Author: Taiheui ChoPublisher:
ISBN:
Category : Anisotropy
Languages : en
Pages : 336
Book Description
Anisotropy of low dielectric constant materials and reliability of Cu/low-k interconnects
Author: Taiheui ChoPublisher:
ISBN:
Category : Anisotropy
Languages : en
Pages : 336
Book Description
Low Dielectric Constant Materials for IC Applications
Author: Paul S. HoPublisher: Springer Science & Business Media
ISBN: 3642559085
Category : Technology & Engineering
Languages : en
Pages : 323
Book Description
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for
Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects
Author: Ting Y. TsuiPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 498
Book Description
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics:
Author: G. S. OehrleinPublisher: Cambridge University Press
ISBN: 9781107413153
Category : Technology & Engineering
Languages : en
Pages : 614
Book Description
This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
Low and High Dielectric Constant Materials
Author: Mark J. LododaPublisher: The Electrochemical Society
ISBN: 9781566772709
Category : Technology & Engineering
Languages : en
Pages : 262
Book Description
Contains papers from a May 2000 symposium, representing the state of the art in areas of dielectric materials science and process integration. Papers are arranged in sections on low and high dielectric constant materials, covering topics such as ammonia plasma passivation effects on properties of post-CMP low-k HSQ, characterization of ashing effects on low-k dielectric films, and electron beam curing of thin film polymer dielectrics. Other subjects include characterization of high-k dielectrics using the non-contact surface charge profiler method, and processing effects and electrical evaluation of ZrO2 formed by RTP oxidation of Zr. Loboda is affiliated with Dow Corning Corporation. c. Book News Inc.
Low and High Dielectric Constant Materials
Author: Rajendra SinghPublisher: The Electrochemical Society
ISBN: 9781566772297
Category : Technology & Engineering
Languages : en
Pages : 242
Book Description
Proceedings of the Second International Symposium on Low and High Dielectric Constant Materials
Author: Hazara S. RathorePublisher: The Electrochemical Society
ISBN: 9781566771351
Category : Science
Languages : en
Pages : 278
Book Description
Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics, 2003
Author: Materials Research Society. MeetingPublisher:
ISBN:
Category : Dielectric films
Languages : en
Pages : 544
Book Description
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004
Author: R. J. CarterPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
Book Description
The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Author: