A One-Semester Course in Modeling of VSLI Interconnections PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download A One-Semester Course in Modeling of VSLI Interconnections PDF full book. Access full book title A One-Semester Course in Modeling of VSLI Interconnections by Ashok Goel. Download full books in PDF and EPUB format.
Author: Ashok Goel Publisher: ISBN: 9781606505120 Category : Computers Languages : en Pages : 0
Book Description
The optimum design of state-of-the-art integrated circuits relies heavily on quantitative understanding of the parasitic capacitances and inductances in the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrate circuits (VSLI). This is because more than 65% of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Modeling of VSLI Interconnections will discuss the mathematical techniques necessary to model the parasitic capacitances, inductances, propagation delays, crosstalk noise and electro migration-induced failure associated with the interconnections in the realistic high-density environment on a chip. This book will be the first of its kind written for a one-semester course on the mathematical modeling of metallic interconnections on a VLSI circuit. In most institutions around the world, this course will be offered at an upper-level undergraduate and beginning graduate level. The book will also be of interest to practicing engineers in the field who are looking for a quick refresher on the subject.
Author: Ashok Goel Publisher: ISBN: 9781606505120 Category : Computers Languages : en Pages : 0
Book Description
The optimum design of state-of-the-art integrated circuits relies heavily on quantitative understanding of the parasitic capacitances and inductances in the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrate circuits (VSLI). This is because more than 65% of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Modeling of VSLI Interconnections will discuss the mathematical techniques necessary to model the parasitic capacitances, inductances, propagation delays, crosstalk noise and electro migration-induced failure associated with the interconnections in the realistic high-density environment on a chip. This book will be the first of its kind written for a one-semester course on the mathematical modeling of metallic interconnections on a VLSI circuit. In most institutions around the world, this course will be offered at an upper-level undergraduate and beginning graduate level. The book will also be of interest to practicing engineers in the field who are looking for a quick refresher on the subject.
Author: Ashok Goel Publisher: Momentum Press ISBN: 1606505130 Category : Technology & Engineering Languages : en Pages : 394
Book Description
Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.
Author: Michel S. Nakhla Publisher: Springer Science & Business Media ISBN: 146152718X Category : Technology & Engineering Languages : en Pages : 104
Book Description
Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
Author: Hartmut Grabinski Publisher: Springer Science & Business Media ISBN: 1461543495 Category : Technology & Engineering Languages : en Pages : 234
Book Description
This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
Author: Ashok K. Goel Publisher: John Wiley & Sons ISBN: 0470165960 Category : Technology & Engineering Languages : en Pages : 433
Book Description
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Author: Ashok K. Goel Publisher: Wiley-Interscience ISBN: Category : Computers Languages : en Pages : 660
Book Description
In recent years, customer demands for higher speeds and smaller chips have resulted in the use of interconnections in multilevel and multilayer configurations. Various issues associated with very large scale integrated circuit (VLSIC) interconnections used for high-speed applications are emphasized. Written for those who want to gain a better understanding of the factors associated with modeling, analyzing and simulating high-density, high-speed interconnections, the chapters are designed so that they can be read independently.
Author: Andrew B. Kahng Publisher: Springer Science & Business Media ISBN: 1475723636 Category : Technology & Engineering Languages : en Pages : 301
Book Description
On Optimal Interconnections for VLSI describes, from a geometric perspective, algorithms for high-performance, high-density interconnections during the global and detailed routing phases of circuit layout. First, the book addresses area minimization, with a focus on near-optimal approximation algorithms for minimum-cost Steiner routing. In addition to practical implementations of recent methods, the implications of recent results on spanning tree degree bounds and the method of Zelikovsky are discussed. Second, the book addresses delay minimization, starting with a discussion of accurate, yet algorithmically tractable, delay models. Recent minimum-delay constructions are highlighted, including provably good cost-radius tradeoffs, critical-sink routing algorithms, Elmore delay-optimal routing, graph Steiner arborescences, non-tree routing, and wiresizing. Third, the book addresses skew minimization for clock routing and prescribed-delay routing formulations. The discussion starts with early matching-based constructions and goes on to treat zero-skew routing with provably minimum wirelength, as well as planar clock routing. Finally, the book concludes with a discussion of multiple (competing) objectives, i.e., how to optimize area, delay, skew, and other objectives simultaneously. These techniques are useful when the routing instance has heterogeneous resources or is highly congested, as in FPGA routing, multi-chip packaging, and very dense layouts. Throughout the book, the emphasis is on practical algorithms and a complete self-contained development. On Optimal Interconnections for VLSI will be of use to both circuit designers (CAD tool users) as well as researchers and developers in the area of performance-driven physical design.
Author: Ashok Goel
Author: Ashok Goel
Author: Ashok Goel
Author: Michel S. Nakhla
Author: Hartmut Grabinski
Author: Sudhakar Muddu
Author: Ashok K. Goel
Author: Ashok K. Goel
Author: Steven Paul McCormick
Author: Andrew B. Kahng
Author: Andrew B. Kahng