Annual IEEE Semiconductor Thermal Measurement and Management Symposium PDF Download

Author:
Publisher:
ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 392

View

Book Description

Author: IEEE Components, Packaging and Manufacturing Technology Society Staff
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 189

View

Book Description

Author:
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 272

View

Book Description

Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1796

View

Book Description

Author: G.G. Harman
Publisher: Springer Science & Business Media
ISBN: 9401151350
Category : Technology & Engineering
Languages : en
Pages : 295

View

Book Description
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.

Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 672

View

Book Description

Author: Marta Rencz
Publisher: Springer Nature
ISBN: 3030861740
Category : Technology & Engineering
Languages : en
Pages : 389

View

Book Description
This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.

Author: Lian Zhang
Publisher: Springer Science & Business Media
ISBN: 3662098997
Category : Technology & Engineering
Languages : en
Pages : 148

View

Book Description
Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase-flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 nm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes.

Author: Maciej Jaroszewski
Publisher: John Wiley & Sons
ISBN: 1119128633
Category : Technology & Engineering
Languages : en
Pages : 638

View

Book Description
A comprehensive review of the field of materials that shield people and sensitive electronic devices from electromagnetic fields Advanced Materials for Electromagnetic Shielding offers a thorough review of the most recent advances in the processing and characterization of the electromagnetic shielding materials. In this groundbreaking book, the authors—noted experts in the field—discuss the fundamentals of shielding theory as well as the practice of electromagnetic field measuring techniques and systems. They also explore applications of shielding materials used as absorbers of electromagnetic radiation, or as magnetic shields and explore coverage of new advanced materials for EMI shielding in aerospace applications. In addition, the text contains methods of preparation and applicability of metal foams. This comprehensive text examines the influence of technology on the micro-and macrostructure of polymers enabling their use in screening technology, technologies of shielding materials based on textiles, and analyses of its effectiveness in screening. The book also details the method of producing nanowires and their applications in EM shielding. This important resource: Explores the burgeoning market of electromagnetic shielding materials as we create, depend upon, and are exposed to more electronic devices than ever Addresses the most comprehensive issues relating to electromagnetic fields Contains information on the manufacturing, characterization methods, and properties of materials used to protect against them Discusses the important characterization techniques compared with one another, thus allowing scientists to select the best approach to a problem Written for materials scientists, electrical and electronics engineers, physicists, and industrial researchers, Advanced Materials for Electromagnetic Shielding explores all aspects in the area of electromagnetic shielding materials and examines the current state-of-the-art and new challenges in this rapidly growing area.

Author: Sadik Kakaç
Publisher: CRC Press
ISBN: 1439849919
Category : Science
Languages : en
Pages : 624

View

Book Description
Heat exchangers are essential in a wide range of engineering applications, including power plants, automobiles, airplanes, process and chemical industries, and heating, air conditioning and refrigeration systems. Revised and updated with new problem sets and examples, Heat Exchangers: Selection, Rating, and Thermal Design, Third Edition presents a