Author: Glenn ChapmanPublisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Integrated circuits
Languages : en
Pages : 400
Book Description
Seventh Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA
Author: Glenn ChapmanPublisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Integrated circuits
Languages : en
Pages : 400
Book Description
Index to IEEE Publications
Author: Institute of Electrical and Electronics EngineersPublisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1292
Book Description
Semiconductor Wafer Bonding VII : Science, Technology, and Applications
Author: Publisher: The Electrochemical Society
ISBN: 9781566774024
Category : Technology & Engineering
Languages : en
Pages : 404
Book Description
New Serial Titles
Author: Publisher:
ISBN:
Category : Periodicals
Languages : en
Pages : 2316
Book Description
A union list of serials commencing publication after Dec. 31, 1949.
Index of Conference Proceedings
Author: British Library. Document Supply CentrePublisher:
ISBN:
Category : Congresses and conventions
Languages : en
Pages : 988
Book Description
Seventh International Conference on Indium Phosphide and Related Materials
Author: 国立国会図書館所蔵科学技術関係欧文会議錄目錄
Author: 国立国会図書館 (Japan)Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1592
Book Description
Fan-Out Wafer-Level Packaging
Author: John H. LauPublisher: Springer
ISBN: 9811088845
Category : Technology & Engineering
Languages : en
Pages : 319
Book Description
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
国立国会図書館所蔵科学技術関係欧文会議錄目錄
Author: Kokuritsu Kokkai Toshokan shozō kagaku gijutsu kankei Ōbun kaigiroku mokuroku
Author: Kokuritsu Kokkai Toshokan (Japan)Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1596
Book Description