Author: Biplab Sikdar
Publisher: Springer Nature
ISBN: 9811691541
Category : Technology & Engineering
Languages : en
Pages : 752
Book Description
This book provides insights into the 3rd International Conference on Communication, Devices and Computing (ICCDC 2021), which was held in Haldia, India, on August 16–18, 2021. It covers new ideas, applications, and the experiences of research engineers, scientists, industrialists, scholars, and students from around the globe. The proceedings highlight cutting-edge research on communication, electronic devices, and computing and address diverse areas such as 5G communication, spread spectrum systems, wireless sensor networks, and signal processing for secure communication, error control coding, printed antennas, analysis of wireless networks, antenna array systems, analog and digital signal processing for communication systems, frequency selective surfaces, radar communication, and substrate integrated waveguide and microwave passive components, which are key to state-of-the-art innovations in communication technologies.
Proceedings of the 3rd International Conference on Communication, Devices and Computing
Author: Biplab Sikdar
Publisher: Springer Nature
ISBN: 9811691541
Category : Technology & Engineering
Languages : en
Pages : 752
Book Description
This book provides insights into the 3rd International Conference on Communication, Devices and Computing (ICCDC 2021), which was held in Haldia, India, on August 16–18, 2021. It covers new ideas, applications, and the experiences of research engineers, scientists, industrialists, scholars, and students from around the globe. The proceedings highlight cutting-edge research on communication, electronic devices, and computing and address diverse areas such as 5G communication, spread spectrum systems, wireless sensor networks, and signal processing for secure communication, error control coding, printed antennas, analysis of wireless networks, antenna array systems, analog and digital signal processing for communication systems, frequency selective surfaces, radar communication, and substrate integrated waveguide and microwave passive components, which are key to state-of-the-art innovations in communication technologies.
Publisher: Springer Nature
ISBN: 9811691541
Category : Technology & Engineering
Languages : en
Pages : 752
Book Description
This book provides insights into the 3rd International Conference on Communication, Devices and Computing (ICCDC 2021), which was held in Haldia, India, on August 16–18, 2021. It covers new ideas, applications, and the experiences of research engineers, scientists, industrialists, scholars, and students from around the globe. The proceedings highlight cutting-edge research on communication, electronic devices, and computing and address diverse areas such as 5G communication, spread spectrum systems, wireless sensor networks, and signal processing for secure communication, error control coding, printed antennas, analysis of wireless networks, antenna array systems, analog and digital signal processing for communication systems, frequency selective surfaces, radar communication, and substrate integrated waveguide and microwave passive components, which are key to state-of-the-art innovations in communication technologies.
Proceedings of Sixth International Conference on Inventive Material Science Applications
Author: V. Bindhu
Publisher: Springer Nature
ISBN: 981994189X
Category : Technology & Engineering
Languages : en
Pages : 161
Book Description
The book is a collection of best selected research papers presented at the 6th International Conference on Inventive Material Science Applications (ICIMA 2023) organized by PPG Institute of Technology, Coimbatore, India, during May 11–12, 2023. The book includes original research by material science researchers toward developing a compact and efficient functional elements and structures for micro-, nano-, and optoelectronic applications. The book covers important topics like nanomaterials and devices, optoelectronics, sustainable electronic materials, nanocomposites and nanostructures, hybrid electronic materials, medical electronics, computational material science, wearable electronic devices and models, and optical/nanosensors.
Publisher: Springer Nature
ISBN: 981994189X
Category : Technology & Engineering
Languages : en
Pages : 161
Book Description
The book is a collection of best selected research papers presented at the 6th International Conference on Inventive Material Science Applications (ICIMA 2023) organized by PPG Institute of Technology, Coimbatore, India, during May 11–12, 2023. The book includes original research by material science researchers toward developing a compact and efficient functional elements and structures for micro-, nano-, and optoelectronic applications. The book covers important topics like nanomaterials and devices, optoelectronics, sustainable electronic materials, nanocomposites and nanostructures, hybrid electronic materials, medical electronics, computational material science, wearable electronic devices and models, and optical/nanosensors.
Proceedings of the Third International Conference on Microelectronics, Computing and Communication Systems
Author: Vijay Nath
Publisher: Springer
ISBN: 9811370915
Category : Technology & Engineering
Languages : en
Pages : 673
Book Description
The book presents high-quality papers from the Third International Conference on Microelectronics, Computing & Communication Systems (MCCS 2018). It discusses the latest technological trends and advances in MEMS and nanoelectronics, wireless communications, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems, and sensor network applications. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed in the book provide excellent reference material for future product development.
