Development of a Capacitive MEMS Force Sensor for Touchscreen Applications PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Development of a Capacitive MEMS Force Sensor for Touchscreen Applications PDF full book. Access full book title Development of a Capacitive MEMS Force Sensor for Touchscreen Applications by ALI OMAR NASSER. BANSS. Download full books in PDF and EPUB format.
Author: ALI OMAR NASSER. BANSS Publisher: ISBN: Category : Languages : en Pages : 0
Book Description
This thesis presents the design and development of a capacitive MEMS force sensor to overcome the limitations associated with current force sensors used in touchscreens. The sensor uses two elastic materials that provide a dual-range of force sensitivity ensuring the sensor is able to sense light touch forces and able to withstand heavy ones. The fabrication process of the sensor was developed at the Toronto Nano Fabrication Centre at the University of Toronto. The fabricated sensor was experimentally tested to measure forces ranging from 50 mN to 5 N, with a force threshold of 625 mN that defines the boundary between the high sensitive region for light touches and the moderate sensitivity region. Sensor sensitivity was found to be 3.728pF/N (19.12 %∆C/N) in the first force region with maximum nonlinearity of 0.118 pF. In the second region, the sensitivity was 0.3194 pF (3.2 %∆C/N) with maximum nonlinearity of 0.3194 pF.
Author: ALI OMAR NASSER. BANSS Publisher: ISBN: Category : Languages : en Pages : 0
Book Description
This thesis presents the design and development of a capacitive MEMS force sensor to overcome the limitations associated with current force sensors used in touchscreens. The sensor uses two elastic materials that provide a dual-range of force sensitivity ensuring the sensor is able to sense light touch forces and able to withstand heavy ones. The fabrication process of the sensor was developed at the Toronto Nano Fabrication Centre at the University of Toronto. The fabricated sensor was experimentally tested to measure forces ranging from 50 mN to 5 N, with a force threshold of 625 mN that defines the boundary between the high sensitive region for light touches and the moderate sensitivity region. Sensor sensitivity was found to be 3.728pF/N (19.12 %∆C/N) in the first force region with maximum nonlinearity of 0.118 pF. In the second region, the sensitivity was 0.3194 pF (3.2 %∆C/N) with maximum nonlinearity of 0.3194 pF.
Author: Publisher: ISBN: Category : Languages : en Pages :
Book Description
This thesis describes a closed-loop microelectromechanical system (MEMS) based on lumped-parameter modeling. Analytical models are derived for electrostatic comb drive actuator (CDA) under force-controlled actuation, electrothermal actuator (ETA) under displacement-controlled actuation, capacitive position sensor, including parallel plate capacitive sensor (PPCS) and torsional plate capacitive sensor (TPCS), mechanical equation of motion of a suspended shuttle, viscous air damping, folded exure. These models are implemented and simulated in finite element analysis softwares (ANSYS and FEMM). System level simulation, implementing PID difierential feedback loop, is simulated in a numerical simulation program (MATLAB). The MEMS die is fabricated by following the standard PolyMUMPs process by MEMSCAP. A series of MEMS packaging process and storage are done in the lab. All peripheral circuitries are self-made. A commercial capacitive readout IC (MS3110) is first used for open-loop capacitive sensing, which achieves the resolution of 0.05fF, equivalent to 1nm in displacement. Due to the disadvantage of MS3110 in closed-loop, AC bridge capacitance measurement method is then implemented for closed-loop integration. The resolution of AC bridge sensor reaches 0.02fF, equivalent to 0.4nm in displacement. An additional function of AC bridge sensing is accomplished which is simultaneously sensing and actuation of CDA. In the feedback loop, the traditional analog PID controller is designed to transfer the voltage signal of capacitance measurement to the voltage-force transducer which converts feedback voltages to differential feedback force. Since the differential feedback force is limited by clamped voltage, a force-balanced mode is observed under 5V actuation of CDA.
