Development of Laser Ultrasonic and Interferometric Inspection System for High-volume On-line Inspection of Microelectronic Devices PDF Download
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Author: Abel Valdes Publisher: ISBN: Category : Laser interferometers Languages : en Pages :
Book Description
The objectives of this thesis are to develop and validate laser ultrasonic inspection methods for on-line testing of microelectronic devices. Electronic packaging technologies such as flip chips and BGAs utilize solder bumps as electrical and mechanical connections. Since they are located hidden from view between the device and the substrate, defects such as cracks, voids, misalignments, and missing bumps are difficult to detect using non-destructive methods. Laser ultrasonic inspection is capable of detecting such defects by utilizing a high power laser pulse to induce vibrations in a microelectronic device while measuring the out of plane displacement using an interferometer. Quality can then be assessed by comparing the vibration response of a known-good device to the response of the sample under inspection. The main limitation with the implementation of laser ultrasonic inspection in manufacturing applications is the requirement to establish a known-good reference device utilizing other non-destructive methods. My work will focus on developing a method to inspect flip chip devices without requiring a previously established reference. The method will automatically examine measurement data from a large sample set to identify those devices which are most similar. The selected devices can then be utilized to compose a hybrid reference signal which can be used for comparison and defect detection.
Author: Abel Valdes Publisher: ISBN: Category : Laser interferometers Languages : en Pages :
Book Description
The objectives of this thesis are to develop and validate laser ultrasonic inspection methods for on-line testing of microelectronic devices. Electronic packaging technologies such as flip chips and BGAs utilize solder bumps as electrical and mechanical connections. Since they are located hidden from view between the device and the substrate, defects such as cracks, voids, misalignments, and missing bumps are difficult to detect using non-destructive methods. Laser ultrasonic inspection is capable of detecting such defects by utilizing a high power laser pulse to induce vibrations in a microelectronic device while measuring the out of plane displacement using an interferometer. Quality can then be assessed by comparing the vibration response of a known-good device to the response of the sample under inspection. The main limitation with the implementation of laser ultrasonic inspection in manufacturing applications is the requirement to establish a known-good reference device utilizing other non-destructive methods. My work will focus on developing a method to inspect flip chip devices without requiring a previously established reference. The method will automatically examine measurement data from a large sample set to identify those devices which are most similar. The selected devices can then be utilized to compose a hybrid reference signal which can be used for comparison and defect detection.
Author: Ryan Chaplin Publisher: FriesenPress ISBN: 1460295676 Category : Technology & Engineering Languages : en Pages : 429
Book Description
Ultrasonic testing (UT) has been an accepted practice of inspection in industrial environments for decades. This book, Industrial Ultrasonic Inspection, is designed to meet and exceed ISO 9712 training requirements for Level 1 and Level 2 certification. The material presented in this book will provide readers with all the basic knowledge of the theory behind elastic wave propagation and its uses with the use of easy to read text and clear pictorial descriptions. Discussed UT concepts include: - General engineering, materials, and components theory - Theory of sound waves and their propagation - The general uses of ultrasonic waves - Comprehensive lab section - Methods of ultrasonic wave generation - Different ultrasonic inspection techniques - Ultrasonic flaw detectors, scanning systems, and probes - Calibration fundamentals - General scanning techniques - Flaw sizing techniques - Basic analysis for ultrasonic, phased array ultrasonic, and time of flight diffraction inspection techniques - Codes and standards - Principles of technical documentation and reporting It is my intention that this book is used for general training purposes. It is the ideal classroom textbook. -Ryan Chaplin
Author: Suraj Bramhavar Publisher: ISBN: Category : Languages : en Pages : 274
Book Description
Abstract: The concept of optical excitation and detection of nanoscale mechanical motion has led to a variety of tools for non-destructive materials characterization and remote sensing. These techniques, commonly referred to as laser ultrasonics, offer the benefit of high-bandwidth, highly localized measurements, and also allow for the ability to investigate nanoscale devices. The impact of laser ultrasonic systems has been felt in industries ranging from semiconductor metrology to biological and chemical sensing. In this thesis, we develop a variety of techniques utilizing a frequency domain laser ultrasonic approach, where amplitude modulated continuous wave laser light is used instead of traditional pulsed laser sources, and we apply these systems in free-space, optical fiber based. and integrated on-chip configurations. In doing so, we demonstrate the ability to efficiently transduce various types of mechanical motion including surface and bulk acoustic waves, guided acoustic waves, and resonant motion from nanomechanical systems (NEMS). First, we develop a superheterodyne free-space ultrasonic inspection system in an effort to characterize surface acoustic wave dispersion in thin-film material systems. We utilize a similar system to study negative refraction and focusing behavior of guided elastic waves in a thin metal plate, providing a novel approach for the study of negative index physics. Furthermore, we develop a near-field optical technique using optical fibers to simultaneously transduce the motion of 70 NEMS resonators using a single channel. This multiplexed approach serves as a crucial step in moving NEMS technology out of the research laboratory. Finally, we go on to study opto-mechanical interactions between optical whispering gallery mode (WGM) resonators and integrated NEMS devices on the same chip, using the enhanced interactions to study optical forces acting on the nanoscale mechanical devices. This integrated system provides a very efficient mechanical sensing platform as well as a robust test-bed for the study of new optical interactions including the presence of both attractive and repulsive optical forces. The overall goal of the work is to further the state-of-the art for optically transduced nanomechanical sensing as well as to advance the understanding of optomechanical interactions of nanoscale devices.
Author: Zheng Liu Publisher: Springer ISBN: 1447167414 Category : Computers Languages : en Pages : 541
Book Description
This pioneering text/reference presents a detailed focus on the use of machine vision techniques in industrial inspection applications. An internationally renowned selection of experts provide insights on a range of inspection tasks, drawn from their cutting-edge work in academia and industry, covering practical issues of vision system integration for real-world applications. Topics and features: presents a comprehensive review of state-of-the-art hardware and software tools for machine vision, and the evolution of algorithms for industrial inspection; includes in-depth descriptions of advanced inspection methodologies and machine vision technologies for specific needs; discusses the latest developments and future trends in imaging and vision techniques for industrial inspection tasks; provides a focus on imaging and vision system integration, implementation, and optimization; describes the pitfalls and barriers to developing successful inspection systems for smooth and efficient manufacturing process.
Author: Chaitanya Bakre Publisher: ISBN: Category : Languages : en Pages : 0
Book Description
This research contributes to the development of an in-situ laser ultrasonic inspection system to ensure a defect-free fabrication of additive manufacturing (AM) parts. AM process is hailed as one of the most innovative technologies of industry 4.0. due to the many unique advantages over the subtractive manufacturing methods. The increased design freedom due to the layer-wise manufacturing also allows significant weight reductions and enhanced component performance with little or no specialized tooling. However, the lack of understanding of the process makes it prone to defects inhibiting its use in safety-critical applications such as power generation and aerospace industries. In the absence of defects, subtle changes in the process parameters can lead to undesired microstructure that can be detrimental to the part performance. Thus, in-situ material state monitoring techniques are urgently needed to realize the full benefits of additive manufacturing. The majority of the current process monitoring systems are vision-based, limiting them from monitoring the internal defects, and are incapable of providing information about the mechanical properties. X-ray computed tomography is being used extensively to detect volumetric AM defects, but it is not amenable for in-situ inspections and is limited by size. Thus, laser ultrasound is considered as a viable solution for in-situ monitoring of AM as it is non-contact and offers benefits of ultrasonic testing, such as detecting volumetric defects and estimating strength-related properties. This research presents a laser ultrasonic system integrated into a directed-energy-deposition additive manufacturing system and demonstrates the in-situ detection of realistic AM defects and microstructural sensing. Laser generation of both narrowband and broadband Rayleigh waves is exploited to detect localized defects created by altering the process parameters in Ti-6Al-4V depositions. Furthermore, the nonlinear waveform distortion of broadband Rayleigh waves is used to detect changes instilled by marginally varying the process parameters for Ti-6Al-4V and IN718 depositions. The AM surface roughness is a key challenge for laser ultrasound-based in-situ monitoring because it affects both wave reception and the Rayleigh wave propagation. Results demonstrate the influence of AM surface roughness and unique microstructure on nonlinear distortions of Rayleigh waves. Furthermore, the capability of the laser ultrasonic system to carry out artificial flaw detection using narrowband and broadband Rayleigh waves and microstructure monitoring using nonlinear distortion of broadband Rayleigh waves is demonstrated for Ti-6Al-4V and IN-718 specimens within the directed energy deposition additive manufacturing chamber.
Author: Abel Valdes
Author: Abel Valdes
Author: 
Author: James Wagner
Author: Ryan Chaplin
Author: Suraj Bramhavar
Author: 
Author: Zheng Liu
Author: Chaitanya Bakre
Author: Kevin G. Harding
Author: National Institute of Standards and Technology (U.S.)