Author:
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 1178
Book Description
Defect and Impurity Engineered Semiconductors and Devices
Semiconductor Wafer Bonding : Science, Technology, and Applications V
Author: Charles E. Hunt
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 498
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 498
Book Description
American Book Publishing Record
Author:
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 1044
Book Description
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 1044
Book Description
Mechanical Behavior of Diamond and Other Forms of Carbon
Research & Development
Author:
Publisher:
ISBN:
Category : Research, Industrial
Languages : en
Pages : 554
Book Description
Publisher:
ISBN:
Category : Research, Industrial
Languages : en
Pages : 554
Book Description
Compound Semiconductor
Author:
Publisher:
ISBN:
Category : Compound semiconductors
Languages : en
Pages : 342
Book Description
Publisher:
ISBN:
Category : Compound semiconductors
Languages : en
Pages : 342
Book Description
Electrical & Electronics Abstracts
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 2304
Book Description
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 2304
Book Description
International Aerospace Abstracts
Government Reports Annual Index
Author:
Publisher:
ISBN:
Category : Government reports announcements & index
Languages : en
Pages : 1372
Book Description
Publisher:
ISBN:
Category : Government reports announcements & index
Languages : en
Pages : 1372
Book Description
Chemical-Mechanical Planarization of Semiconductor Materials
Author: M.R. Oliver
Publisher: Springer Science & Business Media
ISBN: 9783540431817
Category : Technology & Engineering
Languages : en
Pages : 444
Book Description
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Publisher: Springer Science & Business Media
ISBN: 9783540431817
Category : Technology & Engineering
Languages : en
Pages : 444
Book Description
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.