Author: Electronic Components and Technology ConferencePublisher:
ISBN:
Category :
Languages : en
Pages : 117
Book Description
Contributions from the 51st Electronic Components and Technology Conference
Author: Electronic Components and Technology ConferencePublisher:
ISBN:
Category :
Languages : en
Pages : 117
Book Description
50th ECTC
Author: Robert Boudreau49th ECTC
Author: Madhavan SwaminathanSemiconductor Wafer Bonding 9: Science, Technology, and Applications
Author: Helmut BaumgartPublisher: The Electrochemical Society
ISBN: 156677506X
Category : Microelectromechanical systems
Languages : en
Pages : 398
Book Description
This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Power Integrity Modeling and Design for Semiconductors and Systems
Author: Madhavan SwaminathanPublisher: Pearson Education
ISBN: 0132797178
Category : Technology & Engineering
Languages : en
Pages : 599
Book Description
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
50th Electronic Components and Technology Conference
Author: Michael F. CaggianoSpecial Section from the 48th Electronic Components and Technology Conference
Author: Peter J. KrusiusMultiscale Technologies For Cryomedicine: Implementation From Nano To Macroscale
Author: John C BischofPublisher: World Scientific
ISBN: 9814733202
Category : Technology & Engineering
Languages : en
Pages : 389
Book Description
The use of micro / nanotechnology in cell and tissue engineering, and especially for cell and tissue preservation, is at the peak of its activity now, with scientific output expected to continue growing in the coming years.Micro and nanotechnologies have induced paradigm shifts in many scientific fields, and as featured in this edited volume, they are having important impact in the field of cryomedicine. The book gives an overview of the recent progress in implementing multiscale (micro and nanoscale) technologies to improve the outcome of various cryomedical applications including cryosurgery, cryopreservation, lyopreservation and to understand the fundamental engineering and science underpinning the applications.This is the first book that will provide both an introductory and in-depth account of applying the multiscale technologies in cryomedicine.
Transactions of the ASME.
Author: Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 180
Book Description
5th Electronics Packaging Technology Conference
Author: Mahadevan K. IyerPublisher: IEEE Computer Society Press
ISBN: 9780780382053
Category : Technology & Engineering
Languages : en
Pages : 854
Book Description