to etching, chips to packages, mechanisms to models, through-silicon vias to nanotubes, tin to ruthenium, capping to cooling, porous gold to porous alumina, probe-card springs to solder balls, electroless deposition to CMP, TFT-LCDs to magnetic nanowires and beyond.
Author: Yosi Shacham-Diamand Publisher: Springer Science & Business Media ISBN: 0387958681 Category : Science Languages : en Pages : 545
Book Description
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Author: Kazuo Kondo Publisher: Springer Science & Business Media ISBN: 1461491762 Category : Science Languages : en Pages : 280
Book Description
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
Author: G. Oskam Publisher: The Electrochemical Society ISBN: 156677800X Category : Science Languages : en Pages : 234
Book Description
This symposium provided a forum for current work on the electrodeposition and characterization of functional coatings and nanostructures. Central issues include the control of size and architecture and the ample choices and demands of substrate and deposited materials. The focus materials of this symposium were semiconductors, oxides and composites with e.g. ceramic nanoparticles or nanotubes.
Author: Kazuo Kondo
Author: Kazuo Kondo
Author: Panayotis C. Andricacos
Author: Mehdi Khodaei
Author: Panayotis C. Andricacos
Author: Electrochemical Society. Meeting
Author: Electrochemical Society. Dielectric Science and Technology Division
Author: John O. Dukovic
Author: Yosi Shacham-Diamand
Author: Kazuo Kondo
Author: G. Oskam