Development of Liquid Crystalline Polymer (LCP) Surface Mount Packages for Ka-band Applications PDF Download

Author: Kunia Aihara
Publisher:
ISBN:
Category :
Languages : en
Pages : 304

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Author: Mark Patrick McGrath
Publisher:
ISBN:
Category :
Languages : en
Pages : 226

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Author: Cheng Chen
Publisher:
ISBN: 9781267238436
Category :
Languages : en
Pages :

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Book Description
This research project presents the design and development of a high frequency surface mount package (SMT) for high power microwave/millimeter-wave applications using liquid crystalline polymer (LCP). As microwave frequencies, the demand for greater power output is rapidly increasing due to many RF system requirements such as higher data rate, larger cell base station coverage. A package with GaAs 4-Watt amplifier is demonstrated to be able to handle ~10 Watt DC power dissipation. Two methods are used to measure the package thermal resistances. Both temperature results are below the allowable 150°C maximum temperature. The electrical feed-through of the package provides signal path traveling from the device to the printed circuit board (PCB) has been demonstrated individually and using commercial product. At Ka-band feed-through of the package show theoretical insertion loss of less than -0.5dB and actual measurement of -1.5dB. Return loss is less than -10dB all the way up to 46GHz. The sparse via experiment indicates that with 24.4% via number reduction, thermal and electrical results still remain acceptable. Lastly, to utilize the package spacing, two types of class-A amplifiers are designed and measured using the proposed LCP package. The single transistor amplifier has smaller size as it is only consist of the input and output matching networks. The measured and simulation small-signal gain only has 0.27dB difference while the power output differs by 1.01dB.

Author: Anh-Vu H. Pham
Publisher: Cambridge University Press
ISBN: 1107377986
Category : Technology & Engineering
Languages : en
Pages : 269

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A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.

Author: Anyong Qing
Publisher: Springer Nature
ISBN: 9819989132
Category :
Languages : en
Pages : 283

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Author: Shadia Ikhmayies
Publisher: Springer
ISBN: 3319513826
Category : Technology & Engineering
Languages : en
Pages : 839

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This collection gives broad and up-to-date results in the research and development of materials characterization and processing. Coverage is well-rounded from minerals, metals, and materials characterization and developments in extraction to the fabrication and performance of materials. In addition, topics as varied as structural steels to electronic materials to plant-based composites are explored. The latest research presented in this wide area make this book both timely and relevant to the materials science field as a whole. The book explores scientific processes to characterize materials using modern technologies, and focuses on the interrelationships and interdependence among processing, structure, properties, and performance of materials. Topics covered include ferrous materials, non-ferrous materials, minerals, ceramics, clays, soft materials, method development, processing, corrosion, welding, solidification, composites, extraction, powders, nanomaterials, advanced materials, and several others.

Author: Ken Kuang
Publisher: Springer Science & Business Media
ISBN: 1441909842
Category : Technology & Engineering
Languages : en
Pages : 295

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Author: Tae Mok Gwon
Publisher: Springer
ISBN: 9811304726
Category : Technology & Engineering
Languages : en
Pages : 107

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This book describes the design, fabrication and evaluation of a polymer-based neural interface for a cochlear electrode array, reviewed in terms of fabrication process, functionality, and reliability. Polymer-based devices have attracted attention in the neural prosthetic field due to their flexibility and compatibility with micro-fabrication process. A liquid crystal polymer (LCP) is an inert, highly water-resistant polymer suitable for the encapsulation of electronic components and as a substrate material for fabricating neural interfaces. The author has designed, fabricated, and evaluated an LCP-based cochlear electrode array for an improved polymer-based cochlear implant. The thesis deals with 3 key topics: atraumatic deep insertion, tripolar stimulation, and long-term reliability. Atraumatic insertion of the intracochlear electrode and resulting preservation of residual hearing have become essential in state–of-the-art cochlear implantation. A novel tapered design of an LCP-based cochlear electrode array is presented to meet such goals. For high-density and pitch-recognizable cochlear implant, channel interaction should be avoided. Local tripolar stimulation using multi-layered electrode sites are shown to achieve highly focused electrical stimulation. This thesis addresses another vital issue in the polymer-based neural implants: the long-term reliability issue. After suggesting a new method of forming mechanical interlocking to improve polymer-metal adhesion, the author performs accelerating aging tests to verify the method’s efficacy. The aforementioned three topics have been thoroughly examined through various in vitro and in vivo studies. Verification foresees the development of LCP-based cochlear electrode array for an atraumatic deep insertion, advanced stimulation, and long-term clinical implant.

Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 047099617X
Category : Technology & Engineering
Languages : en
Pages : 866

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Book Description
This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging

Author: Guo'an Wang
Publisher: Artech House
ISBN: 1608071995
Category : Technology & Engineering
Languages : en
Pages : 306

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Book Description
Focusing on novel materials and techniques, this pioneering volume provides you with a solid understanding of the design and fabrication of smart RF passive components. You find comprehensive details on LCP, metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives. Supported with over 145 illustrations, this forward-looking resource summarizes the growing trend of smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications.