Author: Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Application of Chemical-mechanical Polishing to Planarization of Surface-micromachined Devices
Author: Application of Chemical-mechanical Polishing to Planarization of Surface-micromachined Devises
Author: Publisher:
ISBN:
Category :
Languages : en
Pages : 6
Book Description
Chemical-Mechanical Polishing (CMP) has emerged as an enabling technology for manufacturing multi-level metal interconnects used in high-density Integrated Circuits (IC). In this work we present extension of CMP from sub-micron IC manufacturing to fabrication of complex surface-micromachined Micro-ElectroMechanical Systems (MEMS). This planarization technique alleviates processing problems associated with fabrication of multi-level polysilicon structures, eliminates design constraints linked with non-planar topography, and provides an avenue for integrating different process technologies. We discuss the CMP process and present examples of the use of CMP in fabricating MEMS devices such as microengines, pressures sensors, and proof masses for accelerometers along with its use for monolithically integrating MEMS devices with microelectronics.
Chemical Mechanical Polishing
Author: Publisher:
ISBN:
Category :
Languages : en
Pages : 11
Book Description
Chemical-Mechanical-Polishing (CMP), first used as a planarization technology in the manufacture of multi-level metal interconnects for high-density Integrated Circuits (IC), is readily adapted as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. The authors have demonstrated that CMP enhances the design and manufacturability of MEMS devices by eliminating several photolithographic definition and film etch issues generated by severe topography. In addition, CMP planarization readily allows multi-level polysilicon structures comprised of 4- or more levels of polysilicon, eliminates design compromise generated by non-planar topography, and provides an avenue for integrating different process technologies. A recent investigation has also shown that CMP is a valuable tool for assuring acceptable optical flatness of micro-optical components such as micromirrors. Examples of these enhancements include: an extension of polysilicon surface-micromachining fabrication to a 5-level technology, a method of monolithic integration of electronics and MEMS, and optically flat micromirrors.
Chemical Mechanical Polishing 14
Author: R. RhoadesPublisher: The Electrochemical Society
ISBN: 1607687453
Category : Science
Languages : en
Pages : 93
Book Description
Chemical Mechanical Planarization VI
Author: Sudipta SealPublisher: The Electrochemical Society
ISBN: 9781566774048
Category : Technology & Engineering
Languages : en
Pages : 370
Book Description
Chemical-mechanical Polishing
Author: Publisher:
ISBN:
Category : Electrolytic polishing
Languages : en
Pages : 184
Book Description
Chemical Mechanical Polishing 9
Author: G. BanerjeePublisher: The Electrochemical Society
ISBN: 1566776295
Category : Science
Languages : en
Pages : 91
Book Description
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Chemical Mechanical Polishing 9¿, held during the 213th meeting of The Electrochemical Society, in Phoenix, Arizona from May 18-23, 2008.
Chemical-Mechanical Polishing - Fundamentals and Challenges: Volume 566
Author: S. V. BabuPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 304
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Chemical Mechanical Planarization of Microelectronic Materials
Author: Joseph M. SteigerwaldPublisher: John Wiley & Sons
ISBN: 9780471138273
Category : Science
Languages : en
Pages : 354
Book Description
The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Author: Jie ChengPublisher: Springer
ISBN: 9789811355851
Category : Technology & Engineering
Languages : en
Pages : 137
Book Description
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.