Diffusion and Defect Data Vol. 16 PDF Download

Author: Fred H. Wohlbier
Publisher: Trans Tech Publications Ltd
ISBN: 3035708193
Category : Technology & Engineering
Languages : en
Pages : 273

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Defect and Diffusion Forum Vol. 16

Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :

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Author:
Publisher:
ISBN:
Category : Crystals
Languages : en
Pages : 484

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Book Description

Author: Fred H. Wohlbier
Publisher: Trans Tech Publications Ltd
ISBN: 3035708282
Category : Technology & Engineering
Languages : en
Pages : 189

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Nonmetals

Author: Yu R. Kolobov
Publisher: Cambridge Int Science Publishing
ISBN: 1904602177
Category : Technology & Engineering
Languages : en
Pages : 247

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Book Description
The authors examine the main relationships of the process of grain boundary diffusion in bicrystals, coarse-grained polycrystals and nanostructured materials. The results of investigations of diffusion-related processes of recovery, recystallisation and development of plastic deformation in creep, static and cyclic loading in bulk nanostructured materials produced by high-intensity plastic deformation are presented.

Author: Heinrich Behrens
Publisher:
ISBN:
Category : Chemistry, Physical and theoretical
Languages : en
Pages : 650

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Author: A. G. Milnes
Publisher: Springer Science & Business Media
ISBN: 9401170215
Category : Science
Languages : en
Pages : 1014

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For some time there has been a need for a semiconductor device book that carries diode and transistor theory beyond an introductory level and yet has space to touch on a wider range of semiconductor device principles and applica tions. Such topics are covered in specialized monographs numbering many hun dreds, but the voluminous nature of this literature limits access for students. This book is the outcome of attempts to develop a broad course on devices and integrated electronics for university students at about senior-year level. The edu cational prerequisites are an introductory course in semiconductor junction and transistor concepts, and a course on analog and digital circuits that has intro duced the concepts of rectification, amplification, oscillators, modulation and logic and SWitching circuits. The book should also be of value to professional engineers and physicists because of both, the information included and the de tailed guide to the literature given by the references. The aim has been to bring some measure of order into the subject area examined and to provide a basic structure from which teachers may develop themes that are of most interest to students and themselves. Semiconductor devices and integrated circuits are reviewed and fundamental factors that control power levels, frequency, speed, size and cost are discussed. The text also briefly mentions how devices are used and presents circuits and comments on representative applications. Thus, the book seeks a balance be tween the extremes of device physics and circuit design.

Author: ERDA Library
Publisher:
ISBN:
Category : Power resources
Languages : en
Pages : 228

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Author: Takao Abe
Publisher: The Electrochemical Society
ISBN: 9781566772235
Category : Science
Languages : en
Pages : 548

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Author: Chr. Boller
Publisher: Elsevier
ISBN: 1483193209
Category : Technology & Engineering
Languages : en
Pages : 172

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Book Description
Materials Data for Cyclic Loading, Part D: Aluminium and Titanium Alloys presents materials data for cyclic loading which provide the basis for materials assessment by direct comparison of data or characteristic values and for estimating the crack initiation lives of aluminum and titanium alloys under constant and variable amplitude loading. The data include stress-strain curves, strain life curves, and mean stress parameter life curves for cyclic loading. Each data sheet takes up a maximum of four pages. The first page gives a description of the material and testing procedure. The chemical composition is always given in weight percent and corresponds to the values given in the literature referred to. The second and third pages show the diagrams for: stress-strain curves for monotonic and cyclic loading; strain life curve;, and mean stress (damage) parameter life curve according to the parameter of Smith, Watson and Topper. Unless indicated otherwise in the plots, the experiments were carried out at room temperature in laboratory air. The diagrams for the stress-strain relationships contain at the most three curves, one for monotonic loading and two for cyclic loading, the latter being evaluated from incremental step tests and constant amplitude tests. All three curves can be described approximately by an analytical function. This book will be of interest to materials scientists.