Publisher: Springer
ISBN: 9811370915
Category : Technology & Engineering
Languages : en
Pages : 673
Book Description
The book presents high-quality papers from the Third International Conference on Microelectronics, Computing & Communication Systems (MCCS 2018). It discusses the latest technological trends and advances in MEMS and nanoelectronics, wireless communications, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems, and sensor network applications. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed in the book provide excellent reference material for future product development.
Design, Manufacturing And Mechatronics - Proceedings Of The International Conference On Design, Manufacturing And Mechatronics (Icdmm2016)
Author: A Mehran Shahhosseini
Publisher: World Scientific
ISBN: 9813208333
Category : Technology & Engineering
Languages : en
Pages : 758
Book Description
The 3rd Annual International Conference on Design, Manufacturing and Mechatronics (ICDMM2016) was successfully held in Wuhan, China in 2016.The ICDMM2016 covers a wide range of fundamental studies, technical innovations and industrial applications in industry design, manufacturing and mechatronics. The ICDMM2016 program consists of 4 keynote speeches, 96 oral and poster presentations. We were pleased to have more than 80 participants from China, South Korea, Taiwan, Japan, Malaysia, and Saudi Arabia. However, finally, only 83 articles were selected after peer review to be included in this proceedings.
Publisher: World Scientific
ISBN: 9813208333
Category : Technology & Engineering
Languages : en
Pages : 758
Book Description
The 3rd Annual International Conference on Design, Manufacturing and Mechatronics (ICDMM2016) was successfully held in Wuhan, China in 2016.The ICDMM2016 covers a wide range of fundamental studies, technical innovations and industrial applications in industry design, manufacturing and mechatronics. The ICDMM2016 program consists of 4 keynote speeches, 96 oral and poster presentations. We were pleased to have more than 80 participants from China, South Korea, Taiwan, Japan, Malaysia, and Saudi Arabia. However, finally, only 83 articles were selected after peer review to be included in this proceedings.
VLSI Design and Test
Author: S. Rajaram
Publisher: Springer
ISBN: 9811359504
Category : Computers
Languages : en
Pages : 728
Book Description
This book constitutes the refereed proceedings of the 22st International Symposium on VLSI Design and Test, VDAT 2018, held in Madurai, India, in June 2018. The 39 full papers and 11 short papers presented together with 8 poster papers were carefully reviewed and selected from 231 submissions. The papers are organized in topical sections named: digital design; analog and mixed signal design; hardware security; micro bio-fluidics; VLSI testing; analog circuits and devices; network-on-chip; memory; quantum computing and NoC; sensors and interfaces.
Publisher: Springer
ISBN: 9811359504
Category : Computers
Languages : en
Pages : 728
Book Description
This book constitutes the refereed proceedings of the 22st International Symposium on VLSI Design and Test, VDAT 2018, held in Madurai, India, in June 2018. The 39 full papers and 11 short papers presented together with 8 poster papers were carefully reviewed and selected from 231 submissions. The papers are organized in topical sections named: digital design; analog and mixed signal design; hardware security; micro bio-fluidics; VLSI testing; analog circuits and devices; network-on-chip; memory; quantum computing and NoC; sensors and interfaces.
Proceedings of Fourth International Conference on Communication, Computing and Electronics Systems
Author: V. Bindhu
Publisher: Springer Nature
ISBN: 9811977534
Category : Technology & Engineering
Languages : en
Pages : 1048
Book Description
This book includes high-quality research papers presented at the Fourth International Conference on Communication, Computing and Electronics Systems (ICCCES 2022), held at the PPG Institute of Technology, Coimbatore, India, on September 15–16, 2022. The book focuses mainly on the research trends in cloud computing, mobile computing, artificial intelligence and advanced electronics systems. The topics covered are automation, VLSI, embedded systems, optical communication, RF communication, microwave engineering, artificial intelligence, deep learning, pattern recognition, communication networks, Internet of things, cyber-physical systems and healthcare informatics.
Publisher: Springer Nature
ISBN: 9811977534
Category : Technology & Engineering
Languages : en
Pages : 1048
Book Description
This book includes high-quality research papers presented at the Fourth International Conference on Communication, Computing and Electronics Systems (ICCCES 2022), held at the PPG Institute of Technology, Coimbatore, India, on September 15–16, 2022. The book focuses mainly on the research trends in cloud computing, mobile computing, artificial intelligence and advanced electronics systems. The topics covered are automation, VLSI, embedded systems, optical communication, RF communication, microwave engineering, artificial intelligence, deep learning, pattern recognition, communication networks, Internet of things, cyber-physical systems and healthcare informatics.
High-Resolution and High-Speed Integrated CMOS AD Converters for Low-Power Applications
Author: Weitao Li
Publisher: Springer
ISBN: 3319620126
Category : Technology & Engineering
Languages : en
Pages : 181
Book Description
This book is a step-by-step tutorial on how to design a low-power, high-resolution (not less than 12 bit), and high-speed (not less than 200 MSps) integrated CMOS analog-to-digital (AD) converter, to respond to the challenge from the rapid growth of IoT. The discussion includes design techniques on both the system level and the circuit block level. In the architecture level, the power-efficient pipelined AD converter, the hybrid AD converter and the time-interleaved AD converter are described. In the circuit block level, the reference voltage buffer, the opamp, the comparator, and the calibration are presented. Readers designing low-power and high-performance AD converters won’t want to miss this invaluable reference. Provides an in-depth introduction to the newest design techniques for the power-efficient, high-resolution (not less than 12 bit), and high-speed (not less than 200 MSps) AD converter; Presents three types of power-efficient architectures of the high-resolution and high-speed AD converter; Discusses the relevant circuit blocks (i.e., the reference voltage buffer, the opamp, and the comparator) in two aspects, relaxing the requirements and improving the performance.
Publisher: Springer
ISBN: 3319620126
Category : Technology & Engineering
Languages : en
Pages : 181
Book Description
This book is a step-by-step tutorial on how to design a low-power, high-resolution (not less than 12 bit), and high-speed (not less than 200 MSps) integrated CMOS analog-to-digital (AD) converter, to respond to the challenge from the rapid growth of IoT. The discussion includes design techniques on both the system level and the circuit block level. In the architecture level, the power-efficient pipelined AD converter, the hybrid AD converter and the time-interleaved AD converter are described. In the circuit block level, the reference voltage buffer, the opamp, the comparator, and the calibration are presented. Readers designing low-power and high-performance AD converters won’t want to miss this invaluable reference. Provides an in-depth introduction to the newest design techniques for the power-efficient, high-resolution (not less than 12 bit), and high-speed (not less than 200 MSps) AD converter; Presents three types of power-efficient architectures of the high-resolution and high-speed AD converter; Discusses the relevant circuit blocks (i.e., the reference voltage buffer, the opamp, and the comparator) in two aspects, relaxing the requirements and improving the performance.
Nano Devices and Sensors
Author: Juin J. Liou
Publisher: Walter de Gruyter GmbH & Co KG
ISBN: 1501501534
Category : Technology & Engineering
Languages : en
Pages : 228
Book Description
The chapters in this edited book are written by some authors who have presented very high quality papers at the 2015 International Symposium of Next-Generation Electronics (ISNE 2015) held in Taipei, Taiwan. The ISNE 2015 was intended to provide a common forum for researchers, scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, developments, and applications in the general areas of electron devices, integrated circuits, and microelectronic systems and technologies. The scope of the conference includes the following topics: A. Green Electronics B. Microelectronic Circuits and Systems C. Integrated Circuits and Packaging Technologies D. Computer and Communication Engineering E. Electron Devices F. Optoelectronic and Semiconductor Technologies The technical program consisted of 4 plenary talks, 23 invited talks, and more than 250 contributed oral and poster presentations. Plenary speakers were recognized experts in their fields, and their talks focused on leading-edge technologies including: "The Future Lithographic Technology for Semiconductor Fabrication" by Dr. Alek C. Chen, Asia ASML, Taiwan. "Detection of Single Traps and Characterization of Individual Traps: Beginning of Atomistic Reliability Physics" by Prof. Toshiaki Tsuchiya, Shimane University, Japan. "The Art and Science of Packaging High-Coupling Photonics Devices and Modules", by Prof. Wood-Hi Cheng, National Chung-Hsing University, Taiwan. "Prospect and Outlook of Electrostatic Discharge (ESD) Protection in Emerging Technologies", by Prof. Juin J. Liou, University of Central Florida, USA. After a rigorous review process, the ISNE 2015 technical program committee has selected 10 outstanding presentations and invited the authors to prepare extended chapters for inclusion in this edited book. Of the 10 chapters, five are focused on the subject of electronic devices, and the other covers the circuit designs for various applications. The authors are working at the academia in Austria, United States, Korea, and Taiwan. The guest editors would like to take this opportunity to express our sincere gratitude to all the members of the ISNE 2015 technical program committees for reviewing the papers and selecting the manuscripts for the edited book. We also thank all the authors for their valuable and excellent contributions to the book.
Publisher: Walter de Gruyter GmbH & Co KG
ISBN: 1501501534
Category : Technology & Engineering
Languages : en
Pages : 228
Book Description
The chapters in this edited book are written by some authors who have presented very high quality papers at the 2015 International Symposium of Next-Generation Electronics (ISNE 2015) held in Taipei, Taiwan. The ISNE 2015 was intended to provide a common forum for researchers, scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, developments, and applications in the general areas of electron devices, integrated circuits, and microelectronic systems and technologies. The scope of the conference includes the following topics: A. Green Electronics B. Microelectronic Circuits and Systems C. Integrated Circuits and Packaging Technologies D. Computer and Communication Engineering E. Electron Devices F. Optoelectronic and Semiconductor Technologies The technical program consisted of 4 plenary talks, 23 invited talks, and more than 250 contributed oral and poster presentations. Plenary speakers were recognized experts in their fields, and their talks focused on leading-edge technologies including: "The Future Lithographic Technology for Semiconductor Fabrication" by Dr. Alek C. Chen, Asia ASML, Taiwan. "Detection of Single Traps and Characterization of Individual Traps: Beginning of Atomistic Reliability Physics" by Prof. Toshiaki Tsuchiya, Shimane University, Japan. "The Art and Science of Packaging High-Coupling Photonics Devices and Modules", by Prof. Wood-Hi Cheng, National Chung-Hsing University, Taiwan. "Prospect and Outlook of Electrostatic Discharge (ESD) Protection in Emerging Technologies", by Prof. Juin J. Liou, University of Central Florida, USA. After a rigorous review process, the ISNE 2015 technical program committee has selected 10 outstanding presentations and invited the authors to prepare extended chapters for inclusion in this edited book. Of the 10 chapters, five are focused on the subject of electronic devices, and the other covers the circuit designs for various applications. The authors are working at the academia in Austria, United States, Korea, and Taiwan. The guest editors would like to take this opportunity to express our sincere gratitude to all the members of the ISNE 2015 technical program committees for reviewing the papers and selecting the manuscripts for the edited book. We also thank all the authors for their valuable and excellent contributions to the book.
Handbook for III-V High Electron Mobility Transistor Technologies
Author: D. Nirmal
Publisher: CRC Press
ISBN: 0429862539
Category : Science
Languages : en
Pages : 430
Book Description
This book focusses on III-V high electron mobility transistors (HEMTs) including basic physics, material used, fabrications details, modeling, simulation, and other important aspects. It initiates by describing principle of operation, material systems and material technologies followed by description of the structure, I-V characteristics, modeling of DC and RF parameters of AlGaN/GaN HEMTs. The book also provides information about source/drain engineering, gate engineering and channel engineering techniques used to improve the DC-RF and breakdown performance of HEMTs. Finally, the book also highlights the importance of metal oxide semiconductor high electron mobility transistors (MOS-HEMT). Key Features Combines III-As/P/N HEMTs with reliability and current status in single volume Includes AC/DC modelling and (sub)millimeter wave devices with reliability analysis Covers all theoretical and experimental aspects of HEMTs Discusses AlGaN/GaN transistors Presents DC, RF and breakdown characteristics of HEMTs on various material systems using graphs and plots
Publisher: CRC Press
ISBN: 0429862539
Category : Science
Languages : en
Pages : 430
Book Description
This book focusses on III-V high electron mobility transistors (HEMTs) including basic physics, material used, fabrications details, modeling, simulation, and other important aspects. It initiates by describing principle of operation, material systems and material technologies followed by description of the structure, I-V characteristics, modeling of DC and RF parameters of AlGaN/GaN HEMTs. The book also provides information about source/drain engineering, gate engineering and channel engineering techniques used to improve the DC-RF and breakdown performance of HEMTs. Finally, the book also highlights the importance of metal oxide semiconductor high electron mobility transistors (MOS-HEMT). Key Features Combines III-As/P/N HEMTs with reliability and current status in single volume Includes AC/DC modelling and (sub)millimeter wave devices with reliability analysis Covers all theoretical and experimental aspects of HEMTs Discusses AlGaN/GaN transistors Presents DC, RF and breakdown characteristics of HEMTs on various material systems using graphs and plots
Approximate Circuits
Author: Sherief Reda
Publisher: Springer
ISBN: 3319993224
Category : Technology & Engineering
Languages : en
Pages : 495
Book Description
This book provides readers with a comprehensive, state-of-the-art overview of approximate computing, enabling the design trade-off of accuracy for achieving better power/performance efficiencies, through the simplification of underlying computing resources. The authors describe in detail various efforts to generate approximate hardware systems, while still providing an overview of support techniques at other computing layers. The book is organized by techniques for various hardware components, from basic building blocks to general circuits and systems.
Publisher: Springer
ISBN: 3319993224
Category : Technology & Engineering
Languages : en
Pages : 495
Book Description
This book provides readers with a comprehensive, state-of-the-art overview of approximate computing, enabling the design trade-off of accuracy for achieving better power/performance efficiencies, through the simplification of underlying computing resources. The authors describe in detail various efforts to generate approximate hardware systems, while still providing an overview of support techniques at other computing layers. The book is organized by techniques for various hardware components, from basic building blocks to general circuits and systems.