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Chemical Vapor Deposition of Organosilicon Composite Thin Films for Porous Low-k Dielectrics

Chemical Vapor Deposition of Organosilicon Composite Thin Films for Porous Low-k Dielectrics PDF Author: April Denise Ross
Publisher:
ISBN:
Category :
Languages : en
Pages : 238

Book Description
Pulsed plasma enhanced chemical vapor deposition has produced organosilicon thin films with the potential use as low dielectric constant interconnect materials in microelectronic circuits. Both diethylsilane and octamethylcyclotetrasiloxane precursors were used, with oxygen and hydrogen peroxides oxidants respectively, to deposit low-k organosilicon films. FTIR, nanoindentation, ellipsometry, and dielectric constant measurements were demonstrated as a valuable film characterization tools to understand structure-property-processing fundamentals by quantifying structural bonding environments and relating those to the film properties. Nanocomposites were also produced using two novel techniques. First, crystal colloidal templates of polystyrene nanospheres were fabricated using evaporation-induced self-assembly. OSG was then deposited throughout the templates to create composite materials. Subsequently the polystyrene was removed upon thermal annealing to create highly porous OSG thin films. Second, ultrasonic atomization was used to deliver particles into a vacuum chamber during plasma-enhanced CVD of the organosilicon matrix to create composite thin films using an all-CVD technique. This process could extend CVD to applications currently only possible using wet processing techniques or multi-step processing.

Chemical Vapor Deposition of Organosilicon Composite Thin Films for Porous Low-k Dielectrics

Chemical Vapor Deposition of Organosilicon Composite Thin Films for Porous Low-k Dielectrics PDF Author: April Denise Ross
Publisher:
ISBN:
Category :
Languages : en
Pages : 238

Book Description
Pulsed plasma enhanced chemical vapor deposition has produced organosilicon thin films with the potential use as low dielectric constant interconnect materials in microelectronic circuits. Both diethylsilane and octamethylcyclotetrasiloxane precursors were used, with oxygen and hydrogen peroxides oxidants respectively, to deposit low-k organosilicon films. FTIR, nanoindentation, ellipsometry, and dielectric constant measurements were demonstrated as a valuable film characterization tools to understand structure-property-processing fundamentals by quantifying structural bonding environments and relating those to the film properties. Nanocomposites were also produced using two novel techniques. First, crystal colloidal templates of polystyrene nanospheres were fabricated using evaporation-induced self-assembly. OSG was then deposited throughout the templates to create composite materials. Subsequently the polystyrene was removed upon thermal annealing to create highly porous OSG thin films. Second, ultrasonic atomization was used to deliver particles into a vacuum chamber during plasma-enhanced CVD of the organosilicon matrix to create composite thin films using an all-CVD technique. This process could extend CVD to applications currently only possible using wet processing techniques or multi-step processing.

Pulsed-plasma Chemical Vapor Deposition of Organosilicon Thin Films for Dielectric Applications

Pulsed-plasma Chemical Vapor Deposition of Organosilicon Thin Films for Dielectric Applications PDF Author: Daniel D. Burkey
Publisher:
ISBN:
Category :
Languages : en
Pages : 284

Book Description
Organosilicon matrix material resulted in film collapse rather than the formation of voids. In order to prevent this, an extensive study of the mechanical properties of the matrix material was performed, with identification of key structure-property-processing relationships that allowed for the enhancement of mechanical properties while maintaining favorable conditions for the deposition of the porogen species. Integration of the optimized system and subsequent removal of the porogen sacrificial material resulted in thin films with properties suggesting porosity and dielectric constants as low as 2.3.

Silicon Nitride, Silicon Dioxide Thin Insulating Films, and Other Emerging Diele[c]trics VIII

Silicon Nitride, Silicon Dioxide Thin Insulating Films, and Other Emerging Diele[c]trics VIII PDF Author: Ram Ekwal Sah
Publisher: The Electrochemical Society
ISBN: 9781566774598
Category : Nature
Languages : en
Pages : 606

Book Description


Dissertation Abstracts International

Dissertation Abstracts International PDF Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 858

Book Description


Handbook of Thin Film Deposition

Handbook of Thin Film Deposition PDF Author: Krishna Seshan
Publisher: William Andrew
ISBN: 1437778739
Category : Science
Languages : en
Pages : 412

Book Description
Resumen: The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

Chemical Vapor Deposition

Chemical Vapor Deposition PDF Author: Electrochemical Society. High Temperature Materials Division
Publisher: The Electrochemical Society
ISBN: 9781566771788
Category : Science
Languages : en
Pages : 1686

Book Description


Chemical Vapor Deposition and Functionalization of Fluorocarbon-organosilicon Copolymer Thin Films

Chemical Vapor Deposition and Functionalization of Fluorocarbon-organosilicon Copolymer Thin Films PDF Author: Shashi Krishna Murthy
Publisher:
ISBN:
Category :
Languages : en
Pages : 122

Book Description
Neural prostheses are micron-scale integrated circuit devices that are under development for the treatment of brain and spinal cord injuries. A key challenge in the fabrication of these silicon- based devices is the protection of the electronic components from the ambient body environment. There is a need for a biopassivation coating on these devices that is chemically inert and electrically insulating with good adhesion to the underlying silicon substrate. Fluorocarbon-organosilicon copolymers are of interest for this application because they have the desirable attributes of both fluorocarbon and organosilicon polymers, such as low dielectric constant, thermal stability, and good adhesion to silicon. Chemical vapor deposition (CVD) is an attractive synthetic technique for this application because it is single-step, requires no solvent, and allows conformal coatings to be deposited on substrates with complex topographies and small dimensions. Fluorocarbon-organosilicon copolymers have been synthesized by hot-filament CVD, a thermal CVD technique. Control over deposition rate and chemical structure is achieved by precursor choice and variation of filament temperature. Chemical characterization by infrared (FTIR), x-ray photoelectron (XPS), and solid-state nuclear magnetic resonance (NMR) spectroscopies indicates that the copolymer films range from highly cross-linked films to flexible films comprised mostly of linear polymer chains. This variation in chemical composition influences physical properties such as thermal stability and flexibility. The possibility of creating bioactive surface coatings has been explored by using the techniques of CVD and solution chemistry in combination. Chains of poly(acrylamide) have been grafted onto fluorocarbon-organosilicon films as a first step towards the design of bioactive coatings that could potentially enhance the performance of medical implants.

Plasma Applications In Gases, Liquids And Solids: Technology And Methods

Plasma Applications In Gases, Liquids And Solids: Technology And Methods PDF Author: Claudia Riccardi
Publisher: World Scientific
ISBN: 9811275947
Category : Science
Languages : en
Pages : 296

Book Description
This book explores the exciting and evolving world of plasma physics in materials manufacturing and processing. From ionized discharges to non-thermal equilibrium plasmas, new phenomena in physics are constantly emerging. Written, organized, and edited by internationally recognized experts, the various chapters delve into diverse issues in plasma science, including new applications at the nanoscale to the development of diagnostic tools and simulations. The interactions between the plasma state and matter, both surface and bulk, as well as gases and liquids, are explored. As electric discharges in plasmas continue to expand towards new horizons, anyone interested in this fascinating field would benefit from this book as an up-to-date and essential resource.

Ordered Porous Solids

Ordered Porous Solids PDF Author: Valentin Valtchev
Publisher: Elsevier
ISBN: 0080932452
Category : Science
Languages : en
Pages : 813

Book Description
The developments in the area of ordered nanoporous solids have moved beyond the traditional catalytic and separation uses and given rise to a wide variety of new applications in different branches of chemistry, physics, material science, etc. The activity in this area is due to the outstanding properties of nanoporous materials that have attracted the attention of researchers from different communities. However, recent achievements in a specific field often remain out of the focus of collaborating communities. This work summarizes the latest developments and prospects in the area of ordered porous solids, including synthetic layered materials (clays), microporous zeolite-type materials, ordered mesoporous solids, metal-organic-framework compounds (MOFs), carbon, etc. All aspects, from synthesis via comprehensive characterization to the advanced applications of ordered porous materials, are presented. The chapters are written by leading experts in their respective fields with an emphasis on recent progress and the state of the art. - Summarizes the latest developments in the field of ordered nanoporous solids - Presents state-of-the-art coverage of applications related to porous solids - Incorporates 28 contributions from experts across the disciplines

Catalytic Chemical Vapor Deposition

Catalytic Chemical Vapor Deposition PDF Author: Hideki Matsumura
Publisher: John Wiley & Sons
ISBN: 3527818642
Category : Technology & Engineering
Languages : en
Pages : 440

Book Description
The authoritative reference on catalytic chemical vapor deposition, written by the inventor of the technology. This comprehensive book covers a wide scope of Cat-CVD and related technologies from the fundamentals to the many applications, including the design of a Cat-CVD apparatus. Featuring contributions from four senior leaders in the field, including the father of catalytic chemical vapor deposition, it also introduces some of the techniques used in the observation of Cat-CVD related phenomena so that readers can understand the concepts of such techniques. Catalytic Chemical Vapor Deposition: Technology and Applications of Cat-CVD begins by reviewing the analytical tools for elucidating the chemical reactions in Cat-CVD, such as laser-induced fluorescence and deep ultra-violet absorption, and explains in detail the underlying physics and chemistry of the Cat-CVD technology. Subsequently it provides an overview of the synthesis and properties of Cat-CVD-prepared inorganic and organic thin films. The last parts of this unique book are devoted to the design and operation of Cat-CVD apparatuses and the applications. Provides coherent coverage of the fundamentals and applications of catalytic chemical vapor deposition (Cat-CVD) Assembles in one place the state of the art of this rapidly growing field, allowing new researchers to get an overview that is difficult to obtain solely from journal articles Presents comparisons of different Cat-CVD methods which are usually not found in research papers Bridges academic and industrial research, showing how CVD can be scaled up from the lab to large-scale industrial utilization in the high-tech industry. Catalytic Chemical Vapor Deposition: Technology and Applications is an excellent one-stop resource for researchers and engineers working on or entering the field of Cat-CVD, Hot-Wire CVD, iCVD, and related technologies.