Author: Tho T. Vu
Publisher: World Scientific
ISBN: 9812383115
Category : Technology & Engineering
Languages : en
Pages : 363
Book Description
This is the book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits. There are fourteen invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. Contents: Present and Future of High-Speed Compound Semiconductor IC's (T Otsuji); Transforming MMIC (E J Martinez); Distributed Amplifier for Fiber-Optic Communication Systems (H Shigematsu et al.); Microwave GaN-Based Power Transistors on Large-Scale Silicon Wafers (S Manohar et al.); Radiation Effects in High Speed III-V Integrated Circuits (T R Weatherford); Radiation Effects in III-V Semiconductor Electronics (B D Weaver et al.); Reliability and Radiation Hardness of Compound Semiconductors (S A Kayali & A H Johnston); and other papers. Readership: Engineers, scientists and graduate students working on high speed electronics and systems, and in the area of compound semiconductor integrated circuits.
Compound Semiconductor Integrated Circuits
Author: Tho T. Vu
Publisher: World Scientific
ISBN: 9812383115
Category : Technology & Engineering
Languages : en
Pages : 363
Book Description
This is the book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits. There are fourteen invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. Contents: Present and Future of High-Speed Compound Semiconductor IC's (T Otsuji); Transforming MMIC (E J Martinez); Distributed Amplifier for Fiber-Optic Communication Systems (H Shigematsu et al.); Microwave GaN-Based Power Transistors on Large-Scale Silicon Wafers (S Manohar et al.); Radiation Effects in High Speed III-V Integrated Circuits (T R Weatherford); Radiation Effects in III-V Semiconductor Electronics (B D Weaver et al.); Reliability and Radiation Hardness of Compound Semiconductors (S A Kayali & A H Johnston); and other papers. Readership: Engineers, scientists and graduate students working on high speed electronics and systems, and in the area of compound semiconductor integrated circuits.
Publisher: World Scientific
ISBN: 9812383115
Category : Technology & Engineering
Languages : en
Pages : 363
Book Description
This is the book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits. There are fourteen invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. Contents: Present and Future of High-Speed Compound Semiconductor IC's (T Otsuji); Transforming MMIC (E J Martinez); Distributed Amplifier for Fiber-Optic Communication Systems (H Shigematsu et al.); Microwave GaN-Based Power Transistors on Large-Scale Silicon Wafers (S Manohar et al.); Radiation Effects in High Speed III-V Integrated Circuits (T R Weatherford); Radiation Effects in III-V Semiconductor Electronics (B D Weaver et al.); Reliability and Radiation Hardness of Compound Semiconductors (S A Kayali & A H Johnston); and other papers. Readership: Engineers, scientists and graduate students working on high speed electronics and systems, and in the area of compound semiconductor integrated circuits.
Devices for Integrated Circuits
Author: H. Craig Casey
Publisher: John Wiley & Sons
ISBN: 0471171344
Category : Technology & Engineering
Languages : en
Pages : 549
Book Description
This book develops the device physics of the Si and III-V compound semiconductor devices used in integrated circuits. Important equations are derived from basic physical concepts. The physics of these devices are related to the parameters used in SPICE. Terminology is intended to prepare students for reading technical journals on semiconductor devices. This text is suitable for first-year graduate students and seniors in Electrical Engineering; graduate students in Material Science and Chemical Engineering, interested in semiconductor materials; Computer Science students interested in custom VLSI design; and professionals in the semiconductor industry.
Publisher: John Wiley & Sons
ISBN: 0471171344
Category : Technology & Engineering
Languages : en
Pages : 549
Book Description
This book develops the device physics of the Si and III-V compound semiconductor devices used in integrated circuits. Important equations are derived from basic physical concepts. The physics of these devices are related to the parameters used in SPICE. Terminology is intended to prepare students for reading technical journals on semiconductor devices. This text is suitable for first-year graduate students and seniors in Electrical Engineering; graduate students in Material Science and Chemical Engineering, interested in semiconductor materials; Computer Science students interested in custom VLSI design; and professionals in the semiconductor industry.
2009 Annual IEEE Compound Semiconductor Integrated Circuit Symposium
Author: IEEE Electron Devices Society
Publisher:
ISBN: 9781424452606
Category : Compound semiconductors
Languages : en
Pages : 201
Book Description
Publisher:
ISBN: 9781424452606
Category : Compound semiconductors
Languages : en
Pages : 201
Book Description
2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS 2015)
Special Section on the 2015 Compound Semiconductor Integrated Circuit Symposium
2007 IEEE Compound Semiconductor Integrated Circuits Symposium
Author:
Publisher:
ISBN: 9781509086276
Category : Electronic books
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9781509086276
Category : Electronic books
Languages : en
Pages :
Book Description
Special Issue on the Third IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)
Author: Compound Semiconductor Integrated Circuit Symposium
Publisher:
ISBN:
Category :
Languages : en
Pages : 242
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 242
Book Description
Special Issue: Compound Semiconductor Integrated Circuits
2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)
Author: Institute of Electrical and Electronics Engineers
Publisher:
ISBN:
Category : Compound semiconductors
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category : Compound semiconductors
Languages : en
Pages :
Book Description
2008 IEEE Compound Semiconductor Integrated Circuits Symposium
Author: IEEE Staff
Publisher:
ISBN: 9781509078714
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN: 9781509078714
Category :
Languages : en
Pages :
Book Description