Author: Kaushal Verma
Publisher:
ISBN:
Category :
Languages : en
Pages : 262
Book Description
Development of Far Infrared Fizeau Interferometry for Real-time Warpage Measurement of Rough Surfaces
Thermo-mechanical Characterization of Evolving Packaging Materials and Structures
Author: Sheng Liu
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 156
Book Description
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 156
Book Description
Dissertation Abstracts International
Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 810
Book Description
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 810
Book Description
Optical Design and Testing
Optical Engineering
Author:
Publisher:
ISBN:
Category : Optical instruments
Languages : en
Pages : 914
Book Description
Publishes papers reporting on research and development in optical science and engineering and the practical applications of known optical science, engineering, and technology.
Publisher:
ISBN:
Category : Optical instruments
Languages : en
Pages : 914
Book Description
Publishes papers reporting on research and development in optical science and engineering and the practical applications of known optical science, engineering, and technology.
American Doctoral Dissertations
Author:
Publisher:
ISBN:
Category : Dissertation abstracts
Languages : en
Pages : 816
Book Description
Publisher:
ISBN:
Category : Dissertation abstracts
Languages : en
Pages : 816
Book Description
Electronic Packaging Materials Science X: Volume 515
Author: Daniel J. Belton
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 288
Book Description
Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 288
Book Description
Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR
Electronic Packaging Materials Science
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 288
Book Description
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 288
Book Description
Springer Handbook of Experimental Solid Mechanics
Author: William N. Sharpe, Jr.
Publisher: Springer Science & Business Media
ISBN: 0387268839
Category : Mathematics
Languages : en
Pages : 1100
Book Description
The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line computers for rapid data processing and the combined use of experimental and numerical techniques have greatly expanded the capabilities of experimental mechanics. New exciting topics are included on biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics. Presenting complete instructions to various areas of experimental solid mechanics, guidance to detailed expositions in important references, and a description of state-of-the-art applications in important technical areas, this thoroughly revised and updated edition is an excellent reference to a widespread academic, industrial, and professional engineering audience.
Publisher: Springer Science & Business Media
ISBN: 0387268839
Category : Mathematics
Languages : en
Pages : 1100
Book Description
The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line computers for rapid data processing and the combined use of experimental and numerical techniques have greatly expanded the capabilities of experimental mechanics. New exciting topics are included on biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics. Presenting complete instructions to various areas of experimental solid mechanics, guidance to detailed expositions in important references, and a description of state-of-the-art applications in important technical areas, this thoroughly revised and updated edition is an excellent reference to a widespread academic, industrial, and professional engineering audience.
Introduction to Microwave Remote Sensing
Author: Iain H. Woodhouse
Publisher: CRC Press
ISBN: 1351988557
Category : Technology & Engineering
Languages : en
Pages : 321
Book Description
Introduction to Microwave Remote Sensing offers an extensive overview of this versatile and extremely precise technology for technically oriented undergraduates and graduate students. This textbook emphasizes an important shift in conceptualization and directs it toward students with prior knowledge of optical remote sensing: the author dispels any linkage between microwave and optical remote sensing. Instead, he constructs the concept of microwave remote sensing by comparing it to the process of audio perception, explaining the workings of the ear as a metaphor for microwave instrumentation. This volume takes an “application-driven” approach. Instead of describing the technology and then its uses, this textbook justifies the need for measurement then explains how microwave technology addresses this need. Following a brief summary of the field and a history of the use of microwaves, the book explores the physical properties of microwaves and the polarimetric properties of electromagnetic waves. It examines the interaction of microwaves with matter, analyzes passive atmospheric and passive surface measurements, and describes the operation of altimeters and scatterometers. The textbook concludes by explaining how high resolution images are created using radars, and how techniques of interferometry can be applied to both passive and active sensors.
Publisher: CRC Press
ISBN: 1351988557
Category : Technology & Engineering
Languages : en
Pages : 321
Book Description
Introduction to Microwave Remote Sensing offers an extensive overview of this versatile and extremely precise technology for technically oriented undergraduates and graduate students. This textbook emphasizes an important shift in conceptualization and directs it toward students with prior knowledge of optical remote sensing: the author dispels any linkage between microwave and optical remote sensing. Instead, he constructs the concept of microwave remote sensing by comparing it to the process of audio perception, explaining the workings of the ear as a metaphor for microwave instrumentation. This volume takes an “application-driven” approach. Instead of describing the technology and then its uses, this textbook justifies the need for measurement then explains how microwave technology addresses this need. Following a brief summary of the field and a history of the use of microwaves, the book explores the physical properties of microwaves and the polarimetric properties of electromagnetic waves. It examines the interaction of microwaves with matter, analyzes passive atmospheric and passive surface measurements, and describes the operation of altimeters and scatterometers. The textbook concludes by explaining how high resolution images are created using radars, and how techniques of interferometry can be applied to both passive and active sensors.