Author: Larry K. Baxter Publisher: Institute of Electrical & Electronics Engineers(IEEE) ISBN: Category : Technology & Engineering Languages : en Pages : 328
Book Description
Capacitive sensors produce spectacular resolution of movement to one part in 10-10 meters and maintain exceptional long-term stability in hostile environments. They are increasingly used for a variety of jobs in consumer and industrial equipment, including wall stud sensors, keypads, lamp dimmers, micrometers, calipers, rotation encoders, and more. The most focused, authoritative book available in the field, "Capacitive Sensors" brings you complete information on the research, design, and production of capacitive sensors. This all-in-one source provides detailed, comprehensive coverage of key topics, including underlying theory, electrode configuration, and practical circuits. In addition, you'll find reviews of a number of tested systems never before published. "Capacitive Sensors" is a must-have for product designers and mechanical and electrical engineers interested in using this fast-developing technology to get top price and performance advantages.
Author: Jürg Schwizer Publisher: Springer Science & Business Media ISBN: 3540269452 Category : Technology & Engineering Languages : en Pages : 184
Book Description
Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
Author: Jose Gerardo Rocha Publisher: ISBN: 9789537619312 Category : Languages : en Pages :
Book Description
A three dimensional capacitive force sensor for tactile applications has been presented. In order to better understand its capabilities, the different technologies developed in order to achieve tactile sensors have been reviewed. In this way, electromagnetic, piezoelectric, resistive and piezoresistive based tactile sensors have been discussed. Finally, the three dimensional capacitive force sensor has been presented. In a first stage, the theoretical description of the sensor has been developed through the simulation of the sensor response to forces applied along different directions. Finally, the readout electronics for capacitive sensors in general and for the three dimensional capacitive sensor has been shown. As a conclusion, capacitive sensors allow an easy and low-cost fabrication of a flexible and precise three-dimensional force sensor suitable for tactile applications.
Author: Tan Tran Duc Publisher: GRIN Verlag ISBN: 3640249593 Category : Technology & Engineering Languages : en Pages : 83
Book Description
Diploma Thesis from the year 2005 in the subject Electrotechnology, grade: Master 9.8/10, , language: English, abstract: Microelectromechanical systems (MEMS) are collection of microsensors and actuators that have the ability to sense its environment and react to changes in that environment with the use of a microcircuit control. They also include the conventional microelectronics packaging, integrating antenna structures for command signals into microelectromechanical structures for desired sensing and actuating functions. The system may also need micropower supply, microrelay, and microsignal processing units. Microcomponents make the system faster, more reliable, cheaper, and capable of incorporating more complex functions. In the beginning of 1990s, MEMS appeared with the aid of the development of integrated circuit fabrication processes, in which sensors, actuators, and control functions are co-fabricated in silicon [1]. Since then, remarkable research progresses have been achieved in MEMS under the strong promotions from both government and industries. In addition to the commercialization of some less integrated MEMS devices, such as microaccelerometers, inkjet printer head, micromirrors for projection, etc., the concepts and feasibility of more complex MEMS devices have been proposed and demonstrated for the applications in such varied fields as microfluidics, aerospace, biomedical, chemical analysis, wireless communications, data storage, display, optics, etc. Some branches of MEMS, appearing as microoptoelectromechanical systems (MOEMS), micro total analysis systems, etc., have attracted a great research since their potential applications’ market.
Author: Yong Ping Xu Publisher: River Publishers ISBN: 9788770229661 Category : Languages : en Pages : 0
Book Description
Most MEMS accelerometers on the market today are capacitive accelerometers that are based on the displacement sensing mechanism. This book is intended to cover recent developments of MEMS silicon oscillating accelerometers (SOA), also referred to as MEMS resonant accelerometer. As contrast to the capacitive accelerometer, the MEMS SOA is based on the force sensing mechanism, where the input acceleration is converted to a frequency output. MEMS Silicon Oscillating Accelerometers and Readout Circuits consists of six chapters and covers both MEMS sensor and readout circuit, and provides an in-depth coverage on the design and modelling of the MEMS SOA with several recently reported prototypes. The book is not only useful to researchers and engineers who are familiar with the topic, but also appeals to those who have general interests in MEMS inertial sensors. The book includes extensive references that provide further information on this topic.
Author: ALI OMAR NASSER. BANSS
Author: ALI OMAR NASSER. BANSS
Author: Changhong Guan
Author: 
Author: Larry K. Baxter
Author: Jürg Schwizer
Author: Jose Gerardo Rocha
Author: Tan Tran Duc
Author: Yong Ping Xu
Author: Md Shafiqur Rahman
Author: Fu Shao