Author: IEEE StaffPublisher:
ISBN: 9781424455966
Category :
Languages : en
Pages :
Book Description
2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
Author: IEEE StaffPublisher:
ISBN: 9781424455966
Category :
Languages : en
Pages :
Book Description
2010 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010)
Author: ISTFA 2011
Author: Publisher: ASM International
ISBN: 1615038507
Category : Technology & Engineering
Languages : en
Pages : 479
Book Description
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
Author: Publisher: ASM International
ISBN: 1627080996
Category :
Languages : en
Pages :
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Physical and Failure Analysis of Integrated Circuits
Author: IEEE Singapore SectionProceedings of the ... International Symposium on the Physical & Failure Analysis of Integrated Circuits
Author: ISTFA 2012
Author: ASM InternationalPublisher: ASM International
ISBN: 1615039953
Category : Technology & Engineering
Languages : en
Pages : 643
Book Description
ISTFA 2013
Author: A. S. M. InternationalPublisher: ASM International
ISBN: 1627080228
Category : Technology & Engineering
Languages : en
Pages : 634
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
Author: 
Author: