Wireless Interface Technologies for 3D IC and Module Integration PDF Download

Author: Tadahiro Kuroda
Publisher: Cambridge University Press
ISBN: 110889822X
Category : Technology & Engineering
Languages : en
Pages : 338

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Book Description
Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

Author: Peter J. Pupalaikis
Publisher: Cambridge University Press
ISBN: 1108808344
Category : Technology & Engineering
Languages : en
Pages : 667

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Book Description
Master the usage of s-parameters in signal integrity applications and gain full understanding of your simulation and measurement environment with this rigorous and practical guide. Solve specific signal integrity problems including calculation of the s-parameters of a network, linear simulation of circuits, de-embedding, and virtual probing, all with expert guidance. Learn about the interconnectedness of s-parameters, frequency responses, filters, and waveforms. This invaluable resource for signal integrity engineers is supplemented with the open-source software SignalIntegrity, a Python package for scripting solutions to signal integrity problems.

Author: John H. Lau
Publisher: McGraw Hill Professional
ISBN: 007184807X
Category : Technology & Engineering
Languages : en
Pages : 481

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Book Description
A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.3D IC Integration and Packaging covers:• 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP

Author: Neeraj Kumar Singh
Publisher: Apress
ISBN: 1484235347
Category : Computers
Languages : en
Pages : 268

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Book Description
Explore a complex mechanical system where electronics and mechanical engineers work together as a cross-functional team. Using a working example, this book is a practical “how to” guide to designing a drone system. As system design becomes more and more complicated, systematic, and organized, there is an increasingly large gap in how system design happens in the industry versus what is taught in academia. While the system design basics and fundamentals mostly remain the same, the process, flow, considerations, and tools applied in industry are far different than that in academia. Designing Drone Systems takes you through the entire flow from system conception to design to production, bridging the knowledge gap between academia and the industry as you build your own drone systems. What You’ll LearnGain a high level understanding of drone systems Design a drone systems and elaborating the various aspects and considerations of design Review the principles of the industrial system design process/flow, and the guidelines for drone systems Look at the challenges, limitations, best practices, and patterns of system design Who This Book Is For Primarily for beginning or aspiring system design experts, recent graduates, and system design engineers. Teachers, trainers, and system design mentors can also benefit from this content.

Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071593322
Category : Technology & Engineering
Languages : en
Pages : 807

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Book Description
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

Author: John H. Lau
Publisher: Springer Nature
ISBN: 9811613761
Category : Technology & Engineering
Languages : en
Pages : 513

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Book Description
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 1119556635
Category : Technology & Engineering
Languages : en
Pages : 416

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Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

Author: Hubert Kaeslin
Publisher: Cambridge University Press
ISBN: 0521882672
Category : Technology & Engineering
Languages : en
Pages : 878

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Book Description
This practical, tool-independent guide to designing digital circuits takes a unique, top-down approach, reflecting the nature of the design process in industry. Starting with architecture design, the book comprehensively explains the why and how of digital circuit design, using the physics designers need to know, and no more.

Author: Steve A. Rackley
Publisher: Elsevier
ISBN: 0080471404
Category : Technology & Engineering
Languages : en
Pages : 425

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Book Description
As the demand for higher bandwidth has lead to the development of increasingly complex wireless technologies, an understanding of both wireless networking technologies and radio frequency (RF) principles is essential for implementing high performance and cost effective wireless networks.Wireless Networking Technology clearly explains the latest wireless technologies, covering all scales of wireless networking from personal (PAN) through local area (LAN) to metropolitan (MAN). Building on a comprehensive review of the underlying technologies, this practical guide contains 'how to' implementation information, including a case study that looks at the specific requirements for a voice over wireless LAN application. This invaluable resource will give engineers and managers all the necessary knowledge to design, implement and operate high performance wireless networks.· Explore in detail wireless networking technologies and understand the concepts behind RF propagation.· Gain the knowledge and skills required to install, use and troubleshoot wireless networks.· Learn how to address the problems involved in implementing a wireless network, including the impact of signal propagation on operating range, equipment inter-operability problems and many more.· Maximise the efficiency and security of your wireless network.

Author: Mikhail Baklanov
Publisher: John Wiley & Sons
ISBN: 1119966868
Category : Technology & Engineering
Languages : en
Pages : 616

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Book Description
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.