Author: IEEE Staff
Publisher:
ISBN: 9781728168050
Category :
Languages : en
Pages :
Book Description
This conference represents a unique and unprecedented opportunity to bring together scientists around the world that works on filters, to share the most recent advances in filter theory, technology and manufacturing After this first event, the conference is supposed to start rotating in different continents Thanks of its topic and location, this conference can represent a good opportunity to have periodic meetings for the filter community, as well as to involve and meet the microwave community around the world that is interested in filters but that have not the possibility of joining IMS
2021 IEEE MTT S International Microwave Filter Workshop (IMFW)
Author: IEEE Staff
Publisher:
ISBN: 9781728168050
Category :
Languages : en
Pages :
Book Description
This conference represents a unique and unprecedented opportunity to bring together scientists around the world that works on filters, to share the most recent advances in filter theory, technology and manufacturing After this first event, the conference is supposed to start rotating in different continents Thanks of its topic and location, this conference can represent a good opportunity to have periodic meetings for the filter community, as well as to involve and meet the microwave community around the world that is interested in filters but that have not the possibility of joining IMS
Publisher:
ISBN: 9781728168050
Category :
Languages : en
Pages :
Book Description
This conference represents a unique and unprecedented opportunity to bring together scientists around the world that works on filters, to share the most recent advances in filter theory, technology and manufacturing After this first event, the conference is supposed to start rotating in different continents Thanks of its topic and location, this conference can represent a good opportunity to have periodic meetings for the filter community, as well as to involve and meet the microwave community around the world that is interested in filters but that have not the possibility of joining IMS
Design for Additive Manufacturing
Author: Roland Lachmayer
Publisher: Springer Nature
ISBN: 3662684632
Category :
Languages : en
Pages : 262
Book Description
Publisher: Springer Nature
ISBN: 3662684632
Category :
Languages : en
Pages : 262
Book Description
Resilient Hybrid Electronics for Extreme/Harsh Environments
Author: Amanda Schrand
Publisher: CRC Press
ISBN: 1003857183
Category : Technology & Engineering
Languages : en
Pages : 187
Book Description
The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.
Publisher: CRC Press
ISBN: 1003857183
Category : Technology & Engineering
Languages : en
Pages : 187
Book Description
The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.
The Proceedings of 2022 International Conference on Wireless Power Transfer (ICWPT2022)
Author: Chengbin Ma
Publisher: Springer Nature
ISBN: 9819906318
Category : Technology & Engineering
Languages : en
Pages : 1213
Book Description
This book includes original, peer-reviewed research papers from the 2022 International Conference on Wireless Power Transfer (ICWPT2022), held in Chongqing, China. The topics covered include but are not limited to: wireless power transfer technology and systems, coupling mechanism and electromagnetic field of wireless power transfer systems, latest developments in wireless power transfer system, and wide applications. The papers share the latest findings in the field of wireless power transfer, making the book a valuable asset for researchers, engineers, university students, etc
Publisher: Springer Nature
ISBN: 9819906318
Category : Technology & Engineering
Languages : en
Pages : 1213
Book Description
This book includes original, peer-reviewed research papers from the 2022 International Conference on Wireless Power Transfer (ICWPT2022), held in Chongqing, China. The topics covered include but are not limited to: wireless power transfer technology and systems, coupling mechanism and electromagnetic field of wireless power transfer systems, latest developments in wireless power transfer system, and wide applications. The papers share the latest findings in the field of wireless power transfer, making the book a valuable asset for researchers, engineers, university students, etc
Special Topics in Information Technology
Author: Francesco Amigoni
Publisher: Springer Nature
ISBN: 3031515005
Category :
Languages : en
Pages : 153
Book Description
Publisher: Springer Nature
ISBN: 3031515005
Category :
Languages : en
Pages : 153
Book Description
Proceedings of the 2nd International Conference on Electronic Engineering and Renewable Energy Systems
Author: Bekkay Hajji
Publisher: Springer Nature
ISBN: 9811562598
Category : Technology & Engineering
Languages : en
Pages : 858
Book Description
This book includes papers presented at the Second International Conference on Electronic Engineering and Renewable Energy (ICEERE 2020), which focus on the application of artificial intelligence techniques, emerging technology and the Internet of things in electrical and renewable energy systems, including hybrid systems, micro-grids, networking, smart health applications, smart grid, mechatronics and electric vehicles. It particularly focuses on new renewable energy technologies for agricultural and rural areas to promote the development of the Euro-Mediterranean region. Given its scope, the book is of interest to graduate students, researchers and practicing engineers working in the fields of electronic engineering and renewable energy.
Publisher: Springer Nature
ISBN: 9811562598
Category : Technology & Engineering
Languages : en
Pages : 858
Book Description
This book includes papers presented at the Second International Conference on Electronic Engineering and Renewable Energy (ICEERE 2020), which focus on the application of artificial intelligence techniques, emerging technology and the Internet of things in electrical and renewable energy systems, including hybrid systems, micro-grids, networking, smart health applications, smart grid, mechatronics and electric vehicles. It particularly focuses on new renewable energy technologies for agricultural and rural areas to promote the development of the Euro-Mediterranean region. Given its scope, the book is of interest to graduate students, researchers and practicing engineers working in the fields of electronic engineering and renewable energy.
Internet of Things
Author: Subhas Chandra Mukhopadhyay
Publisher: Springer Science & Business Media
ISBN: 3319042238
Category : Technology & Engineering
Languages : en
Pages : 259
Book Description
Advancement in sensor technology, smart instrumentation, wireless sensor networks, miniaturization, RFID and information processing is helping towards the realization of Internet of Things (IoT). IoTs are finding applications in various area applications including environmental monitoring, intelligent buildings, smart grids and so on. This book provides design challenges of IoT, theory, various protocols, implementation issues and a few case study. The book will be very useful for postgraduate students and researchers to know from basics to implementation of IoT.
Publisher: Springer Science & Business Media
ISBN: 3319042238
Category : Technology & Engineering
Languages : en
Pages : 259
Book Description
Advancement in sensor technology, smart instrumentation, wireless sensor networks, miniaturization, RFID and information processing is helping towards the realization of Internet of Things (IoT). IoTs are finding applications in various area applications including environmental monitoring, intelligent buildings, smart grids and so on. This book provides design challenges of IoT, theory, various protocols, implementation issues and a few case study. The book will be very useful for postgraduate students and researchers to know from basics to implementation of IoT.
Microwave Filters, Impedance-matching Networks, and Coupling Structures
Author: George L. Matthaei
Publisher:
ISBN:
Category : Electric filters
Languages : en
Pages : 1134
Book Description
Publisher:
ISBN:
Category : Electric filters
Languages : en
Pages : 1134
Book Description
Millimeter Wave Radar
Author: Stephen L. Johnston
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 686
Book Description
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 686
Book Description
Advances in Decision Sciences, Image Processing, Security and Computer Vision
Author: Suresh Chandra Satapathy
Publisher: Springer
ISBN: 3030243222
Category : Technology & Engineering
Languages : en
Pages : 838
Book Description
This book constitutes the proceedings of the First International Conference on Emerging Trends in Engineering (ICETE), held at University College of Engineering and organised by the Alumni Association, University College of Engineering, Osmania University, in Hyderabad, India on 22–23 March 2019. The proceedings of the ICETE are published in three volumes, covering seven areas: Biomedical, Civil, Computer Science, Electrical & Electronics, Electronics & Communication, Mechanical, and Mining Engineering. The 215 peer-reviewed papers from around the globe present the latest state-of-the-art research, and are useful to postgraduate students, researchers, academics and industry engineers working in the respective fields. Volume 1 presents papers on the theme “Advances in Decision Sciences, Image Processing, Security and Computer Vision – International Conference on Emerging Trends in Engineering (ICETE)”. It includes state-of-the-art technical contributions in the area of biomedical and computer science engineering, discussing sustainable developments in the field, such as instrumentation and innovation, signal and image processing, Internet of Things, cryptography and network security, data mining and machine learning.
Publisher: Springer
ISBN: 3030243222
Category : Technology & Engineering
Languages : en
Pages : 838
Book Description
This book constitutes the proceedings of the First International Conference on Emerging Trends in Engineering (ICETE), held at University College of Engineering and organised by the Alumni Association, University College of Engineering, Osmania University, in Hyderabad, India on 22–23 March 2019. The proceedings of the ICETE are published in three volumes, covering seven areas: Biomedical, Civil, Computer Science, Electrical & Electronics, Electronics & Communication, Mechanical, and Mining Engineering. The 215 peer-reviewed papers from around the globe present the latest state-of-the-art research, and are useful to postgraduate students, researchers, academics and industry engineers working in the respective fields. Volume 1 presents papers on the theme “Advances in Decision Sciences, Image Processing, Security and Computer Vision – International Conference on Emerging Trends in Engineering (ICETE)”. It includes state-of-the-art technical contributions in the area of biomedical and computer science engineering, discussing sustainable developments in the field, such as instrumentation and innovation, signal and image processing, Internet of Things, cryptography and network security, data mining and machine learning.