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Author: S. M. Sohel Murshed Publisher: BoD – Books on Demand ISBN: 1789848385 Category : Science Languages : en Pages : 154
Book Description
Since conventional cooling techniques are increasing falling short of meeting the ever-growing cooling demands of high heat generating devices, thermal systems, and processes, advanced and innovative cooling technologies are of immense importance to deal with such high thermal management. Hence, this book covers a number of key topics related to advanced cooling approaches, their performance, and applications, including: Evaporative air cooling; Spray impingement cooling; Heat pump-based cooling; Modular cooling for photovoltaic plant; Nucleate pool boiling of refrigerants; Transient flashing spray cooling and application; Compressor cooling systems for industry. The book is aimed at a wide variety of people from graduate students and researchers to manufacturers who are involved or interested in the areas of thermal management systems, cooling technologies, and their applications.
Author: S. M. Sohel Murshed Publisher: BoD – Books on Demand ISBN: 1789848385 Category : Science Languages : en Pages : 154
Book Description
Since conventional cooling techniques are increasing falling short of meeting the ever-growing cooling demands of high heat generating devices, thermal systems, and processes, advanced and innovative cooling technologies are of immense importance to deal with such high thermal management. Hence, this book covers a number of key topics related to advanced cooling approaches, their performance, and applications, including: Evaporative air cooling; Spray impingement cooling; Heat pump-based cooling; Modular cooling for photovoltaic plant; Nucleate pool boiling of refrigerants; Transient flashing spray cooling and application; Compressor cooling systems for industry. The book is aimed at a wide variety of people from graduate students and researchers to manufacturers who are involved or interested in the areas of thermal management systems, cooling technologies, and their applications.
Author: Frank Kreith Publisher: Springer Science & Business Media ISBN: 3662301822 Category : Science Languages : en Pages : 400
Book Description
to increase the use of direct contact processes, the National Science Foundation sup ported a workshop on direct contact heat transfer at the Solar Energy Research Insti tute in the summer of 1985. We served as organizers for this workshop, which em phasized an area of thermal engineering that, in our opinion, has great promise for the future, but has not yet reached the point of wide-spread commercial application. Hence, a summary of the state of knowledge at this point is timely. The workshop had a dual objective: 1. To summarize the current state of knowledge in such a form that industrial practi tioners can make use of the available information. 2. To indicate the research and development needed to advance the state-of-the-art, indicating not only what kind of research is needed, but also the industrial poten tial that could be realized if the information to be obtained through the proposed research activities were available.
Author: Arthur H. Lefebvre Publisher: CRC Press ISBN: 1498736262 Category : Technology & Engineering Languages : en Pages : 284
Book Description
The second edition of this long-time bestseller provides a framework for designing and understanding sprays for a wide array of engineering applications. The text contains correlations and design tools that can be easily understood and used in relating the design of atomizers to the resulting spray behavior. Written to be accessible to readers with a modest technical background, the emphasis is on application rather than in-depth theory. Numerous examples are provided to serve as starting points for using the information in the book. Overall, this is a thoroughly updated edition that still retains the practical focus and readability of the original work by Arthur Lefebvre.
Author: Martin Rein Publisher: Springer Science & Business Media ISBN: 9783211836927 Category : Computers Languages : en Pages : 328
Book Description
This book presents a comprehensive overview of fluid mechanical, thermal and physico-chemical aspects of drop-surface interactions. Basic physical mechanisms pertaining to free-surface flow phenomena characteristic of drop impact on solid and liquid surfaces are explained emphasizing the importance of scaling. Moreover, physico-chemical fundamentals relating to a forced spreading of complex solutions, analytical tools for calculating compressibility effects, and heat transfer and phase change phenomena occurring during solidification and evaporation processes, respectively, are introduced in detail. Finally, numerical approaches particularly suited for modeling drop-surface interactions are consisely surveyed with a particular emphasis on boundary integral methods and Navier-Stokes algorithms (volume of fluid, level set and front tracking algorithms). The book is closed by contributions to a workshop on Drop-Surface Interactions held at the International Centre of Mechanical Sciences.
Author: Bengt Sundén Publisher: WIT Press ISBN: 184564462X Category : Technology & Engineering Languages : en Pages : 354
Book Description
.".. Eleventh International Conference on Advanced Computational Methods and Experimental Measurements in Heat Transfer and Mass Transfer held in Tallinn, Estonia in 2010"--Pref.
Author: Muhannad S. Bakir Publisher: Artech House ISBN: 1596932473 Category : Technology & Engineering Languages : en Pages : 551
Book Description
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Author: S. M. Sohel Murshed
Author: S. M. Sohel Murshed
Author: Frank Kreith
Author: Arthur H. Lefebvre
Author: 
Author: Martin Rein
Author: Bengt Sundén
Author: John W. Schaefer
Author: Ali M. Khounsary
Author: 
Author: Muhannad S. Bakir