Author: Kumar, Ashwani
Publisher: IGI Global
ISBN: 1522537236
Category : Technology & Engineering
Languages : en
Pages : 257
Book Description
Recent developments in information processing systems have driven the advancement of numerical simulations in engineering. New models and simulations enable better solutions for problem-solving and overall process improvement. Advanced Numerical Simulations in Mechanical Engineering is a pivotal reference source for the latest research findings on advanced modelling and simulation method adopted in mechanical and mechatronics engineering. Featuring extensive coverage on relevant areas such as fuzzy logic controllers, finite element analysis, and analytical models, this publication is an ideal resource for students, professional engineers, and researchers interested in the application of numerical simulations in mechanical engineering.
Advanced Numerical Simulations in Mechanical Engineering
Author: Kumar, Ashwani
Publisher: IGI Global
ISBN: 1522537236
Category : Technology & Engineering
Languages : en
Pages : 257
Book Description
Recent developments in information processing systems have driven the advancement of numerical simulations in engineering. New models and simulations enable better solutions for problem-solving and overall process improvement. Advanced Numerical Simulations in Mechanical Engineering is a pivotal reference source for the latest research findings on advanced modelling and simulation method adopted in mechanical and mechatronics engineering. Featuring extensive coverage on relevant areas such as fuzzy logic controllers, finite element analysis, and analytical models, this publication is an ideal resource for students, professional engineers, and researchers interested in the application of numerical simulations in mechanical engineering.
Publisher: IGI Global
ISBN: 1522537236
Category : Technology & Engineering
Languages : en
Pages : 257
Book Description
Recent developments in information processing systems have driven the advancement of numerical simulations in engineering. New models and simulations enable better solutions for problem-solving and overall process improvement. Advanced Numerical Simulations in Mechanical Engineering is a pivotal reference source for the latest research findings on advanced modelling and simulation method adopted in mechanical and mechatronics engineering. Featuring extensive coverage on relevant areas such as fuzzy logic controllers, finite element analysis, and analytical models, this publication is an ideal resource for students, professional engineers, and researchers interested in the application of numerical simulations in mechanical engineering.
This Place Sucks
Author: Alien Believer Publishing
Publisher:
ISBN: 9781651840955
Category :
Languages : en
Pages : 100
Book Description
This Place Sucks Space Galaxy UFO Gift For UFO Extraterrestrial Believer is a Great Gift For Funny Alien Space Galaxy Lovers. Perfect For people Who believe in flying saucer, Alien Space Galaxy UFO, abduction with a Galaxy Alien.I Got Aliens in My Basement. Perfect Alien y Alien in the Basement Galaxy gift for who believe that alien exists and UFO conspiracy as scientific fact as they look at the night sky of planets, moon stars space and mars and Alien extraterrestrial believer.
Publisher:
ISBN: 9781651840955
Category :
Languages : en
Pages : 100
Book Description
This Place Sucks Space Galaxy UFO Gift For UFO Extraterrestrial Believer is a Great Gift For Funny Alien Space Galaxy Lovers. Perfect For people Who believe in flying saucer, Alien Space Galaxy UFO, abduction with a Galaxy Alien.I Got Aliens in My Basement. Perfect Alien y Alien in the Basement Galaxy gift for who believe that alien exists and UFO conspiracy as scientific fact as they look at the night sky of planets, moon stars space and mars and Alien extraterrestrial believer.
Silicon Microchannel Heat Sinks
Author: Lian Zhang
Publisher: Springer Science & Business Media
ISBN: 3662098997
Category : Technology & Engineering
Languages : en
Pages : 148
Book Description
Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase-flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 nm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes.
Publisher: Springer Science & Business Media
ISBN: 3662098997
Category : Technology & Engineering
Languages : en
Pages : 148
Book Description
Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase-flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 nm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes.
