Author: Publisher:
ISBN:
Category :
Languages : en
Pages : 80
Book Description
Dynamic Response Assessment for the MEMS Accelerometer Under Severe Shock Loads
Author: Dynamic Response Assessment for the Mems Accelerometer Under Severe Shock Loads
Author: National Aeronautics and Space Administration (NASA)Publisher: Createspace Independent Publishing Platform
ISBN: 9781720481201
Category :
Languages : en
Pages : 74
Book Description
NASA Goddard Space Flight Center (GSFC) has evaluated the dynamic response of a commercial-off-the-shelf (COTS) microelectromechanical systems (MEMS) device made by Analog Device, Inc. The device is designated as ADXL250 and is designed mainly for sensing dynamic acceleration. It is also used to measure the tilting angle of any system or component from its original level position. The device has been in commercial use (e.g., in automobile airbag deployment system as a dual-axial accelerometer and in the electronic game play-station as a tilting sensor) with success, but NASA needs an in-depth assessment of its performance under severe dynamic shock environments. It was realized while planning this evaluation task that two assessments would be beneficial to NASA's missions: (1) severe dynamic shock response under nominal thermal environments; and (2) general dynamic performance under cryogenic environments. The first evaluation aims at obtaining a good understanding of its micromachined structure within a framework of brittle fracture dynamics, while the second evaluation focuses on the structure integrity under cryogenic temperature conditions. The information we gathered from the manufacturer indicated that the environmental stresses under NASA's evaluation program have been far beyond what the device has experienced with commercial applications, for which the device was designed. Thus NASA needs the outcome of this evaluation in order to make the selection for possible use for its missions. This paper provides details of the first evaluation the dynamic response under severe multi-axial single-pulse shock load. It was performed using finite element tools with nonlinear dynamics procedures.Fan, Mark S. and Shaw, Harry C.Goddard Space Flight CenterACCELEROMETERS; COMMERCIAL OFF-THE-SHELF PRODUCTS; DYNAMIC RESPONSE; MICROELECTROMECHANICAL SYSTEMS; FINITE ELEMENT METHOD; ATTITUDE (INCLINATION); SHOCK LOADS; COMPUTERIZED SIMULATION
Dynamic Response Assessment for the MEMS Accelerometer Under Severe Shock Loads
Author: Mark S. FanPublisher:
ISBN:
Category : Accelerometers
Languages : en
Pages : 78
Book Description
NASA Technical Paper
Author: United States. National Aeronautics and Space AdministrationPublisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 80
Book Description
NASA Technical Paper
Author: MEMS Linear and Nonlinear Statics and Dynamics
Author: Mohammad I. YounisPublisher: Springer Science & Business Media
ISBN: 1441960201
Category : Technology & Engineering
Languages : en
Pages : 463
Book Description
MEMS Linear and Nonlinear Statics and Dynamics presents the necessary analytical and computational tools for MEMS designers to model and simulate most known MEMS devices, structures, and phenomena. This book also provides an in-depth analysis and treatment of the most common static and dynamic phenomena in MEMS that are encountered by engineers. Coverage also includes nonlinear modeling approaches to modeling various MEMS phenomena of a nonlinear nature, such as those due to electrostatic forces, squeeze-film damping, and large deflection of structures. The book also: Includes examples of numerous MEMS devices and structures that require static or dynamic modeling Provides code for programs in Matlab, Mathematica, and ANSYS for simulating the behavior of MEMS structures Provides real world problems related to the dynamics of MEMS such as dynamics of electrostatically actuated devices, stiction and adhesion of microbeams due to electrostatic and capillary forces MEMS Linear and Nonlinear Statics and Dynamics is an ideal volume for researchers and engineers working in MEMS design and fabrication.
Mems Packaging
Author: Yung-cheng LeePublisher: World Scientific
ISBN: 9813229373
Category : Technology & Engineering
Languages : en
Pages : 363
Book Description
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Proceedings of the ASME Applied Mechanics Division
Author: Shock Margin Testing of a One-axis MEMS Accelerometer
Author: Publisher:
ISBN:
Category :
Languages : en
Pages : 25
Book Description
Shock testing was performed on a selected commercial-off-the-shelf - MicroElectroMechanical System (COTS-MEMS) accelerometer to determine the margin between the published absolute maximum rating for shock and the 'measured' level where failures are observed. The purpose of this testing is to provide baseline data for isolating failure mechanisms under shock and environmental loading in a representative device used or under consideration for use within systems and assemblies of the DOD/DOE weapons complex. The specific device chosen for this study was the AD22280 model of the ADXL78 MEMS Accelerometer manufactured by Analog Devices Inc. This study focuses only on the shock loading response of the device and provides the necessary data for adding influence of environmental exposure to the reliability of this class of devices. The published absolute maximum rating for acceleration in any axis was 4000 G for this device powered or unpowered. Results from this study showed first failures at 8000 G indicating a margin of error of two. Higher shock level testing indicated that an in-plane, but off-axis acceleration was more damaging than one in the sense direction.
Author: