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Author: David. J. Fisher Publisher: Materials Research Forum LLC ISBN: 1644900092 Category : Technology & Engineering Languages : en Pages : 146
Book Description
Bonding by Self-Propagating Reaction represents a highly promising approach for the joining of dissimilar materials in such fields as microelectronics, infrared sensors, micro-electro-mechanical systems (MEMS), aerospace and nuclear industries, and surface engineering for chemical, mechanical and microsystems applications. The technique leads to high bonding strengths and low rates of damage on substrates. Another advantage is that it does not require high processing temperatures. The book is based on 251 original resources and includes their direct web link for in-depth reading.
Author: David. J. Fisher Publisher: Materials Research Forum LLC ISBN: 1644900092 Category : Technology & Engineering Languages : en Pages : 146
Book Description
Bonding by Self-Propagating Reaction represents a highly promising approach for the joining of dissimilar materials in such fields as microelectronics, infrared sensors, micro-electro-mechanical systems (MEMS), aerospace and nuclear industries, and surface engineering for chemical, mechanical and microsystems applications. The technique leads to high bonding strengths and low rates of damage on substrates. Another advantage is that it does not require high processing temperatures. The book is based on 251 original resources and includes their direct web link for in-depth reading.
Author: C. Colinge Publisher: The Electrochemical Society ISBN: 1566778239 Category : Science Languages : en Pages : 656
Book Description
Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Author: Inna P. Borovinskaya Publisher: Elsevier ISBN: 0128041889 Category : Science Languages : en Pages : 468
Book Description
The Concise Encyclopedia of Self-Propagating High-Temperature Synthesis: History, Theory, Technology, and Products helps students and scientists understand the fundamental concepts behind self-propagating high-temperature synthesis (SHS). SHS-based technologies provide valuable alterations to traditional methods of material fabrication, such as powder metallurgy, conventional and force sintering, casting, extrusion, high isostatic pressure sintering, and others. The book captures the whole spectrum of the chemistry, physics, reactions, materials, and processes of self-propagating high-temperature synthesis. This book is an indispensable resource not only to scientists working in the field of SHS, but also to researchers in multidisciplinary fields such as chemical engineering, metallurgy, material science, combustion, explosion, and the chemistry of solids. - Written by high-level experts in the field from 20 different countries, along with editors who are founders of the field - Covers 169 topics in the field of SHS - Features new phenomena, such as acoustics and high-energy reactions in combustion synthesis - Provides an overview of many aspects of the constructive application of the combustion phenomenon, for example, in the fabrication of advanced materials
Author: Robin Shannon Publisher: Scientific e-Resources ISBN: 1839472413 Category : Languages : en Pages : 312
Book Description
An analog chip is a set of miniature electronic analog circuits formed on a single piece of semiconductor material. The voltage and current at specified points in the circuits of analog chips vary continuously in time. In contrast, digital chips only use and create voltages or currents at discrete levels, with no intermediate values. In addition to Transistors, analog chips often have a larger number of passive elements than digital chips typically do. Inductors tend to be avoided because of their large size and a transistor and capacitor together can do the work of an inductor. The book broadly deals with: Direct and capacitor coupled Opamp amplifiers; Frequency response and compensation to improve the performance of Opamp circuits; Voltage and current sources, instrumentation amplifiers and precision rectifiers, limiting and clamping circuits; Log and antilog amplifiers, etc. The book covers the syllabus prescribed for B.E. Care is taken to develop the subject logically so that the book could also be used by B.Sc. and diploma students. Neatly drawn diagrams, stepwise illustrations, and graded numerical examples, are included in every chapter to support the contents.
Author: Robert W. Messler Publisher: Butterworth-Heinemann ISBN: 0750677570 Category : Technology & Engineering Languages : en Pages : 816
Book Description
Joining of Materials and Structures is the first and only complete and highly readable treatment of the options for joining conventional materials and the structures they comprise in conventional and unconventional ways, and for joining emerging materials and structures in novel ways. Joining by mechanical fasteners, integral designed-or formed-in features, adhesives, welding, brazing, soldering, thermal spraying, and hybrid processes are addressed as processes and technologies, as are issues associated with the joining of metals, ceramics (including cement and concrete) glass, plastics, and composites (including wood), as well as, for the first time anywhere, living tissue. While focused on materials issues, issues related to joint design, production processing, quality assurance, process economics, and joint performance in service are not ignored. The book is written for engineers, from an in-training student to a seasoned practitioner by an engineer who chose to teach after years of practice. By reading and referring to this book, the solutions to joining problems will be within one's grasp. Key Features: · Unprecedented coverage of all joining options (from lashings to lasers) in 10 chapters · Uniquely complete coverage of all materials, including living tissues, in 6 chapters · Richly illustrated with 76 photographs and 233 illustrations or plots · Practice Questions and Problems for use as a text of for reviewing to aid for comprehension * Coverage all of major joining technologies, including welding, soldering, brazing, adhesive and cement bonding, pressure fusion, riveting, bolting, snap-fits, and more * Organized by both joining techniques and materials types, including metals, non-metals, ceramics and glasses, composites, biomaterials, and living tissue * An ideal reference for design engineers, students, package and product designers, manufacturers, machinists, materials scientists
Author: Masayoshi Esashi Publisher: John Wiley & Sons ISBN: 3527823255 Category : Technology & Engineering Languages : en Pages : 528
Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author: Balázs Illés Publisher: Elsevier ISBN: 0128185066 Category : Technology & Engineering Languages : en Pages : 295
Book Description
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. - Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles - Analyses and compares the different reflow ovens - Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality - Introduces Vapor Phase Soldering (VPS) technology
Author: Yung-cheng Lee Publisher: World Scientific ISBN: 9813229373 Category : Technology & Engineering Languages : en Pages : 363
Book Description
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Author: Publisher: Newnes ISBN: 008097743X Category : Science Languages : en Pages : 9815
Book Description
The second edition of Comprehensive Organic Synthesis—winner of the 2015 PROSE Award for Multivolume Reference/Science from the Association of American Publishers—builds upon the highly respected first edition in drawing together the new common themes that underlie the many disparate areas of organic chemistry. These themes support effective and efficient synthetic strategies, thus providing a comprehensive overview of this important discipline. Fully revised and updated, this new set forms an essential reference work for all those seeking information on the solution of synthetic problems, whether they are experienced practitioners or chemists whose major interests lie outside organic synthesis. In addition, synthetic chemists requiring the essential facts in new areas, as well as students completely new to the field, will find Comprehensive Organic Synthesis, Second Edition, Nine Volume Set an invaluable source, providing an authoritative overview of core concepts. Winner of the 2015 PROSE Award for Multivolume Reference/Science from the Association of American Publishers Contains more than170 articles across nine volumes, including detailed analysis of core topics such as bonds, oxidation, and reduction Includes more than10,000 schemes and images Fully revised and updated; important growth areas—including combinatorial chemistry, new technological, industrial, and green chemistry developments—are covered extensively
Author: David. J. Fisher
Author: David. J. Fisher
Author: C. Colinge
Author: Inna P. Borovinskaya
Author: Robin Shannon
Author: Robert W. Messler
Author: Masayoshi Esashi
Author: Balázs Illés
Author: Robbin Gourley
Author: Yung-cheng Lee
Author: