Author: Christopher Bruce BlaisPublisher:
ISBN:
Category :
Languages : en
Pages : 290
Book Description
Atmospheric Pressure Deposition of Silicon Nitride Thin Films Using a Dielectric Barrier Discharge as a Plasma Source
Author: Christopher Bruce BlaisPublisher:
ISBN:
Category :
Languages : en
Pages : 290
Book Description
Design of Atomospheric [sic] Pressure Plasma CVD Process for Deposition of Silicon Nitride Thin Films Using Dielectric Barrier Discharge
![Design of Atomospheric [sic] Pressure Plasma CVD Process for Deposition of Silicon Nitride Thin Films Using Dielectric Barrier Discharge PDF](https://books.google.com/books/content/images/frontcover/VKtzXwAACAAJ?fife=w80-h100)
Author: Shunfu HuEncyclopedia of Plasma Technology - Two Volume Set
Author: J. Leon ShohetPublisher: CRC Press
ISBN: 1482214318
Category : Technology & Engineering
Languages : en
Pages : 1654
Book Description
Technical plasmas have a wide range of industrial applications. The Encyclopedia of Plasma Technology covers all aspects of plasma technology from the fundamentals to a range of applications across a large number of industries and disciplines. Topics covered include nanotechnology, solar cell technology, biomedical and clinical applications, electronic materials, sustainability, and clean technologies. The book bridges materials science, industrial chemistry, physics, and engineering, making it a must have for researchers in industry and academia, as well as those working on application-oriented plasma technologies. Also Available Online This Taylor & Francis encyclopedia is also available through online subscription, offering a variety of extra benefits for researchers, students, and librarians, including: Citation tracking and alerts Active reference linking Saved searches and marked lists HTML and PDF format options Contact Taylor and Francis for more information or to inquire about subscription options and print/online combination packages. US: (Tel) 1.888.318.2367; (E-mail) [email protected] International: (Tel) +44 (0) 20 7017 6062; (E-mail) [email protected]
Plasma Deposited Thin Films
Author: MortPublisher: CRC Press
ISBN: 1351092715
Category : Technology & Engineering
Languages : en
Pages : 310
Book Description
In Summary, the objective of this book is to present in one volume a review of the plasma deposition process and the present understanding of the most important and widely used plasma deposited thin film materials, devices and their applications.
Silicon Nitride and Silicon Dioxide Thin Insulating Films VII
Author: Electrochemical Society. MeetingPublisher: The Electrochemical Society
ISBN: 9781566773478
Category : Science
Languages : en
Pages : 652
Book Description
Plasma Sources for Thin Film Deposition and Etching
Author: Maurice H. FrancombePublisher: Academic Press
ISBN: 0080925138
Category : Technology & Engineering
Languages : en
Pages : 343
Book Description
This latest volume of the well-known Physics of Thin Films Series includes four chapters that discuss high-density plasma sources for materials processing, electron cyclotron resonance and its uses, unbalancedmagnetron sputtering, and particle formation in thin film processing plasma. - Chapter One develops a unified framework from which all "high-efficiency" sources may be viewed and compared; outlines key elements of source design affecting processing results; and highlights areas where additional research and development are needed - Chapter Two reviews and analyzes the main types of electron cyclotron resonance (ECR) plasma sources suitable for ECR PACVD of thin films, mainly ECR sources using magnet coils - Chapter Three examines the benefits and limitations of the new technique, unbalanced magnetron sputtering (UBM), along with the motivation for its development, the basic principles of its operation and commercial applications, and some speculations regarding the future of UBM technology - Chapter Four describes general phenomena observed in connection with particle formation in thin film processing plasmas; discusses particles in PECVD plasmas, sputtering plasmas, and RIE plasmas; presents an overview of the theoretical modeling of various aspects of particles in processing plasmas; examines issues of equipment design affecting particle formation; and concludes with remarks about the implications of this work for the control of process-induced particle contamination
Advanced Materials for Membrane Fabrication and Modification
Author: Stephen GrayPublisher: CRC Press
ISBN: 1351730886
Category : Science
Languages : en
Pages : 621
Book Description
Membranes are an energy efficient separation technology that are now the basis for many water treatment and food processing applications. However, there is the potential to improve the operating performance of these separations and to extend the application of membranes to energy production, gas separations, organic solvent-based separations, and biomedical applications through novel membrane materials. This book contains 20 chapters written by leading academic researchers on membrane fabrication and modification techniques and provides a comprehensive overview on the recent developments of membrane technology. Membranes can be manufactured from a range of materials including polymeric compounds, and ceramic materials, and both these materials are considered in the book. There are 5 chapters on water and wastewater membranes that cover the fabrication of thin film (TFC) composite membranes for nanofiltration(NF)/reverse osmosis (RO)/forward osmosis (FO) applications, stimuli responsive membranes, electrospun membranes, porous ceramic membranes, and polymeric ultrafiltration (UF) manufacture and modification. There are another 6 chapters on gas separation that consider carbon membranes, zeolite membranes, silica template and metal oxide silica membranes, TFC membranes, silica membranes, and metal organic framework (MOF) membranes. Zeolite membranes are also considered for organic solvent applications, as are solvent-resistant membranes manufactured by phase inversion, ceramic-supported composite membranes, and ceramic NF membranes. The emerging areas of membranes for energy and biomedical applications have 3 and 2 chapters, respectively. Energy applications consider ion exchange membranes for use in fuel cells, membranes for electrodialysis, and membranes for use in microbial fuel cells. For biomedical applications the chapters focus on hemodialysis membranes and redox responsive membranes.
Atmospheric Pressure Plasma Chemical Deposition by Using Dielectric Barrier Discharge System
Author: Silicon Nitride and Silicon Dioxide Thin Insulating Films
Author: Characteristics of Silicon Nitride Deposited by VHF (162 MHz)-plasma Enhanced Chemical Vapor Deposition Using a Multi-tile Push–pull Plasma Source
Author: Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Abstract: To prevent moisture and oxygen permeation into flexible organic electronic devices formed on substrates, the deposition of an inorganic diffusion barrier material such as SiN x is important for thin film encapsulation. In this study, by a very high frequency (162 MHz) plasma-enhanced chemical vapor deposition (VHF-PECVD) using a multi-tile push–pull plasma source, SiN x layers were deposited with a gas mixture of NH3 /SiH4 with/without N2 and the characteristics of the plasma and the deposited SiN x film as the thin film barrier were investigated. Compared to a lower frequency (60 MHz) plasma, the VHF (162 MHz) multi-tile push–pull plasma showed a lower electron temperature, a higher vibrational temperature, and higher N2 dissociation for an N2 plasma. When a SiN x layer was deposited with a mixture of NH3 /SiH4 with N2 at a low temperature of 100 °C, a stoichiometric amorphous Si3 N4 layer with very low Si–H bonding could be deposited. The 300 nm thick SiN x film exhibited a low water vapor transmission rate of 1.18 × 10 −4 g (m 2 · d) −1, in addition to an optical transmittance of higher than 90%.