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Author: R.A. Powell Publisher: Elsevier ISBN: 0080983588 Category : Technology & Engineering Languages : en Pages : 312
Book Description
This volume collects together for the first time a series of in-depth, critical reviews of important topics in dry etching, such as dry processing of III-V compound semiconductors, dry etching of refractory metal silicides and dry etching aluminium and aluminium alloys. This topical format provides the reader with more specialised information and references than found in a general review article. In addition, it presents a broad perspective which would otherwise have to be gained by reading a large number of individual research papers. An additional important and unique feature of this book is the inclusion of an extensive literature review of dry processing, compiled by search of computerized data bases. A subject index allows ready access to the key points raised in each of the chapters.
Author: R.A. Powell Publisher: Elsevier ISBN: 0080983588 Category : Technology & Engineering Languages : en Pages : 312
Book Description
This volume collects together for the first time a series of in-depth, critical reviews of important topics in dry etching, such as dry processing of III-V compound semiconductors, dry etching of refractory metal silicides and dry etching aluminium and aluminium alloys. This topical format provides the reader with more specialised information and references than found in a general review article. In addition, it presents a broad perspective which would otherwise have to be gained by reading a large number of individual research papers. An additional important and unique feature of this book is the inclusion of an extensive literature review of dry processing, compiled by search of computerized data bases. A subject index allows ready access to the key points raised in each of the chapters.
Author: Kazuo Nojiri Publisher: Springer ISBN: 3319102958 Category : Technology & Engineering Languages : en Pages : 126
Book Description
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.
Author: Kung Linliu Publisher: Independently Published ISBN: Category : Languages : en Pages : 57
Book Description
Semiconductor market value of 2018 was around 468.8 billion US dollars. It is increased for about 13.7% than year 2017. For 2019, it is estimated decrease about 10% to 13% which is 422 to 408 billion US dollars.This market is in a way winner takes all, for example, TSMC (Taiwan Semiconductor Manufacturing Company) which is the world leading semiconductor foundry company has more than 50% market share. Intel has more than 90% market share of personal computer CPU (Central Process Unit) for many years. However, the semiconductor IC process technology sometimes might change the rule of market. Just recently, AMD (Advanced Micro Devices, Inc.) has more than 17% market share of personal computer CPU because they use foundry of TSMC with 7nm EUV technology node (Extreme Ultraviolet, its wavelength is 13.5 nm, shorter wavelength has better critical dimension (CD) resolution for IC process).For the present time, there are four leading semiconductor companies in the world with EUV technology process node which are as follows: (1)Samsung: the world leading semiconductor IC process company for commodity IC such as DRAM、Flash memory and IC for cell phone. The world leading company in cell phone market share, Samsung has highest volume unit of mobile phone which is 75.1 million unit representing 23% of world market share. Samsung also is the leading company in OLED (organic light emitting diode) process technology and display panel which is more than 90% of world market share.(2)Intel: is the world leading company in personal computer CPU which has more than 90% market share of personal computer CPU (Central Process Unit) for many years. Intel is actually a world leading semiconductor IC technology in DRAM (many years ago) and Flash (at the present time) memory.(3)TSMC: TSMC is brief of Taiwan Semiconductor Manufacturing Company which is the world leading semiconductor foundry company has more than 50% market share. The author worked there for a few years as an R & D manager many years ago.(4)Micron: a world leading in DRAM and Flash memory IC.
Author: A.J. van Roosmalen Publisher: Springer Science & Business Media ISBN: 148992566X Category : Science Languages : en Pages : 247
Book Description
This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.
Author: Basudeb Saha Publisher: Walter de Gruyter GmbH & Co KG ISBN: 3110390124 Category : Technology & Engineering Languages : en Pages : 399
Book Description
Catalytic Reactors presents several key aspects of reactor design in Chemical and Process Engineering. Starting with the fundamental science across a broad interdisciplinary field, this graduate level textbook offers a concise overview on reactor and process design for students, scientists and practitioners new to the field. This book aims to collate into a comprehensive and well-informed work of leading researchers from north America, western Europe and south-east Asia. The editor and international experts discuss state-of-the-art applications of multifunctional reactors, biocatalytic membrane reactors, micro-flow reactors, industrial catalytic reactors, micro trickle bed reactors and multiphase catalytic reactors. The use of catalytic reactor technology is essential for the economic viability of the chemical manufacturing industry. The importance of Chemical and Process Engineering and efficient design of reactors are another focus of the book. Especially the combination of advantages from both catalysis and chemical reaction technology for optimization and intensification as essential factors in the future development of reactors and processes are discussed. Furthermore, options that can drastically influence reaction processes, e.g. choice of catalysts, alternative reaction pathways, mass and heat transfer effects, flow regimes and inherent design of catalytic reactors are reviewed in detail. Focuses on the state-of-the-art applications of catalytic reactors and optimization in the design and operation of industrial catalytic reactors Insights into transfer of knowledge from laboratory science to industry For students and researchers in Chemical and Mechanical Engineering, Chemistry, Industrial Catalysis and practising Engineers
Author: Stephen J. Pearton Publisher: CRC Press ISBN: 1000448428 Category : Science Languages : en Pages : 556
Book Description
Presents views on current developments in heat and mass transfer research related to the modern development of heat exchangers. Devotes special attention to the different modes of heat and mass transfer mechanisms in relation to the new development of heat exchangers design. Dedicates particular attention to the future needs and demands for further development in heat and mass transfer. GaN and related materials are attracting tremendous interest for their applications to high-density optical data storage, blue/green diode lasers and LEDs, high-temperature electronics for high-power microwave applications, electronics for aerospace and automobiles, and stable passivation films for semiconductors. In addition, there is great scientific interest in the nitrides, because they appear to form the first semiconductor system in which extended defects do not severely affect the optical properties of devices. This series provides a forum for the latest research in this rapidly-changing field, offering readers a basic understanding of new developments in recent research. Series volumes feature a balance between original theoretical and experimental research in basic physics, device physics, novel materials and quantum structures, processing, and systems.
Author: Dongqing Li Publisher: Springer Science & Business Media ISBN: 0387324682 Category : Technology & Engineering Languages : en Pages : 2242
Book Description
Covering all aspects of transport phenomena on the nano- and micro-scale, this encyclopedia features over 750 entries in three alphabetically-arranged volumes including the most up-to-date research, insights, and applied techniques across all areas. Coverage includes electrical double-layers, optofluidics, DNC lab-on-a-chip, nanosensors, and more.
Author: R.J. Shul Publisher: Springer Science & Business Media ISBN: 9783540667728 Category : Science Languages : en Pages : 664
Book Description
This volume covers the topic of advanced plasma processing techniques, from the fundamental physics of plasmas to diagnostics, modeling and applications such as etching and deposition for microelectronics. The use of plasmas for patterning on a submicron scale has enabled successive generations of continually smaller transistors, lasers, micromachines, sensors and magnetic read/write heads that have formed the basis of our information age. This volume is the first to give coverage to this broad area of topics in a detailed fashion, especially in the rapidly expanding fields of micro-mechanical machines, photomask fabrication, magnetic data storage and reactor modeling. It provides the reader with a broad array of topics, authored by the leading experts in the field.
Author: Michael A. Lieberman Publisher: John Wiley & Sons ISBN: 0471724246 Category : Science Languages : en Pages : 795
Book Description
A Thorough Update of the Industry Classic on Principles of Plasma Processing The first edition of Principles of Plasma Discharges and Materials Processing, published over a decade ago, was lauded for its complete treatment of both basic plasma physics and industrial plasma processing, quickly becoming the primary reference for students and professionals. The Second Edition has been carefully updated and revised to reflect recent developments in the field and to further clarify the presentation of basic principles. Along with in-depth coverage of the fundamentals of plasma physics and chemistry, the authors apply basic theory to plasma discharges, including calculations of plasma parameters and the scaling of plasma parameters with control parameters. New and expanded topics include: * Updated cross sections * Diffusion and diffusion solutions * Generalized Bohm criteria * Expanded treatment of dc sheaths * Langmuir probes in time-varying fields * Electronegative discharges * Pulsed power discharges * Dual frequency discharges * High-density rf sheaths and ion energy distributions * Hysteresis and instabilities * Helicon discharges * Hollow cathode discharges * Ionized physical vapor deposition * Differential substrate charging With new chapters on dusty plasmas and the kinetic theory of discharges, graduate students and researchers in the field of plasma processing should find this new edition more valuable than ever.
Author: Irving P. Herman Publisher: Elsevier ISBN: 0080538088 Category : Technology & Engineering Languages : en Pages : 815
Book Description
This volume describes the increasing role of in situ optical diagnostics in thin film processing for applications ranging from fundamental science studies to process development to control during manufacturing. The key advantage of optical diagnostics in these applications is that they are usually noninvasive and nonintrusive. Optical probes of the surface, film, wafer, and gas above the wafer are described for many processes, including plasma etching, MBE, MOCVD, and rapid thermal processing. For each optical technique, the underlying principles are presented, modes of experimental implementation are described, and applications of the diagnostic in thin film processing are analyzed, with examples drawn from microelectronics and optoelectronics. Special attention is paid to real-time probing of the surface, to the noninvasive measurement of temperature, and to the use of optical probes for process control. Optical Diagnostics for Thin Film Processing is unique. No other volume explores the real-time application of optical techniques in all modes of thin film processing. The text can be used by students and those new to the topic as an introduction and review of the subject. It also serves as a comprehensive resource for engineers, technicians, researchers, and scientists already working in the field. - The only volume that comprehensively explores in situ, real-time, optical probes for all types of thin film processing - Useful as an introduction to the subject or as a resource handbook - Covers a wide range of thin film processes including plasma etching, MBE, MOCVD, and rapid thermal processing - Examples emphasize applications in microelectronics and optoelectronics - Introductory chapter serves as a guide to all optical diagnostics and their applications - Each chapter presents the underlying principles, experimental implementation, and applications for a specific optical diagnostic
Author: R.A. Powell
Author: R.A. Powell
Author: Kazuo Nojiri
Author: Kung Linliu
Author: A.J. van Roosmalen
Author: Basudeb Saha
Author: Stephen J. Pearton
Author: Dongqing Li
Author: R.J. Shul
Author: Michael A. Lieberman
Author: Irving P. Herman