Investigation of Forced-convection Nucleate Boiling of Water for Nozzle Cooling at Very High Heat Fluxes PDF Download

Author: John W. Schaefer
Publisher:
ISBN:
Category : Heat flux
Languages : en
Pages : 52

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Author: Pankaj Saha
Publisher: Springer
ISBN: 9811364168
Category : Technology & Engineering
Languages : en
Pages : 831

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Book Description
This book comprises select proceedings of the International Conference on Future Learning Aspects of Mechanical Engineering (FLAME 2018). The book gives an overview of recent developments in the field of thermal and fluid engineering, and covers theoretical and experimental fluid dynamics, numerical methods in heat transfer and fluid mechanics, different modes of heat transfer, multiphase transport and phase change, fluid machinery, turbo machinery, and fluid power. The book is primarily intended for researchers and professionals working in the field of fluid dynamics and thermal engineering.

Author: S. M. Sohel Murshed
Publisher: BoD – Books on Demand
ISBN: 1789848385
Category : Science
Languages : en
Pages : 154

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Book Description
Since conventional cooling techniques are increasing falling short of meeting the ever-growing cooling demands of high heat generating devices, thermal systems, and processes, advanced and innovative cooling technologies are of immense importance to deal with such high thermal management. Hence, this book covers a number of key topics related to advanced cooling approaches, their performance, and applications, including: Evaporative air cooling; Spray impingement cooling; Heat pump-based cooling; Modular cooling for photovoltaic plant; Nucleate pool boiling of refrigerants; Transient flashing spray cooling and application; Compressor cooling systems for industry. The book is aimed at a wide variety of people from graduate students and researchers to manufacturers who are involved or interested in the areas of thermal management systems, cooling technologies, and their applications.

Author: S. Kakaç
Publisher: Springer Science & Business Media
ISBN: 1402033613
Category : Technology & Engineering
Languages : en
Pages : 517

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Book Description
This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.

Author: J.A. Reizes
Publisher: Elsevier
ISBN: 0444599797
Category : Technology & Engineering
Languages : en
Pages : 833

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Book Description
Theoretical, numerical and experimental studies of transport phenomena in heat and mass transfer are reported in depth in this volume. Papers are presented which review and discuss the most recent developments in areas such as: Mass transfer; Cooling of electronic components; Phase change processes; Instrumentation techniques; Numerical methods; Heat transfer in rotating machinery; Hypersonic flows; and Industrial applications. Bringing together the experience of specialists in these fields, the volume will be of interest to researchers and practising engineers who wish to enhance their knowledge in these rapidly developing areas.

Author: Vincenzo Bianco
Publisher: CRC Press
ISBN: 1482254026
Category : Science
Languages : en
Pages : 473

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Book Description
Nanofluids are gaining the attention of scientists and researchers around the world. This new category of heat transfer medium improves the thermal conductivity of fluid by suspending small solid particles within it and offers the possibility of increased heat transfer in a variety of applications. Bringing together expert contributions from

Author: Frank Kreith
Publisher: Springer Science & Business Media
ISBN: 3662301822
Category : Science
Languages : en
Pages : 400

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Book Description
to increase the use of direct contact processes, the National Science Foundation sup ported a workshop on direct contact heat transfer at the Solar Energy Research Insti tute in the summer of 1985. We served as organizers for this workshop, which em phasized an area of thermal engineering that, in our opinion, has great promise for the future, but has not yet reached the point of wide-spread commercial application. Hence, a summary of the state of knowledge at this point is timely. The workshop had a dual objective: 1. To summarize the current state of knowledge in such a form that industrial practi tioners can make use of the available information. 2. To indicate the research and development needed to advance the state-of-the-art, indicating not only what kind of research is needed, but also the industrial poten tial that could be realized if the information to be obtained through the proposed research activities were available.

Author: Muhannad S. Bakir
Publisher: Artech House
ISBN: 1596932473
Category : Technology & Engineering
Languages : en
Pages : 551

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Book Description
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.

Author: Madhusudan Iyengar
Publisher: World Scientific
ISBN: 9811279381
Category : Technology & Engineering
Languages : en
Pages : 479

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Book Description
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.

Author: Arthur H. Lefebvre
Publisher: CRC Press
ISBN: 1498736262
Category : Technology & Engineering
Languages : en
Pages : 284

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Book Description
The second edition of this long-time bestseller provides a framework for designing and understanding sprays for a wide array of engineering applications. The text contains correlations and design tools that can be easily understood and used in relating the design of atomizers to the resulting spray behavior. Written to be accessible to readers with a modest technical background, the emphasis is on application rather than in-depth theory. Numerous examples are provided to serve as starting points for using the information in the book. Overall, this is a thoroughly updated edition that still retains the practical focus and readability of the original work by Arthur Lefebvre.