Heat Transfer and Fluid Flow in Minichannels and Microchannels
Author: Satish Kandlikar
Publisher: Elsevier
ISBN: 9780080445274
Category : Science
Languages : en
Pages : 492
Book Description
&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Publisher: Elsevier
ISBN: 9780080445274
Category : Science
Languages : en
Pages : 492
Book Description
&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Two-phase Flow and Heat Transfer
Author: David Butterworth
Publisher:
ISBN: 9780198517184
Category : Fluid mechanics
Languages : en
Pages : 514
Book Description
Publisher:
ISBN: 9780198517184
Category : Fluid mechanics
Languages : en
Pages : 514
Book Description
Electronic Components and Systems
Author: W. H. Dennis
Publisher: Elsevier
ISBN: 148310334X
Category : Technology & Engineering
Languages : en
Pages : 273
Book Description
Electronic Components and Systems focuses on the principles and processes in the field of electronics and the integrated circuit. Covered in the book are basic aspects and physical fundamentals; different types of materials involved in the field; and passive and active electronic components such as capacitors, inductors, diodes, and transistors. Also covered in the book are topics such as the fabrication of semiconductors and integrated circuits; analog circuitry; digital logic technology; and microprocessors. The monograph is recommended for beginning electrical engineers who would like to know the fundamental concepts, theories, and processes in the related fields.
Publisher: Elsevier
ISBN: 148310334X
Category : Technology & Engineering
Languages : en
Pages : 273
Book Description
Electronic Components and Systems focuses on the principles and processes in the field of electronics and the integrated circuit. Covered in the book are basic aspects and physical fundamentals; different types of materials involved in the field; and passive and active electronic components such as capacitors, inductors, diodes, and transistors. Also covered in the book are topics such as the fabrication of semiconductors and integrated circuits; analog circuitry; digital logic technology; and microprocessors. The monograph is recommended for beginning electrical engineers who would like to know the fundamental concepts, theories, and processes in the related fields.
Shape and Structure, from Engineering to Nature
Author: Adrian Bejan
Publisher: Cambridge University Press
ISBN: 9780521793889
Category : Science
Languages : en
Pages : 370
Book Description
Seemingly universal geometric forms unite the flow systems of engineering and nature. For example, tree-shaped flows can be seen in computers, lungs, dendritic crystals, urban street patterns, and communication links. In this groundbreaking book, Adrian Bejan considers the design and optimization of engineered systems and discovers a deterministic principle of the generation of geometric form in natural systems. Shape and structure spring from the struggle for better performance in both engineering and nature. This idea is the basis of the new constructal theory: the objective and constraints principle used in engineering is the same mechanism from which the geometry in natural flow systems emerges. From heat exchangers to river channels, the book draws many parallels between the engineered and the natural world. Among the topics covered are mechanical structure, thermal structure, heat trees, ducts and rivers, turbulent structure, and structure in transportation and economics. The numerous illustrations, examples, and homework problems in every chapter make this an ideal text for engineering design courses. Its provocative ideas will also appeal to a broad range of readers in engineering, natural sciences, economics, and business.
Publisher: Cambridge University Press
ISBN: 9780521793889
Category : Science
Languages : en
Pages : 370
Book Description
Seemingly universal geometric forms unite the flow systems of engineering and nature. For example, tree-shaped flows can be seen in computers, lungs, dendritic crystals, urban street patterns, and communication links. In this groundbreaking book, Adrian Bejan considers the design and optimization of engineered systems and discovers a deterministic principle of the generation of geometric form in natural systems. Shape and structure spring from the struggle for better performance in both engineering and nature. This idea is the basis of the new constructal theory: the objective and constraints principle used in engineering is the same mechanism from which the geometry in natural flow systems emerges. From heat exchangers to river channels, the book draws many parallels between the engineered and the natural world. Among the topics covered are mechanical structure, thermal structure, heat trees, ducts and rivers, turbulent structure, and structure in transportation and economics. The numerous illustrations, examples, and homework problems in every chapter make this an ideal text for engineering design courses. Its provocative ideas will also appeal to a broad range of readers in engineering, natural sciences, economics, and business.
Electronics Cooling
Author: S. M. Sohel Murshed
Publisher: BoD – Books on Demand
ISBN: 9535124056
Category : Computers
Languages : en
Pages : 184
Book Description
Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Publisher: BoD – Books on Demand
ISBN: 9535124056
Category : Computers
Languages : en
Pages : 184
Book Description
Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Conjugate Problems in Convective Heat Transfer
Author: Abram S. Dorfman
Publisher: CRC Press
ISBN: 9781420082388
Category : Science
Languages : en
Pages : 456
Book Description
Illustrates Calculations Using Machine and Technological Processes The conjugate heat transfer (CHT) problem addresses the thermal interaction between a body and fluid flowing over or through it. This is an essential consideration in nature and different areas of engineering, including mechanics, aerospace, nuclear engineering, biology, and meteorology. Advanced conjugate modeling of the heat transfer process is now used extensively in a wide range of applications. Conjugate Problems in Convective Heat Transfer addresses the latest theory, methods, and applications associated with both analytical and numerical methods of solution CHT problems and their exact and approximate solutions. It demonstrates how the true value of a CHT solution is derived by applying these solutions to contemporary engineering design analysis. Assembling cutting-edge information on modern modeling from more than 200 publications, this book presents more than 100 example applications in thermal treatment materials, machinery operation, and technological processes. Creating a practical review of current CHT development, the author includes methods associated with estimating heat transfer, particularly that from arbitrary non-isothermal surfaces in both laminar and turbulent flows. Harnesses the Modeling Power of CHT Unique in its consistent compilation and application of current knowledge, this book presents advanced CHT analysis as a powerful tool for modeling various device operations and technological processes, from relatively simple procedures to complex multistage, nonlinear processes.
Publisher: CRC Press
ISBN: 9781420082388
Category : Science
Languages : en
Pages : 456
Book Description
Illustrates Calculations Using Machine and Technological Processes The conjugate heat transfer (CHT) problem addresses the thermal interaction between a body and fluid flowing over or through it. This is an essential consideration in nature and different areas of engineering, including mechanics, aerospace, nuclear engineering, biology, and meteorology. Advanced conjugate modeling of the heat transfer process is now used extensively in a wide range of applications. Conjugate Problems in Convective Heat Transfer addresses the latest theory, methods, and applications associated with both analytical and numerical methods of solution CHT problems and their exact and approximate solutions. It demonstrates how the true value of a CHT solution is derived by applying these solutions to contemporary engineering design analysis. Assembling cutting-edge information on modern modeling from more than 200 publications, this book presents more than 100 example applications in thermal treatment materials, machinery operation, and technological processes. Creating a practical review of current CHT development, the author includes methods associated with estimating heat transfer, particularly that from arbitrary non-isothermal surfaces in both laminar and turbulent flows. Harnesses the Modeling Power of CHT Unique in its consistent compilation and application of current knowledge, this book presents advanced CHT analysis as a powerful tool for modeling various device operations and technological processes, from relatively simple procedures to complex multistage, nonlinear processes.
Liquid Cooling of Electronic Devices by Single-Phase Convection
Author: Frank P. Incropera
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 312
Book Description
Liquid Cooling of Electronic Devices by Single-Phase Convection offers the first comprehensive and in-depth coverage of liquid convection as it applies to state-of-the-art thermal management systems. In this book, Dr. Incropera culls ten years of research results, clarifies the physical mechanisms associated with single-phase convection in the context of electronic cooling, and provides working engineers with a solid foundation for the design and development of rational liquid cooling systems. For those involved in designing these products - mechanical and electrical engineers, electronic packaging engineers, technical staff, and others - this book provides an invaluable road map to meet the challenge.
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 312
Book Description
Liquid Cooling of Electronic Devices by Single-Phase Convection offers the first comprehensive and in-depth coverage of liquid convection as it applies to state-of-the-art thermal management systems. In this book, Dr. Incropera culls ten years of research results, clarifies the physical mechanisms associated with single-phase convection in the context of electronic cooling, and provides working engineers with a solid foundation for the design and development of rational liquid cooling systems. For those involved in designing these products - mechanical and electrical engineers, electronic packaging engineers, technical staff, and others - this book provides an invaluable road map to meet the challenge.